公开(公告)号：US20140061932A1

公开(公告)日：2014-03-06

申请号：US13604333

申请日：2012-09-05

Applicant: Meng-Tse Chen ,  Yi-Da Tsai ,  Xi-Hong Chen ,  Tao-Hua Lee ,  Wei-Yu Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Yi-Da Tsai ,  Xi-Hong Chen ,  Tao-Hua Lee ,  Wei-Yu Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/28 ,  H01L21/78 ,  H01L21/56 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/29116 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/81805 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A package-on-package (“PoP”) structure and a method of forming are provided. The PoP structure may be formed by forming a first set of electrical connections on a first substrate. A first material may be applied to the first set of electrical connections. A second substrate may be provided having a second set of electrical connections formed thereon. The first set of electrical connections of the first substrate having the epoxy flux applied may be contacted to the second electrical connections of the second substrate. A reflow process may be performed to electrically connect the first substrate to the second substrate. The epoxy flux applied to the first electrical connections of the first substrate may prohibit electrical bridges or shorts from forming during the reflow process.

Abstract translation: 提供封装封装（“PoP”）结构和形成方法。 PoP结构可以通过在第一基板上形成第一组电连接而形成。 可以将第一材料施加到第一组电连接。 可以提供具有形成在其上的第二组电连接的第二基板。 具有施加的环氧树脂焊剂的第一基板的第一组电连接可以接触第二基板的第二电连接。 可以进行回流工艺以将第一衬底电连接到第二衬底。 施加到第一基板的第一电连接处的环氧树脂通量可能会在回流过程中阻止电桥或短路的形成。

公开(公告)号：US08889486B2

公开(公告)日：2014-11-18

申请号：US13604333

申请日：2012-09-05

Applicant: Meng-Tse Chen ,  Yi-Da Tsai ,  Xi-Hong Chen ,  Tao-Hua Lee ,  Wei-Yu Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Yi-Da Tsai ,  Xi-Hong Chen ,  Tao-Hua Lee ,  Wei-Yu Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/29116 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/81805 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A package-on-package (“PoP”) structure and a method of forming are provided. The PoP structure may be formed by forming a first set of electrical connections on a first substrate. A first material may be applied to the first set of electrical connections. A second substrate may be provided having a second set of electrical connections formed thereon. The first set of electrical connections of the first substrate having the epoxy flux applied may be contacted to the second electrical connections of the second substrate. A reflow process may be performed to electrically connect the first substrate to the second substrate. The epoxy flux applied to the first electrical connections of the first substrate may prohibit electrical bridges or shorts from forming during the reflow process.

Abstract translation: 提供封装封装（“PoP”）结构和形成方法。 PoP结构可以通过在第一基板上形成第一组电连接而形成。 可以将第一材料施加到第一组电连接。 可以提供具有形成在其上的第二组电连接的第二基板。 具有施加的环氧树脂焊剂的第一基板的第一组电连接可以接触第二基板的第二电连接。 可以进行回流工艺以将第一衬底电连接到第二衬底。 施加到第一基板的第一电连接处的环氧树脂通量可能会在回流过程中阻止电桥或短路的形成。