摘要:
There is provided a vacuum film deposition apparatus which forms a film on a substrate by a vacuum film deposition technique, include: substrate holding means for holding the substrate; a deposition preventing member for preventing film deposition at undesired positions within the apparatus; and contacting means for bringing the substrate or the substrate holding means and the deposition preventing member into contact with each other.
摘要:
An object of the present invention is to provide a method of forming a thin film of excellent quality by generating discharge plasma using gaseous raw material including a carbon source under an atmosphere of a relatively high pressure of 100 Torr or higher. A substrate 6 is mounted on at least one of opposing electrodes 4 and 5. A pulse voltage is applied on the opposing electrodes 4 and 5 under a pressure of 100 to 1600 Torr in an atmosphere containing gaseous raw material “A” including a carbon source to generate discharge plasma. A thin film 7 is thus formed on the substrate 6. The pulse voltage has a pulse duration of 10 to 1000 nsec.
摘要:
A substrate 6 is provided over at least one of opposing electrodes 4 and 5. A pulse voltage is applied on the opposing electrodes 4 and 5 in an atmosphere containing gaseous raw material including a carbon source to generate discharge plasma so that a thin film 7 is formed on the substrate 6. The applied pulse voltage includes positive pulse and negative pulses. The positive pulse has a pulse half value width of 1000 nsec or shorter and said negative pulse has a pulse half value width of 1000 nsec or shorter.
摘要:
In fabricating a semiconducting nitride film by a MOCVD method, a susceptor tray is employed. The susceptor tray is constructed of a base plate and an outer member detachable from the base plate. A substrate for the film to be formed upon is set in a recessed portion formed by disposing the outer member on the base plate.
摘要:
A method for fabricating a Group III nitride film is provided, including the steps of preparing a substrate, forming an underfilm and then forming the Group III nitride film on the underfilm. The underfilm is a Group III nitride comprising at least one Group III element and includes at least 50 atomic percent of elemental Al with respect to all of the Group III elements of the Group III nitride of the underfilm. The surface of the underfilm is contoured (concave-convex) and includes flat regions, and less than 50% of the underfilm surface is occupied by the flat regions.
摘要:
A sapphire single crystal wafer 11 having a diameter not less than two inches and having an off-angled surface which is obtained by rotating an R (1-102) surface about a [11-20] axis by a given off-angle is introduced in a CVD apparatus, and a double-layer structure of first and second aluminum single crystal layers 12 and 13 is deposited on the off-angled surface of the sapphire single crystal wafer by MOCVD. The thus deposited aluminum single crystal layer 13 has (1-210) surface. The first aluminum nitride single crystal layer 12 serves as a buffer layer and has a thickness of 5-50 nm, and the second aluminum nitride single crystal layer 13 has a thickness not less than 1 &mgr;m. The off-angle is preferably set to a value not less than ±1°, much preferably a value ±2°, more preferably a value not less than −3°, and particularly preferable to a value within a range from −2°-+10°. The thus obtained aluminum nitride single crystal layer 12, 13 has no clack formed therein, has an excellent piezo-electric property, and has a high propagating velocity for surface acoustic wave.
摘要:
Strip-shaped ditches are formed on a sapphire substrate as a base material. Then, the sapphire substrate is set into a CVD chamber, and an AlxGayInzN (x+y+z=1,x>0,y,z≧0)film is epitaxially grown on the sapphire substrate so as to embed the ditches by a selective lateral epitaxial growth method. As a result, the AlxGayInzN film has low dislocation density areas on at least one of the concave portions and the convex portions of the strip-shaped ditches.
摘要翻译:在蓝宝石基板上形成条形沟槽作为基材。 然后,将蓝宝石衬底置于CVD室中,并将AlxGayInzN(x + y + z = 1,x> 0,y,z> = 0)膜外延生长在蓝宝石衬底上,以便将沟渠嵌入 选择性侧向外延生长法。 结果,AlxGayInzN膜在带状沟槽的至少一个凹部和凸部上具有低位错密度区域。
摘要:
A sapphire single crystal wafer 11 having a diameter not less than two inches and having an off-angled surface which is obtained by rotating an R (1-102) surface about an axis in a negative direction by a given off-angle not less than 2° is introduced in a CVD apparatus. While the sapphire substrate is kept at a temperature of about 950° C., a buffer layer made of gallium nitride or aluminum-gallium nitride is first deposited with an average thickness of 0.1-0.2 &mgr;m, and then an aluminum nitride single crystal layer is deposited with an average thickness not less than 2 &mgr;m. The thus obtained aluminum nitride single crystal layer does not have a significant amount of cracks, has an excellent piezoelectric property, and has a high propagating velocity.
摘要:
A sapphire single crystal wafer 11 having a diameter not less than two inches and having an off-angled surface which is obtained by rotating an R (1-102) surface about a �11-20! axis by a given off-angle is introduced in a CVD apparatus, and a double-layer structure of first and second aluminum single crystal layers 12 and 13 is deposited on the off-angled surface of the sapphire single crystal wafer by MOCVD. The thus deposited aluminum single crystal layer 13 has (1-210) surface. The first aluminum nitride single crystal layer 12 serves as a buffer layer and has a thickness of 5-50 nm, and the second aluminum nitride single crystal layer 13 has a thickness not less than 1 .mu.m. The off-angle is preferably set to a value not less than .+-.1.degree., much preferably a value .+-.2.degree., more preferably a value not less than -3.degree., and particularly preferable to a value within a range from -2.degree.-+10.degree.. The thus obtained aluminum nitride single crystal layer 12, 13 has no clack formed therein, has an excellent piezo-electric property, and has a high propagating velocity for surface acoustic wave.