公开(公告)号：US07977243B2

公开(公告)日：2011-07-12

申请号：US12693589

申请日：2010-01-26

申请人： Hitoshi Sakamoto ,  Naoki Yahata ,  Ryuichi Matsuda ,  Yoshiyuki Ooba ,  Toshihiko Nishimori

发明人： Hitoshi Sakamoto ,  Naoki Yahata ,  Ryuichi Matsuda ,  Yoshiyuki Ooba ,  Toshihiko Nishimori

IPC分类号： H01L21/311

CPC分类号： H01L21/7685 ,  C23C8/36 ,  C23C16/14 ,  C23C16/34 ,  C23C16/40 ,  C23C16/4488 ,  C23C16/452 ,  C23C16/507 ,  C23C16/56 ,  C23F4/00 ,  H01L21/28556 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/76862 ,  H01L21/76876 ,  H01L21/76888 ,  H01L2221/1078

摘要： A Cl2 gas plasma is generated at a site within a chamber between a substrate and a metal member. The metal member is etched with the Cl2 gas plasma to form a precursor. A nitrogen gas is excited in a manner isolated from the chamber accommodating the substrate. A metal nitride is formed upon reaction between excited nitrogen and the precursor, and formed as a film on the substrate. After film formation of the metal nitride, a metal component of the precursor is formed as a film on the metal nitride on the substrate. In this manner, a barrier metal film with excellent burial properties and a very small thickness is produced at a high speed, with diffusion of metal being suppressed and adhesion to the metal being improved.

摘要翻译： 在衬底和金属构件之间的室内的位置处产生Cl 2气体等离子体。 用Cl 2气体等离子体蚀刻金属构件以形成前体。 以与容纳基板的室隔离的方式激发氮气。 在被激发的氮和前体之间反应时形成金属氮化物，并在基板上形成膜。 在金属氮化物成膜后，在基板上的金属氮化物上形成前体的金属成分作为膜。 以这种方式，以高速度产生具有优异的埋藏性能和非常小的厚度的阻挡金属膜，其中金属的扩散被抑制并且对金属的粘附性得到改善。

公开(公告)号：US20090133623A1

公开(公告)日：2009-05-28

申请号：US12356312

申请日：2009-01-20

申请人： HITOSHI SAKAMOTO ,  Naoki Yahata ,  Yoshiyuki Ooba

发明人： HITOSHI SAKAMOTO ,  Naoki Yahata ,  Yoshiyuki Ooba

IPC分类号： B05C11/00

CPC分类号： C23C16/52 ,  C23C16/14 ,  C23C16/4488

摘要： A metal film production apparatus supplies a source gas containing a halogen such as a chlorine, to the interior of a chamber such that the source gas is intermittently supplied, to form a Cu component of a precursor into a film on a substrate, while suppressing a relative increase in etching particles. Thus, the source gas is supplied in the full presence of plasma particles contributing a film formation. Moreover, the source gas is supplied in a state in which a Cu film formed is not etched with the etching particles. Consequently, the Cu film is reliably increased with respect to the film formation time to increase the film formation speed. The temperature of the substrate is less than that of the etched member.Alternatively, a source gas is supplied to the interior of a chamber between a substrate and a copper plate member such that the source gas is gradually increased continuously from a flow rate of 0 to a predetermined flow rate to increase the particle size of the metal component, as copper.

摘要翻译： 金属膜制造装置向室内部供给含有卤素的源气体，使得源气体间歇地供给，在基板上形成膜前体的Cu成分，同时抑制 蚀刻颗粒的相对增加。 因此，在充分存在有助于成膜的等离子体颗粒的情况下供给源气体。 此外，源蚀刻气体以不用蚀刻颗粒蚀刻形成的Cu膜的状态供给。 因此，相对于成膜时间，Cu膜可靠地增加，以提高成膜速度。 基板的温度小于蚀刻部件的温度。 或者，将源气体供给到基板和铜板构件之间的室内部，使得源气体从0的流量连续地逐渐增加到预定流量，以增加金属部件的粒径 ，如铜。

公开(公告)号：US20070117363A1

公开(公告)日：2007-05-24

申请号：US11638522

申请日：2006-12-14

申请人： Hitoshi Sakamoto ,  Naoki Yahata ,  Ryuichi Matsuda ,  Yoshiyuki Ooba ,  Toshihiko Nishimori

发明人： Hitoshi Sakamoto ,  Naoki Yahata ,  Ryuichi Matsuda ,  Yoshiyuki Ooba ,  Toshihiko Nishimori

IPC分类号： H01L21/3205 ,  C23C16/00 ,  H01L21/4763

CPC分类号： H01L21/7685 ,  C23C8/36 ,  C23C16/14 ,  C23C16/34 ,  C23C16/40 ,  C23C16/4488 ,  C23C16/452 ,  C23C16/507 ,  C23C16/56 ,  C23F4/00 ,  H01L21/28556 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/76862 ,  H01L21/76876 ,  H01L21/76888 ,  H01L2221/1078

