Abstract:
A surface acoustic wave chip formed with an inter-digital transducer entirely over a piezoelectric substrate. In the surface acoustic wave chip, the inter-digital transducer is extended to a rim of the piezoelectric substrate, and a partition section is provided all the way to the rim of the piezoelectric substrate to partition an electrode pattern to derive two of the inter-digital transducers.
Abstract:
The present invention provides an apparatus for transferring a microplate having a plurality of wells arranged in a matrix of lengthwise and crosswise rows relative to stationary dispenser nozzles spaced at regular intervals in the crosswise direction for dispensing a liquid matter into the wells. The number of the nozzles being smaller than the number of the wells in each crosswise row of the microplate. In a preferred embodiment of the invention, the number of the nozzles corresponds to half the number of the wells in a crosswise row. The apparatus comprises, a support plate on which the microplate is mounted, a means for transferring the support plate forward and backward in the lengthwise direction, and a means for shifting the support plate in the crosswise direction between a first position in which each of the odd or even wells in crosswise rows of the microplate is aligned with correspondingly one of the nozzles in the lengthwise direction, respectively, and a second position in which each of the even or odd wells in crosswise rows of the microplate is aligned with correspondingly one of the nozzles in the lengthwise direction, respectively.
Abstract:
An improved water jacket structure for a cylinder head that assists in transferring heat from a lower wall of the cylinder head to coolant flowing through passageway in the head. The passageway is defined in the cylinder head by the lower wall and an upper wall. The lower wall provides a plurality of cylinder top walls that overlie corresponding ones of the cylinders in the engine block. The upper wall includes a series of ribs that extend from the upper wall toward the lower wall. The ribs include an inlet rib, and a set of interconnected ribs. The interconnected ribs are disposed between adjacent cylinder topwalls. The set of interconnected ribs have first ends that are connected to one another, second ends that are spaced from one another, and a lower edge that is spaced a predetermined distance from the lower wall.
Abstract:
The peeling solution for photo- or electron beam-sensitive resin according to the present invention consists of an aqueous solution comprising hydrogen peroxide and a compound represented by the general formula (I) ##STR1## wherein R.sub.1 is H or an alkyl group of 1-2 carbon atoms, R.sub.2 is H or an alkyl group of 1-3 carbon atoms, and R.sub.3 is H or an alkyl group of 1-3 carbon atoms.The process for peeling off a photo- or electron beam-sensitive resin according to the present invention comprises a step of treating a photo- or electron beam-sensitive resin-coated substrate with a peeling solution for photo- or electron beam-sensitive resin cnsisting of an aqueous solution comprising hydrogen peroxide and a compound represented by the above general formula (I).
Abstract:
The peeling solution for photo- or electron beam-sensitive resin according to the present invention consists of an aqueous solution consisting of hydrogen peroxide and a compound represented by the general formula (I) ##STR1## wherein R.sub.1 is H or an alkyl group of 1-2 carbon atoms, R.sub.2 is H or an alkyl group of 1-3 carbon atoms, and R.sub.3 is H or an alkyl group of 1-3 carbon atoms.
Abstract:
Monochromatic light emitted from a monochromator is split into two light beams. These light beams are detected by a photodetector and converted into corresponding electric signals after having been transmitted, respectively, through a sample to be analyzed and a reference placed in the respective beam paths. The signal corresponding to the light beam transmitted through the sample and the signal corresponding to the light beam transmitted through the reference are converted into digital signals which are subsequently stored in respective digital storages or memories. The signal corresponding to the light beam transmitted through the reference is compared with a value in a predetermined range. The resultant value is then converted into an analog signal for operating a sensitivity regulator thereby to adjust the sensitivity of the photodetector. Thus, the signal corresponding to the light beam transmitted through the reference (reference light signal) is so controlled as to lie in a predetermined range. From the digital signals stored in the digital memory, ratio between the sample light signal and the reference light signal is arithmetically calculated by a digital processor unit for determining the transmittance of the sample. Since the reference light signal is prevented from significant variation and the calculation of the signal ratio is effected on the basis of digital technique, the measurement accuracy is remarkably enhanced.
Abstract:
A wavelength reading apparatus for a monochromator comprises a monochromator utilizing a dispersion element for dispersing light in accordance with its wavelengths, a dispersion element driver unit for rotating the dispersion element to effect the tuning wavelength scanning operation of the monochromator and a wavelength counter for adding or subtracting a pulse, which is produced each time when the tuning wavelength of the monochromator changes by a predetermined wavelength increment, depending on whether the wavelength increases or decreases. The wavelength counter is set to a predetermined counting value, in response to a wavelength calibrating pulse produced when the tuning wavelength of the monochromator reaches a predetermined value, so that any counting value of the wavelength counter correctly represents the instant value of the tuning wavelength of the monochromator.
Abstract:
A surface acoustic wave chip formed with an inter-digital transducer entirely over a piezoelectric substrate. In the surface acoustic wave chip, the inter-digital transducer is extended to a rim of the piezoelectric substrate, and a partition section is provided all the way to the rim of the piezoelectric substrate to partition an electrode pattern to derive two of the inter-digital transducers.
Abstract:
A surface acoustic wave device includes a surface acoustic wave (SAW) chip and a cover that are bonded in a body by bonding a metal bonding portion of the SAW chip and a metal bonding portion of the cover and bonding extraction electrodes of the SAW chip and connection electrodes of the cover so as to hermetically seal IDT electrodes disposed on a main surface of a piezoelectric substrate of the SAW chip within a space defined between the SAW chip and the cover. The IDT electrodes and external electrodes on an upper surface of an insulating substrate of the cover are electrically connected to each other through conductive materials formed in through-holes.
Abstract:
A surface acoustic wave device includes a surface acoustic wave (SAW) chip and a cover that are bonded in a body by bonding a metal bonding portion of the SAW chip and a metal bonding portion of the cover and bonding extraction electrodes of the SAW chip and connection electrodes of the cover so as to hermetically seal IDT electrodes disposed on a main surface of a piezoelectric substrate of the SAW chip within a space defined between the SAW chip and the cover. The IDT electrodes and external electrodes on an upper surface of an insulating substrate of the cover are electrically connected to each other through conductive materials formed in through-holes.