公开(公告)号：US06291619B1

公开(公告)日：2001-09-18

申请号：US09355506

申请日：1999-07-29

Applicant: Yasunari Maekawa ,  Takao Miwa ,  Takumi Ueno ,  Yoshiaki Okabe

Inventor： Yasunari Maekawa ,  Takao Miwa ,  Takumi Ueno ,  Yoshiaki Okabe

IPC: C08F12600

CPC classification number: G03F7/0387 ,  G03F7/0045 ,  G03F7/0125 ,  G03F7/0233 ,  G03F7/039 ,  H01L21/312

Abstract: A photosensitive composition comprising a polyimide precursor, a photosensitive material having a structure represented by the following formula wherein A1 is an atom belonging to Group VI of the periodic table, in the molecule thereof and/or a photosensitive material having a structure represented by the following formula: wherein A2 is O, S or N atom, in the molecule thereof is suitable for formation of a positive tone pattern excellent in heat resistance, and applicable to electronic devices.

Abstract translation: 包含聚酰亚胺前体的光敏组合物，具有由下列化学式A1表示的结构的感光材料是分子中属于周期表第VI族的原子和/或具有由下式表示的结构的感光材料 ：其中A2是O，S或N原子，其分子中适用于形成耐热性优异的正色调图案，并且适用于电子器件。

公开(公告)号：US4694098A

公开(公告)日：1987-09-15

申请号：US761885

申请日：1985-08-02

Applicant: Yoichi Hirai ,  Tsunenori Fujii ,  Kaoru Koto ,  Kenji Suzuki ,  Masahiro Yoshida ,  Hisashi Okawa ,  Yoshiaki Okabe ,  Teruo Kitamura ,  Hisao Yokokura ,  Shintaroo Hattori ,  Akio Mukoh ,  Mikio Sato

Inventor： Yoichi Hirai ,  Tsunenori Fujii ,  Kaoru Koto ,  Kenji Suzuki ,  Masahiro Yoshida ,  Hisashi Okawa ,  Yoshiaki Okabe ,  Teruo Kitamura ,  Hisao Yokokura ,  Shintaroo Hattori ,  Akio Mukoh ,  Mikio Sato

IPC: C07C29/00 ,  C07C29/147 ,  C07C31/137 ,  C07C43/164 ,  C07C43/168 ,  C07C43/21 ,  C07C43/225 ,  C07C43/23 ,  C07C57/46 ,  C07C69/75 ,  C07C69/76 ,  C07C69/78 ,  C07C255/53 ,  C07D239/26 ,  C09K19/00 ,  C09K19/20 ,  C09K19/30 ,  C09K19/32 ,  C09K19/34 ,  C07C179/00 ,  C07C69/74

CPC classification number: C07D239/26 ,  C07C255/00 ,  C07C29/00 ,  C07C29/147 ,  C07C31/137 ,  C07C43/168 ,  C07C43/21 ,  C07C43/225 ,  C07C43/23 ,  C07C57/46 ,  C09K19/2007 ,  C09K19/3003 ,  C09K19/3068 ,  C09K19/32 ,  C09K19/321 ,  C09K19/3402 ,  C09K19/3458 ,  C09K19/3475 ,  C09K2019/3425

Abstract: A colorless liquid crystalline compound having at least one 6-membered ring and non-cyclic end groups in the molecular skeleton, said 6-membered ring containing two or more carbon atoms, at least one of which is directly bonded to a methylene group of a non-cyclic group having an alkoxy group at another end has a wide mesomorphic range. When said colorless liquid crystalline compound is mixed with a liquid crystal composition, the resulting mixture also has an enlarged mesomorphic range and in almost all cases has a reduced viscosity.

公开(公告)号：US08420766B2

公开(公告)日：2013-04-16

申请号：US12843979

申请日：2010-07-27

Applicant: Yoshiaki Okabe ,  Hiroyuki Kagawa

Inventor： Yoshiaki Okabe ,  Hiroyuki Kagawa

IPC: C08G59/68

CPC classification number: H05K1/0326 ,  C08G59/42 ,  C08J5/24 ,  C08J2363/00 ,  C08J2397/00 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K2203/178 ,  Y02P70/611

Abstract: A recyclable epoxy resin composition using a plant biomass in a resin skeleton and a cured material of the epoxy resin composition, and various types of products using them are provided. The epoxy resin composition comprises an epoxy resin; and a curing agent, wherein the curing agent is a biomass-derived acid anhydride having an acid anhydride bonded via an ester linkage to a biomass with a weight-average molecular weight of 300 to 5000.

