公开(公告)号：US06438441B1

公开(公告)日：2002-08-20

申请号：US09605644

申请日：2000-06-28

Applicant: Bo-Soon Jang ,  Kil-Yong Noh ,  Hae-Sung Kim ,  Woo-Kyu Lee ,  Jong-Mo Ahn

Inventor： Bo-Soon Jang ,  Kil-Yong Noh ,  Hae-Sung Kim ,  Woo-Kyu Lee ,  Jong-Mo Ahn

IPC: G06F1900

CPC classification number: H01L22/20 ,  G05B19/41865 ,  G05B2219/31288 ,  Y02P90/18 ,  Y02P90/20

Abstract: A method for resetting a process recipe in a semiconductor factory automation (FA) system, includes the steps of: a) sending the process recipe and a lot identifier inputted from an operator to a process equipment, wherein the process recipe represents a set of semiconductor process conditions corresponding to a lot of semiconductor wafers and the lot identifier corresponds to the lot of semiconductor wafers; b) processing the lot of semiconductor wafers according to the process recipe; c) measuring the processed lot of semiconductor wafers to generate semiconductor measurement data; d) writing the semiconductor measurement data to a trace file, wherein the trace file includes the process recipe, the semiconductor measurement data and the lot identifier; e) retrieving the semiconductor measurement data contained in the trace file in response to a retrieval command inputted from the operator; and f) resetting the process recipe in response to a reset command inputted from the operator if the process recipe is not conformable, wherein the operator compares reference data with the retrieved semiconductor measurement data to determine whether the process recipe is conformable.

Abstract translation: 一种用于重新设置半导体工厂自动化（FA）系统中的处理配方的方法，包括以下步骤：a）将处理配方和从操作者输入的批次标识符发送到处理设备，其中处理配方表示一组半导体 对应于大量半导体晶片的工艺条件和批号标识符对应于许多半导体晶片; b）根据工艺配方加工许多半导体晶片; c）测量经处理的半导体晶片以产生半导体测量数据; d）将半导体测量数据写入跟踪文件，其中跟踪文件包括处理配方，半导体测量数据和批号标识符; e）响应于从操作者输入的检索命令，检索包含在跟踪文件中的半导体测量数据; 以及f）如果所述处理配方不一致，则响应于从操作者输入的复位命令来复位所述处理配方，其中所述操作者将所述参考数据与所检索的半导体测量数据进行比较，以确定所述处理配方是否一致。

公开(公告)号：US20160133502A1

公开(公告)日：2016-05-12

申请号：US14870242

申请日：2015-09-30

Applicant: Jung-min Won ,  Myoung-ho Jung ,  Byung-soo Moon ,  Sung-kyung Yun ,  Woo-kyu Lee

Inventor： Jung-min Won ,  Myoung-ho Jung ,  Byung-soo Moon ,  Sung-kyung Yun ,  Woo-kyu Lee

IPC: H01L21/687 ,  H01L21/68 ,  B25J9/16 ,  G01D5/34 ,  B25J9/04 ,  B25J11/00

CPC classification number: H01L21/68707 ,  B25J9/042 ,  B25J9/044 ,  B25J9/1679 ,  B25J11/0095 ,  B25J19/021 ,  G05B2219/40066 ,  G05B2219/45083 ,  H01L21/67259 ,  H01L21/67766 ,  H01L21/681 ,  Y10S901/02 ,  Y10S901/09 ,  Y10S901/15 ,  Y10S901/46

Abstract: A wafer transfer robot includes a robot transfer mechanism including a robot axis member and a robot arm member connected to the robot axis member, a robot hand connected to the robot arm member of the robot transfer mechanism and configured to transfer a wafer by using the robot transfer mechanism, a vertical displacement sensor installed in an upper side of the robot hand, and a plurality of horizontal displacement sensors installed in the upper side of the robot hand and separate from each other along a virtual line that is perpendicular to bilaterally symmetric axis of the robot hand.

Abstract translation: 晶片传送机器人包括机器人传送机构，其包括机器人轴构件和与机器人轴构件连接的机器人臂构件，机器人手连接到机器人传送机构的机器人臂构件，并且被配置为通过使用机器人传送晶片 传送机构，安装在机器人手的上侧的垂直位移传感器，以及安装在机器人手的上侧的多个水平位移传感器，沿着垂直于两侧对称的轴的虚拟线彼此分离 机器人手。

公开(公告)号：US06516238B1

公开(公告)日：2003-02-04

申请号：US09576418

申请日：2000-05-22

Applicant: Jin-Sun Kim ,  Moon-Gi Kim ,  Chang-Kee Hong ,  Tae-Ho Lee ,  Won-Soo Cho ,  Yung-Hwan Chae ,  Woo-Kyu Lee ,  Jong-Mo Ahn ,  Kwang-Ho Lee

Inventor： Jin-Sun Kim ,  Moon-Gi Kim ,  Chang-Kee Hong ,  Tae-Ho Lee ,  Won-Soo Cho ,  Yung-Hwan Chae ,  Woo-Kyu Lee ,  Jong-Mo Ahn ,  Kwang-Ho Lee

IPC: G06F1900

CPC classification number: G05B19/41895 ,  G05B2219/31002 ,  G05B2219/31013 ,  G05B2219/31086 ,  G05B2219/32277 ,  Y02P90/18 ,  Y02P90/285 ,  Y02P90/60

Abstract: A method for transporting semiconductor wafers in semiconductor factory automation system, includes the steps of: a) processing a lot of semiconductor wafers to be contained in a semiconductor wafer cassette in a process equipment; b) sending a cassette transportation request from the process equipment to a cell management server when the process equipment has processed the lot of semiconductor wafers; c) generating a transportation instruction in response to the cassette transportation request; and d) if the semiconductor wafer cassette is transported from the process equipment to a stocker by an automatic guide vehicle (AGV), simultaneously activating the AGV and the stocker by simultaneously sending the transportation instruction to the AGV and the stocker. The method in accordance with the present invention can reduce a time taken to transport the semiconductor wafers.

Abstract translation: 一种在半导体工厂自动化系统中传送半导体晶片的方法，包括以下步骤：a）处理要包含在处理设备中的半导体晶片盒中的许多半导体晶片; b）当处理设备处理了许多半导体晶片时，将处理设备的盒式磁带运送请求发送到单元管理服务器; c）响应于盒运输请求产生运输指令; 以及d）如果通过自动导向车辆（AGV）将半导体晶片盒从处理设备运送到储盘器，则同时通过向AGV和储料器发送运输指令来激活AGV和储料器。 根据本发明的方法可以减少运输半导体晶片所花费的时间。