公开(公告)号：US12068181B2

公开(公告)日：2024-08-20

申请号：US18479872

申请日：2023-10-03

Applicant: AGC Inc.

Inventor： Yuha Kobayashi ,  Yuichi Yoshida ,  Keisuke Hanashima

IPC: B32B3/00 ,  C03C15/02 ,  H01L21/304 ,  H01L21/66 ,  H01L21/67 ,  H01L23/15

CPC classification number: H01L21/67288 ,  C03C15/02 ,  H01L21/304 ,  H01L21/67253 ,  H01L22/12 ,  H01L23/15

Abstract: To suppress lowering of dimensional accuracy. A manufacturing method for a glass substrate is a manufacturing method for the glass substrate that supports a semiconductor device, the manufacturing method including: generating a glass base plate; measuring a thickness, a thickness deviation, and a warpage amount of the glass base plate; screening the glass base plate based on the thickness of the glass base plate; generating a plurality of glass blanks by cutting the screened glass base plate; setting a first polishing condition for the glass blank based on the thickness, the thickness deviation, and the warpage amount of the glass base plate; generating a glass plate by polishing a surface of the glass blank based on the first polishing condition; measuring a thickness, a thickness deviation, and a warpage amount of the glass plate; screening the glass plate based on the thickness of the glass plate; setting a second polishing condition for the glass plate based on the thickness, the thickness deviation, and the warpage amount of the glass plate; and polishing a surface of the screened glass plate based on the second polishing condition to generate a rectangular glass substrate in which a length of a side is equal to or larger than 300 mm and a thickness is equal to or larger than 0.5 mm.

公开(公告)号：US20210366760A1

公开(公告)日：2021-11-25

申请号：US17398107

申请日：2021-08-10

Applicant: AGC Inc.

Inventor： Yu Hanawa ,  Shuhei Nomura ,  Kazutaka Ono ,  Nobuhiko Takeshita ,  Keisuke Hanashima

IPC: H01L21/687 ,  C03B33/02 ,  B65D85/48 ,  H01L21/67 ,  G05B1/00 ,  H01L23/544 ,  C03C27/10 ,  B32B17/10 ,  C03B33/023 ,  H01L21/56

Abstract: A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.

公开(公告)号：US11133215B2

公开(公告)日：2021-09-28

申请号：US15877509

申请日：2018-01-23

Applicant: AGC Inc.

Inventor： Yu Hanawa ,  Shuhei Nomura ,  Kazutaka Ono ,  Nobuhiko Takeshita ,  Keisuke Hanashima

IPC: H01L21/56 ,  H01L21/687 ,  C03B33/023 ,  H01L23/15 ,  H01L23/00 ,  B32B17/00 ,  B65D85/48 ,  C03B33/02 ,  H01L21/67 ,  G05B1/00 ,  H01L23/544 ,  C03C27/10 ,  B32B17/10

Abstract: A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.

公开(公告)号：US11099325B2

公开(公告)日：2021-08-24

申请号：US16787158

申请日：2020-02-11

Applicant: AGC Inc.

Inventor： Shotaro Takenobu ,  Toshihisa Okada ,  Satoko Noma ,  Kenta Kobayashi ,  Keisuke Hanashima ,  Seiki Ohara

IPC: G02B6/122 ,  G02B6/125 ,  G02B6/245 ,  G02B6/26 ,  G02B6/30 ,  G02B6/38 ,  G02B6/42

Abstract: The present invention provides a polymer optical waveguide containing: a core; and a cladding having a refractive index lower than that of the core, provided around the core, in which the polymer optical waveguide has a core-coupling section where at least a part of the cladding is not present along a light propagation direction of the polymer optical waveguide and an application type removal film A provided so as to come into contact with the core of the core-coupling section.

公开(公告)号：US11802080B2

公开(公告)日：2023-10-31

申请号：US17813372

申请日：2022-07-19

Applicant: AGC Inc.

Inventor： Yuha Kobayashi ,  Shigeto Kumano ,  Kaede Katsuno ,  Keisuke Hanashima ,  Kohei Horiuchi

IPC: B32B3/00 ,  C03C23/00

CPC classification number: C03C23/0025

Abstract: A glass substrate 10 has a mark provided on a surface 10A of the glass substrate 10, the mark including plural dots 104, a depth H of each of the dots 104 is 0.5 μm or larger and 7.0 μm or smaller, and an inclination angle of a side surface 104B of each of the dots 104 is 5° or larger and 56° or smaller.

公开(公告)号：US11715673B2

公开(公告)日：2023-08-01

申请号：US17367762

申请日：2021-07-06

Applicant: AGC Inc.

Inventor： Yu Hanawa ,  Shigeki Sawamura ,  Shuhei Nomura ,  Kazutaka Ono ,  Nobuhiko Takeshita ,  Keisuke Hanashima

IPC: B32B17/06 ,  H01L23/15 ,  C03C27/04 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  B32B1/00 ,  B32B9/00 ,  C03C17/22 ,  H01L23/13

CPC classification number: H01L23/15 ,  B32B1/00 ,  B32B9/005 ,  B32B17/06 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C17/22 ,  C03C27/04 ,  H01L23/13 ,  B32B2307/30 ,  B32B2457/14

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.

公开(公告)号：US10731233B2

公开(公告)日：2020-08-04

申请号：US15951424

申请日：2018-04-12

Applicant: AGC Inc.

Inventor： Minoru Yamada ,  Atsushi Yamada ,  Koichi Shibuya ,  Shinya Kikugawa ,  Keisuke Hanashima

IPC: C22C13/00 ,  B23K35/26 ,  C03C27/08

Abstract: A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.

公开(公告)号：US11114356B2

公开(公告)日：2021-09-07

申请号：US16555702

申请日：2019-08-29

Applicant: AGC Inc.

Inventor： Yu Hanawa ,  Shigeki Sawamura ,  Shuhei Nomura ,  Kazutaka Ono ,  Nobuhiko Takeshita ,  Keisuke Hanashima

IPC: B32B15/04 ,  H01L23/15 ,  C03C27/04 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C17/22 ,  H01L23/13

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.

公开(公告)号：US10515864B2

公开(公告)日：2019-12-24

申请号：US15822859

申请日：2017-11-27

Applicant: AGC Inc.

Inventor： Yu Hanawa ,  Shigeki Sawamura ,  Shuhei Nomura ,  Kazutaka Ono ,  Nobuhiko Takeshita ,  Keisuke Hanashima

IPC: B32B15/04 ,  B32B17/06 ,  H01L23/15 ,  C03C17/22 ,  H01L23/13

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.

公开(公告)号：US20190385920A1

公开(公告)日：2019-12-19

申请号：US16555702

申请日：2019-08-29

Applicant: AGC, Inc.

Inventor： Yu Hanawa ,  Shigeki Sawamura ,  Shuhei Nomura ,  Kazutaka Ono ,  Nobuhiko Takeshita ,  Keisuke Hanashima

IPC: H01L23/15 ,  C03C17/22 ,  H01L23/13

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.