Abstract translation: 提供了使用树脂骨架中的植物生物质的可回收环氧树脂组合物和环氧树脂组合物的固化物，以及使用它们的各种产品。 环氧树脂组合物包含环氧树脂; 和固化剂，其中固化剂是具有通过酯键与生物质键合的重均分子量为300-5000的生物质衍生的酸酐。

公开(公告)号：US5633112A

公开(公告)日：1997-05-27

申请号：US319788

申请日：1994-10-07

Applicant: Takao Miwa ,  Yoshiaki Okabe ,  Mina Ishida ,  Akio Takahashi ,  Shunichi Numata

Inventor： Takao Miwa ,  Yoshiaki Okabe ,  Mina Ishida ,  Akio Takahashi ,  Shunichi Numata

IPC: G03F7/004 ,  G03F7/021 ,  G03F7/039 ,  H01L21/027

CPC classification number: G03F7/0212 ,  G03F7/0045

Abstract: A photosensitive resin composition comprising (a) a polymer having carboxyl groups (b) a photoacid generator which generates an acid when irradiated with light, and (c) an aliphatic amine is capable of development with ease by use of a wide variety of aqueous solvents.

Abstract translation: 一种感光性树脂组合物，其包含（a）具有羧基的聚合物（b）光照产生酸的光酸产生剂，（c）脂肪族胺可以通过使用多种水性溶剂容易地显影 。

公开(公告)号：US4810048A

公开(公告)日：1989-03-07

申请号：US788258

申请日：1985-10-17

Applicant: Hideki Asano ,  Shuji Eguchi ,  Seikichi Tanno ,  Yoshiaki Okabe ,  Noriaki Taketani ,  Masanori Nemoto ,  Tuneo Narusawa ,  Yoshimitsu Mihara ,  Yukihiko Takada

Inventor： Hideki Asano ,  Shuji Eguchi ,  Seikichi Tanno ,  Yoshiaki Okabe ,  Noriaki Taketani ,  Masanori Nemoto ,  Tuneo Narusawa ,  Yoshimitsu Mihara ,  Yukihiko Takada

IPC: H05K7/04 ,  G02B6/12 ,  G11B33/02 ,  G11B33/12 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/30

CPC classification number: G11B33/12 ,  G02B6/12004 ,  G11B33/02 ,  H05K1/0284 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/18 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/1327 ,  H05K3/301

Abstract: This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread out on the substrate surface.

Abstract translation: 本发明包括具有安装有机械部件的基座的统一电路，并且涉及设置有衬底和埋置在衬底中和/或扩散在衬底表面上的电路的机械部件安装底盘。

公开(公告)号：US20120190812A1

公开(公告)日：2012-07-26

申请号：US13358529

申请日：2012-01-26

Applicant: Yoshiaki OKABE ,  Hiroyuki KAGAWA ,  Fusao HOJO

Inventor： Yoshiaki OKABE ,  Hiroyuki KAGAWA ,  Fusao HOJO

IPC: C08H7/00 ,  C08G64/02 ,  C08B15/00 ,  C08B37/00

CPC classification number: C08G64/1608 ,  C08G64/0208 ,  C08H6/00

Abstract: Provided is an environmentally friendly novel plant-based polycarbonate resin. Specifically, disclosed are: a plant-based polycarbonate resin which is a polymer derived from a plant-based material having a plurality of hydroxyl groups, in which molecules of the plant-based material are linked to each other through carbonate groups to form the polymer; and a production method of the polycarbonate resin.

Abstract translation: 提供了一种环保的新型植物型聚碳酸酯树脂。 具体地，公开了：植物性聚碳酸酯树脂，其是衍生自具有多个羟基的植物性材料的聚合物，其中植物类材料的分子通过碳酸酯基彼此连接以形成聚合物 ; 和聚碳酸酯树脂的制造方法。

公开(公告)号：US20100155122A1

公开(公告)日：2010-06-24

申请号：US12645726

申请日：2009-12-23

Applicant: Yoshiaki Okabe ,  Hiroyuki Kagawa

Inventor： Yoshiaki Okabe ,  Hiroyuki Kagawa

IPC: H05K1/00 ,  C07D303/00 ,  C07G1/00 ,  C08G65/04 ,  C08K5/05 ,  C08K5/07 ,  C08K5/15 ,  C08K5/16

CPC classification number: C07D405/14 ,  C08G59/02 ,  C08H6/00 ,  C08H8/00 ,  C08L63/00 ,  C09D163/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/0326 ,  H01L2224/0401

Abstract: There is disclosed a biomass-derived epoxy compound as an epoxidized product of a raw-material biomass-derived compound having a weight-average molecular weight of 300 to 10000. The biomass-derived epoxy compound has a weight-average molecular weight of 600 to 20000 and is soluble in an organic solvent for the preparation of a varnish. The epoxy compound is prepared by dissolving the raw-material biomass-derived compound in an aqueous alkali solution; adding epichlorohydrin to the solution and heating the mixture; and evaporating epichlorohydrin from the heated mixture and precipitating a biomass-derived epoxy compound, in which the aqueous alkali solution has a pH of 13.5 to 11.0. The biomass-derived epoxy compound has both high solubility in organic solvents and satisfactory heat resistance and can be manufactured in a high yield on the basis of the raw material through a less number of processes.

