公开(公告)号：US06438441B1

公开(公告)日：2002-08-20

申请号：US09605644

申请日：2000-06-28

Applicant: Bo-Soon Jang ,  Kil-Yong Noh ,  Hae-Sung Kim ,  Woo-Kyu Lee ,  Jong-Mo Ahn

Inventor： Bo-Soon Jang ,  Kil-Yong Noh ,  Hae-Sung Kim ,  Woo-Kyu Lee ,  Jong-Mo Ahn

IPC: G06F1900

CPC classification number: H01L22/20 ,  G05B19/41865 ,  G05B2219/31288 ,  Y02P90/18 ,  Y02P90/20

Abstract: A method for resetting a process recipe in a semiconductor factory automation (FA) system, includes the steps of: a) sending the process recipe and a lot identifier inputted from an operator to a process equipment, wherein the process recipe represents a set of semiconductor process conditions corresponding to a lot of semiconductor wafers and the lot identifier corresponds to the lot of semiconductor wafers; b) processing the lot of semiconductor wafers according to the process recipe; c) measuring the processed lot of semiconductor wafers to generate semiconductor measurement data; d) writing the semiconductor measurement data to a trace file, wherein the trace file includes the process recipe, the semiconductor measurement data and the lot identifier; e) retrieving the semiconductor measurement data contained in the trace file in response to a retrieval command inputted from the operator; and f) resetting the process recipe in response to a reset command inputted from the operator if the process recipe is not conformable, wherein the operator compares reference data with the retrieved semiconductor measurement data to determine whether the process recipe is conformable.

Abstract translation: 一种用于重新设置半导体工厂自动化（FA）系统中的处理配方的方法，包括以下步骤：a）将处理配方和从操作者输入的批次标识符发送到处理设备，其中处理配方表示一组半导体 对应于大量半导体晶片的工艺条件和批号标识符对应于许多半导体晶片; b）根据工艺配方加工许多半导体晶片; c）测量经处理的半导体晶片以产生半导体测量数据; d）将半导体测量数据写入跟踪文件，其中跟踪文件包括处理配方，半导体测量数据和批号标识符; e）响应于从操作者输入的检索命令，检索包含在跟踪文件中的半导体测量数据; 以及f）如果所述处理配方不一致，则响应于从操作者输入的复位命令来复位所述处理配方，其中所述操作者将所述参考数据与所检索的半导体测量数据进行比较，以确定所述处理配方是否一致。

公开(公告)号：US06757578B1

公开(公告)日：2004-06-29

申请号：US09599398

申请日：2000-06-22

Applicant: Bo-Soon Jang

Inventor： Bo-Soon Jang

IPC: G06F1900

CPC classification number: G05B19/41865 ,  Y02P90/10 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/28

Abstract: A method for processing a lot of semiconductor wafers in a semiconductor factory automation (FA) system, wherein the lot is defined as a predetermined number of semiconductor wafers, includes the steps of: a) determining whether a first process equipment operable at a first operating mode has a job file corresponding to the lot of semiconductor wafers, wherein the job file represents data required for a semiconductor process; b) if the first process equipment operable at the first operating mode has the job file, processing the lot of semiconductor wafers according to the job file in the first process equipment; c) if the first process equipment operable at the first operating mode has not the job file, providing the job file to a second process equipment operable at a second operating mode; and d) processing the lot of semiconductor wafers according to the job file in the second process equipment. The method can effectively process a lot of semiconductor wafers at a full-automation mode or a semi-automation mode.

Abstract translation: 一种用于在半导体工厂自动化（FA）系统中处理大量半导体晶片的方法，其中所述批次被定义为预定数量的半导体晶片，包括以下步骤：a）确定在第一操作中可操作的第一处理设备 模式具有对应于许多半导体晶片的作业文件，其中作业文件表示半导体处理所需的数据; b）如果在第一操作模式下可操作的第一处理设备具有作业文件，则根据第一处理设备中的作业文件处理多个半导体晶片; c）如果在第一操作模式下可操作的第一处理设备没有作业文件，则将作业文件提供给可在第二操作模式下操作的第二处理设备; 以及d）根据第二处理设备中的作业文件来处理许多半导体晶片。 该方法可以在全自动化模式或半自动化模式下有效地处理大量半导体晶片。