公开(公告)号：US07170029B2

公开(公告)日：2007-01-30

申请号：US10902897

申请日：2004-07-29

申请人： Wen Dong Song ,  Minghui Hong ,  Chengwu An ,  Yong Feng Lu

发明人： Wen Dong Song ,  Minghui Hong ,  Chengwu An ,  Yong Feng Lu

IPC分类号： B23K26/00 ,  B23K26/14 ,  B23K26/16 ,  B23K26/18

CPC分类号： B08B7/0042 ,  B23K26/0624 ,  B23K26/351 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/67144

摘要： This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

摘要翻译： 本发明涉及一种通过激光照射对集成电路（IC）封装进行消融的方法和装置。 该方法和装置包括两个激光扫描闪光区域，用于进行去抖动操作。 CO 2激光器用于去除闪光的顶层，并且使用YAG激光器去除CO 2激光束缚后残留的薄层。 CO 2激光束缚和随后的YAG激光束缚可以有效地去除闪光，并避免散热片以及IC封装中的引线和棒的损坏。

公开(公告)号：US06917011B2

公开(公告)日：2005-07-12

申请号：US10193773

申请日：2002-07-10

申请人： Ming Hui Hong ,  Yong Feng Lu ,  Wen Dong Song ,  Zhihong Mai ,  Kok Tong Thiam ,  Chye Eng Soh

发明人： Ming Hui Hong ,  Yong Feng Lu ,  Wen Dong Song ,  Zhihong Mai ,  Kok Tong Thiam ,  Chye Eng Soh

IPC分类号： B23K26/00 ,  B23K26/40 ,  H01L21/56 ,  H01L21/60

CPC分类号： H01L24/98 ,  B23K26/361 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50 ,  H01L21/56 ,  H01L24/45 ,  H01L24/799 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0106 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidization of the molding compound by ambient air.

摘要翻译： 本发明涉及一种用于对集成电路封装进行去盖的方法和装置。 本发明涉及用激光辐射照射IC封装，通常在UV-IR光谱和短脉冲持续时间内。 照射导致模塑料的烧蚀。 本发明还提供切割过程和消除碎屑的流体流动去除的实时监测和过程控制。 使用本发明，可以进行开盖，而不会损坏内部IC结构。 此外，液体中的开盖可以防止环境空气对模塑料的氧化。

公开(公告)号：US06838637B2

公开(公告)日：2005-01-04

申请号：US10059940

申请日：2002-01-29

申请人： Wen Dong Song ,  Minghui Hong ,  Chengwu An ,  Yong Feng Lu

发明人： Wen Dong Song ,  Minghui Hong ,  Chengwu An ,  Yong Feng Lu

IPC分类号： B08B7/00 ,  B23K26/00 ,  B23K26/06 ,  H01L21/00

CPC分类号： B08B7/0042 ,  B23K26/0624 ,  B23K26/351 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/67144

摘要： This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

摘要翻译： 本发明涉及一种通过激光照射对集成电路（IC）封装进行消融的方法和装置。 该方法和装置包括两个激光扫描闪光区域，用于进行去抖动操作。 CO2激光器用于去除顶层闪光灯，YAG激光器用于去除二氧化碳激光束缚后残留的薄层闪光。 二氧化碳激光束缚和随后的YAG激光束缚可以有效去除闪光灯，避免散热片以及IC封装中引线和棒的损坏。

公开(公告)号：US06828524B2

公开(公告)日：2004-12-07

申请号：US10083832

申请日：2002-02-27

申请人： Minghui Hong ,  Wen Dong Song ,  Yongfeng Lu

发明人： Minghui Hong ,  Wen Dong Song ,  Yongfeng Lu

IPC分类号： B23K2600

CPC分类号： B41J2/16517 ,  H05K3/26

摘要： This invention relates to a method and apparatus for removing surface contamination on a flexible circuit 34 for an inkjet printer cartridge by pulsed laser irradiation in air. The contamination 3 around and inside the tiny inkjet nozzles 4 can be completely removed without any damage on the flexible circuit 34 by the laser irradiation. The cleaning mechanisms are laser-induced ablation of the contamination and fast momentum transferring from the laser beam to the contamination materials. Compared with chemical solution cleaning and plasma etching, this technique has high throughput and does not cause flexible circuit damage, due to the fact that there are no water and chemical solutions involved in the process. Meanwhile, the laser irradiation is only limited in a small area around the tiny inkjet nozzles 4. There is no laser interaction with the thin conductive circuit 34.

摘要翻译： 本发明涉及通过脉冲激光照射在空气中去除用于喷墨打印机墨盒的柔性电路34上的表面污染物的方法和装置。 可以通过激光照射在微型喷墨嘴4周围和内部的污染物3完全去除而不会对柔性电路34造成任何损坏。 清洁机制是激光诱导的污染消融和从激光束传递到污染物质的快速动量。 与化学溶液清洗和等离子体蚀刻相比，该技术具有高通量，并且由于在该过程中没有涉及水和化学溶液的事实，不会导致柔性电路损坏。 同时，激光照射仅在微小喷墨喷嘴4周围的小区域中受到限制。与薄导电电路34没有激光相互作用。

公开(公告)号：US06835319B2

公开(公告)日：2004-12-28

申请号：US10078382

申请日：2002-02-21

申请人： Wen Dong Song ,  Minghui Hong ,  Yong Feng Lu

发明人： Wen Dong Song ,  Minghui Hong ,  Yong Feng Lu

IPC分类号： H01L21302

CPC分类号： C03C17/23 ,  B23K26/1224 ,  B23K26/146 ,  B23K2101/40 ,  C03C2217/211 ,  C03C2217/215 ,  C03C2217/231 ,  C03C2218/33 ,  H01L21/30604 ,  H01L21/31111

摘要： A method of patterning a substrate includes forming a liquid film on the substrate surface and directing laser energy from a laser through the film to etch the substrate surface. Etched material is carried away from the substrate surface via evaporation of the film during the etching. The liquid film may be formed on the substrate surface by jetting a liquid vapor onto the substrate.

摘要翻译： 图案化衬底的方法包括在衬底表面上形成液膜并将来自激光器的激光能量引导通过膜以蚀刻衬底表面。 在蚀刻期间通过膜的蒸发将蚀刻的材料从衬底表面带走。 液体膜可以通过将液体蒸气喷射到基板上而形成在基板表面上。