Abstract translation: 公开了一种生物质衍生的环氧化合物作为重均分子量为300〜10000的原料生物质衍生化合物的环氧化物。生物质衍生的环氧化合物的重均分子量为600〜 20000，并且可溶于用于制备清漆的有机溶剂中。 通过将原料生物质衍生化合物溶解在碱性水溶液中制备环氧化合物; 将表氯醇加入到溶液中并加热混合物; 并从加热的混合物中蒸发表氯醇，并沉淀出其中碱水溶液的pH为13.5至11.0的生物质衍生的环氧化合物。 生物质衍生的环氧化合物在有机溶剂中的溶解度高，耐热性良好，可以通过较少的工序，以原料为基准以高产率制造。

公开(公告)号：US5686191A

公开(公告)日：1997-11-11

申请号：US553240

申请日：1995-11-07

Applicant: Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

Inventor： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

IPC: C08G73/10 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B27/06

CPC classification number: H05K3/4655 ,  C08G73/1039 ,  C08G73/1071 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K3/386 ,  H05K3/4605 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

Abstract: A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.

Abstract translation: 包含（A）热固性聚酰亚胺和（B）双马来酰亚胺并且在其热固化期间显示出107至102达因/ cm 2的弹性模量的热固性树脂组合物适用于形成具有优异的薄膜布线板中使用的粘合剂膜 耐热性和高可靠性。

公开(公告)号：US5570506A

公开(公告)日：1996-11-05

申请号：US463562

申请日：1995-06-05

Applicant: Rie Tawata ,  Shunichi Numata ,  Takao Miwa ,  Koji Fujisaki ,  Takayoshi Ikeda ,  Yoshiaki Okabe ,  Hisae Shimanoki

Inventor： Rie Tawata ,  Shunichi Numata ,  Takao Miwa ,  Koji Fujisaki ,  Takayoshi Ikeda ,  Yoshiaki Okabe ,  Hisae Shimanoki

IPC: C08G73/10 ,  H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H01K3/22

CPC classification number: H05K3/4655 ,  H01L23/49894 ,  H05K1/0346 ,  H05K3/4673 ,  H05K3/4676 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2203/0759 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49163 ,  Y10T428/31721

Abstract: Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.

Abstract translation: 低热膨胀性聚酰亚胺具有线性刚性骨架，使得完全固化的低热膨胀聚酰亚胺膜之间的粘附性非常低。 另一方面，具有柔性骨架的聚酰亚胺的膜即使在完全固化后也显示出高的粘合性，从而可以通过插入具有柔性骨架的聚酰亚胺来增强低热膨胀性聚酰亚胺膜之间的粘附性。 在半固化状态下在低热膨胀性聚酰亚胺膜上形成柔性聚酰亚胺薄膜作为高粘合剂膜，然后在其上施加金属布线，然后形成半固化状态的另一高粘合性薄膜 然后在其上进一步形成低热膨胀性聚酰亚胺膜。 可以提供具有改善低热膨胀性聚酰亚胺膜和布线图案层或基板之间的粘附性的多层布线结构。

公开(公告)号：US08945413B2

公开(公告)日：2015-02-03

申请号：US13554582

申请日：2012-07-20

Applicant: Ayuta Suzuki ,  Songyun Kang ,  Tsuyoshi Moriya ,  Nobutoshi Terasawa ,  Yoshiaki Okabe

Inventor： Ayuta Suzuki ,  Songyun Kang ,  Tsuyoshi Moriya ,  Nobutoshi Terasawa ,  Yoshiaki Okabe

IPC: B44C1/22 ,  B29C59/14 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/3213

CPC classification number: C23C16/4404 ,  B29C59/14 ,  H01J37/32467 ,  H01J37/32477 ,  H01J37/32623 ,  H01J37/32642 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/32136 ,  H01L21/67069 ,  H01L21/68757 ,  Y10S156/915

Abstract: Etching is performed through the following process. A substrate is loaded into a processing chamber and mounted on a mounting table therein. Then, in the state where a ring member at least a surface of which is made of a same material as a main component of an etching target film is provided to surround the substrate, a processing gas is injected in a shower-like manner from a gas supply unit oppositely facing the substrate and the etching target film is etched by using a plasma of the processing gas; and evacuating the inside of the processing chamber through an exhaust path. Through this process, unbalanced distribution of plasma active species in the vicinity of a circumferential edge portion of the substrate can be suppressed.

Abstract translation: 蚀刻通过以下过程进行。 将基板装载到处理室中并安装在其中的安装台上。 然后，在以与蚀刻对象膜的主要成分相同的材料形成的环构件设置为包围基板的状态下，将处理气体从沐浴状注入到 通过使用处理气体的等离子体来蚀刻与基板相对的气体供给单元和蚀刻目标膜， 并且通过排气路径排出处理室的内部。 通过该处理，可以抑制基板的周缘部附近的等离子体活性物质的不平衡分布。