摘要： A Cl2 gas plasma is generated at a site within a chamber between a substrate and a metal member. The metal member is etched with the Cl2 gas plasma to form a precursor. A nitrogen gas is excited in a manner isolated from the chamber accommodating the substrate. A metal nitride is formed upon reaction between excited nitrogen and the precursor, and formed as a film on the substrate. After film formation of the metal nitride, a metal component of the precursor is formed as a film on the metal nitride on the substrate. In this manner, a barrier metal film with excellent burial properties and a very small thickness is produced at a high speed, with diffusion of metal being suppressed and adhesion to the metal being improved.

公开(公告)号：US20070087577A1

公开(公告)日：2007-04-19

申请号：US11638511

申请日：2006-12-14

申请人： Hitoshi Sakamoto ,  Naoki Yahata ,  Ryuichi Matsuda ,  Yoshiyuki Ooba ,  Toshihiko Nishimori

发明人： Hitoshi Sakamoto ,  Naoki Yahata ,  Ryuichi Matsuda ,  Yoshiyuki Ooba ,  Toshihiko Nishimori

IPC分类号： C23F1/00 ,  C23C16/00 ,  H01L21/31

CPC分类号： H01L21/7685 ,  C23C8/36 ,  C23C16/14 ,  C23C16/34 ,  C23C16/40 ,  C23C16/4488 ,  C23C16/452 ,  C23C16/507 ,  C23C16/56 ,  C23F4/00 ,  H01L21/28556 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/76862 ,  H01L21/76876 ,  H01L21/76888 ,  H01L2221/1078

摘要： A Cl2 gas plasma is generated at a site within a chamber between a substrate and a metal member. The metal member is etched with the Cl2 gas plasma to form a precursor. A nitrogen gas is excited in a manner isolated from the chamber accommodating the substrate. A metal nitride is formed upon reaction between excited nitrogen and the precursor, and formed as a film on the substrate. After film formation of the metal nitride, a metal component of the precursor is formed as a film on the metal nitride on the substrate. In this manner, a barrier metal film with excellent burial properties and a very small thickness is produced at a high speed, with diffusion of metal being suppressed and adhesion to the metal being improved.

摘要翻译： 在衬底和金属构件之间的室内的位置处产生Cl 2/2气体等离子体。 用Cl 2 H 2气体等离子体蚀刻金属构件以形成前体。 以与容纳基板的室隔离的方式激发氮气。 在被激发的氮和前体之间反应时形成金属氮化物，并在基板上形成膜。 在金属氮化物成膜后，在基板上的金属氮化物上形成前体的金属成分作为膜。 以这种方式，以高速度产生具有优异的埋藏性能和非常小的厚度的阻挡金属膜，其中金属的扩散被抑制并且对金属的粘附性得到改善。

公开(公告)号：US20050230830A1

公开(公告)日：2005-10-20

申请号：US11132223

申请日：2005-05-19

申请人： Hitoshi Sakamoto ,  Naoki Yahata ,  Toshihiko Nishimori ,  Yoshiyuki Ooba ,  Hiroshi Tonegawa ,  Ikumasa Koshiro ,  Yuzuru Ogura

发明人： Hitoshi Sakamoto ,  Naoki Yahata ,  Toshihiko Nishimori ,  Yoshiyuki Ooba ,  Hiroshi Tonegawa ,  Ikumasa Koshiro ,  Yuzuru Ogura

IPC分类号： C23C16/08 ,  C23C16/14 ,  C23C16/44 ,  C23C16/448 ,  H01J37/32 ,  H01L21/285 ,  H01L21/44 ,  H01L21/768

CPC分类号： H01J37/321 ,  C23C16/08 ,  C23C16/14 ,  C23C16/4488 ,  H01J37/32357 ,  H01J2237/3326 ,  H01L21/28556 ,  H01L21/76879

摘要： In a metal film production apparatus, a copper plate member is etched with a Cl2 gas plasma within a chamber to form a precursor comprising a Cu component and a Cl2 gas; and the temperatures of the copper plate member and a substrate and a difference between their temperatures are controlled as predetermined, to deposit the Cu component of the precursor on the substrate, thereby forming a film of Cu. In this apparatus, Cl* is formed in an excitation chamber of a passage communicating with the interior of the chamber to flow a Cl2 gas, and the Cl* is supplied into the chamber to withdraw a Cl2 gas from the precursor adsorbed onto the substrate, thereby promoting a Cu film formation reaction. The apparatus has a high film formation speed, can use an inexpensive starting material, and can minimize impurities remaining in the film.

公开(公告)号：US07923374B2

公开(公告)日：2011-04-12

申请号：US12471743

申请日：2009-05-26

申请人： Hitoshi Sakamoto ,  Naoki Yahata ,  Toshihiko Nishimori ,  Yoshiyuki Ooba ,  Hiroshi Tonegawa ,  Ikumasa Koshiro ,  Yuzuru Ogura

发明人： Hitoshi Sakamoto ,  Naoki Yahata ,  Toshihiko Nishimori ,  Yoshiyuki Ooba ,  Hiroshi Tonegawa ,  Ikumasa Koshiro ,  Yuzuru Ogura

IPC分类号： H01L21/302

CPC分类号： H01J37/321 ,  C23C16/08 ,  C23C16/14 ,  C23C16/4488 ,  H01J37/32357 ,  H01J2237/3326 ,  H01L21/28556 ,  H01L21/76879

摘要： In a metal film production apparatus, a copper plate member is etched with a Cl2 gas plasma within a chamber to form a precursor comprising a Cu component and a Cl2 gas; and the temperatures of the copper plate member and a substrate and a difference between their temperatures are controlled as predetermined, to deposit the Cu component of the precursor on the substrate, thereby forming a film of Cu. In this apparatus, Cl* is formed in an excitation chamber of a passage communicating with the interior of the chamber to flow a Cl2 gas, and the Cl* is supplied into the chamber to withdraw a Cl2 gas from the precursor adsorbed onto the substrate, thereby promoting a Cu film formation reaction. The apparatus has a high film formation speed, can use an inexpensive starting material, and can minimize impurities remaining in the film.

摘要翻译： 在金属膜制造装置中，在室内用Cl 2气体等离子体蚀刻铜板构件，形成包含Cu成分和Cl 2气体的前体; 并且将铜板构件和基板的温度和它们的温度之间的差异预先控制，以将前体的Cu组分沉积在基板上，从而形成Cu膜。 在该装置中，Cl *形成在与腔室内部连通的通道的激励室中以流过Cl 2气体，并且将Cl *供应到室中以从吸附到基板上的前体中抽出Cl 2气体， 从而促进Cu成膜反应。 该设备具有高的成膜速度，可以使用廉价的起始材料，并且可以最小化残留在膜中的杂质。

公开(公告)号：US07776751B2

公开(公告)日：2010-08-17

申请号：US11919484

申请日：2006-05-17

申请人： Yoshiyuki Ooba ,  Hitoshi Sakamoto

发明人： Yoshiyuki Ooba ,  Hitoshi Sakamoto

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： C23C16/4488 ,  C01B33/06 ,  C23C16/325 ,  C23C16/42 ,  H01L21/2807 ,  H01L21/28097 ,  H01L21/28518 ,  H01L31/032

摘要： A process for producing a silicon compound can minimize the number of steps and can form a desired compound in a low-temperature environment. The process comprises: allowing a radical of a halogen gas to act on a member 11 to be etched, which is disposed within a chamber 1 and is formed of a material containing an element capable of forming a compound with Si, while keeping the member 11 at a relatively high temperature, to form a gas of a precursor 24, which is a compound of the material and the halogen; holding a substrate 3 accommodated within the chamber 1 at a relatively low temperature, with the Si interface of the substrate 3 being exposed, to adsorb the precursor 24 onto the Si interface of the substrate 3; and then allowing the radical of the halogen gas to act on the precursor 24 adsorbed onto the Si interface to reduce the precursor 24, thereby producing a compound of the material and Si.

摘要翻译： 硅化合物的制造方法可以使步骤的数量最少化，并能在低温环境下形成所需化合物。 该方法包括：使卤素气体基团作用在要蚀刻的构件11上，该构件设置在室1内，并且由含有能够与Si形成化合物的元素的材料形成，同时保持构件11 在相对高的温度下形成作为该材料和卤素的化合物的前体24的气体; 在相对较低的温度下保持容纳在室1内的基板3，使基板3的Si界面露出，以将前体24吸附到基板3的Si界面上; 然后使卤素气体的基团作用于吸附在Si界面上的前体24上以还原前体24，从而产生该材料和Si的化合物。

公开(公告)号：US20100062181A1

公开(公告)日：2010-03-11

申请号：US12618130

申请日：2009-11-13

申请人： Hitoshi Sakamoto ,  Naoki Yahata ,  Yoshiyuki Ooba

发明人： Hitoshi Sakamoto ,  Naoki Yahata ,  Yoshiyuki Ooba

IPC分类号： C23C16/448 ,  C23C16/06

CPC分类号： C23C16/52 ,  C23C16/14 ,  C23C16/4488

摘要： A metal film production method supplies a source gas containing a halogen, such as a chlorine, to the interior of a chamber such that the source gas is intermittently supplied, to form a Cu component of a precursor into a film on a substrate, while suppressing a relative increase in etching particles. Thus, the source gas is supplied in the full presence of plasma particles contributing to film formation. Moreover, the source gas is supplied in a state in which a Cu film formed is not etched with the etching particles. Consequently, the Cu film is reliably increased with respect to the film formation time to increase the film formation speed. The temperature of the substrate is less than that of the etched member.Alternatively, a source gas is supplied to the interior of a chamber between a substrate and a copper plate member such that the source gas is gradually increased continuously from a flow rate of 0 to a predetermined flow rate to increase the particle size of the metal component, as copper gradually.

摘要翻译： 金属膜制造方法将含有卤素如氯的源气体向室内供给，从而间歇地供给源气体，在基板上形成膜前体的Cu成分，同时抑制 蚀刻颗粒的相对增加。 因此，源气体在有助于成膜的等离子体颗粒的完全存在下被供给。 此外，源蚀刻气体以不用蚀刻颗粒蚀刻形成的Cu膜的状态供给。 因此，相对于成膜时间，Cu膜可靠地增加，以提高成膜速度。 基板的温度小于蚀刻部件的温度。 或者，将源气体供给到基板和铜板构件之间的室内部，使得源气体从0的流量连续地逐渐增加到预定流量，以增加金属部件的粒径 ，随着铜逐渐。

公开(公告)号：US20090081869A1

公开(公告)日：2009-03-26

申请号：US11919484

申请日：2006-05-17

申请人： Yoshiyuki Ooba ,  Hitoshi Sakamoto

发明人： Yoshiyuki Ooba ,  Hitoshi Sakamoto

IPC分类号： H01L21/28

CPC分类号： C23C16/4488 ,  C01B33/06 ,  C23C16/325 ,  C23C16/42 ,  H01L21/2807 ,  H01L21/28097 ,  H01L21/28518 ,  H01L31/032

摘要： A process for producing a silicon compound can minimize the number of steps and can form a desired compound in a low-temperature environment. The process comprises: allowing a radical of a halogen gas to act on a member 11 to be etched, which is disposed within a chamber 1 and is formed of a material containing an element capable of forming a compound with Si, while keeping the member 11 at a relatively high temperature, to form a gas of a precursor 24, which is a compound of the material and the halogen; holding a substrate 3 accommodated within the chamber 1 at a relatively low temperature, with the Si interface of the substrate 3 being exposed, to adsorb the precursor 24 onto the Si interface of the substrate 3; and then allowing the radical of the halogen gas to act on the precursor 24 adsorbed onto the Si interface to reduce the precursor 24, thereby producing a compound of the material and Si.

摘要翻译： 硅化合物的制造方法可以使步骤的数量最少化，并能在低温环境下形成所需化合物。 该方法包括：使卤素气体基团作用在要蚀刻的构件11上，该构件设置在室1内，并且由含有能够与Si形成化合物的元素的材料形成，同时保持构件11 在相对高的温度下形成作为该材料和卤素的化合物的前体24的气体; 在相对较低的温度下保持容纳在室1内的基板3，使基板3的Si界面露出，以将前体24吸附到基板3的Si界面上; 然后使卤素气体的基团作用于吸附在Si界面上的前体24上以还原前体24，从而产生该材料和Si的化合物。

公开(公告)号：US20100047471A1

公开(公告)日：2010-02-25

申请号：US12606659

申请日：2009-10-27

申请人： Hitoshi Sakamoto ,  Naoki Yahata ,  Ryuichi Matsuda ,  Yoshiyuki Ooba ,  Toshihiko Nishimori

发明人： Hitoshi Sakamoto ,  Naoki Yahata ,  Ryuichi Matsuda ,  Yoshiyuki Ooba ,  Toshihiko Nishimori

IPC分类号： C23C16/448 ,  C23C16/34

CPC分类号： H01L21/7685 ,  C23C8/36 ,  C23C16/14 ,  C23C16/34 ,  C23C16/40 ,  C23C16/4488 ,  C23C16/452 ,  C23C16/507 ,  C23C16/56 ,  C23F4/00 ,  H01L21/28556 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/76862 ,  H01L21/76876 ,  H01L21/76888 ,  H01L2221/1078

摘要： A Cl2 gas plasma is generated at a site within a chamber between a substrate and a metal member. The metal member is etched with the Cl2 gas plasma to form a precursor. A nitrogen gas is excited in a manner isolated from the chamber accommodating the substrate. A metal nitride is formed upon reaction between excited nitrogen and the precursor, and formed as a film on the substrate. After film formation of the metal nitride, a metal component of the precursor is formed as a film on the metal nitride on the substrate. In this manner, a barrier metal film with excellent burial properties and a very small thickness is produced at a high speed, with diffusion of metal being suppressed and adhesion to the metal being improved.