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公开(公告)号：US20070190962A1
公开(公告)日：2007-08-16
申请号：US11618207
申请日：2006-12-29
申请人： Kenji Sasaki , Tomonori Tanoue , Sakae Kikuchi , Toshifumi Makino , Takeshi Sato , Tsutomu Kobori , Yasunari Umemoto , Takashi Kitahara
发明人： Kenji Sasaki , Tomonori Tanoue , Sakae Kikuchi , Toshifumi Makino , Takeshi Sato , Tsutomu Kobori , Yasunari Umemoto , Takashi Kitahara
CPC分类号： H04B1/28 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L25/18 , H01L2223/6644 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/85181 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01031 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01079 , H01L2924/10329 , H01L2924/10336 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).
摘要翻译： 提供了一种技术，使得用于蜂窝电话等的RF模块的尺寸可以减小。 在构成RF模块的布线板上，设置有形成放大器电路的第一半导体芯片和形成用于控制放大器电路的控制电路的第二半导体芯片。 第二半导体芯片上的接合焊盘通过导线直接通过第一半导体芯片上的接合焊盘连接而不使用继电器垫。 在这方面，形成在第一半导体芯片上的焊盘不是正方形，而是矩形（长方形）。
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公开(公告)号：US08546939B2
公开(公告)日：2013-10-01
申请号：US11618207
申请日：2006-12-29
申请人： Kenji Sasaki , Tomonori Tanoue , Sakae Kikuchi , Toshifumi Makino , Takeshi Sato , Tsutomu Kobori , Yasunari Umemoto , Takashi Kitahara
发明人： Kenji Sasaki , Tomonori Tanoue , Sakae Kikuchi , Toshifumi Makino , Takeshi Sato , Tsutomu Kobori , Yasunari Umemoto , Takashi Kitahara
IPC分类号： H01L23/34 , H01L29/66 , H01L23/52 , H01L23/48 , H01L29/40 , H03F1/00 , H03F3/14 , H03F3/04 , H03F3/68 , H04B1/06 , H04B7/00 , H04B1/28
CPC分类号： H04B1/28 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L25/18 , H01L2223/6644 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/85181 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01031 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01079 , H01L2924/10329 , H01L2924/10336 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).
摘要翻译： 提供了一种技术，使得用于蜂窝电话等的RF模块的尺寸可以减小。 在构成RF模块的布线板上，设置有形成放大器电路的第一半导体芯片和形成用于控制放大器电路的控制电路的第二半导体芯片。 第二半导体芯片上的接合焊盘通过导线直接通过第一半导体芯片上的接合焊盘连接而不使用继电器垫。 在这方面，形成在第一半导体芯片上的焊盘不是正方形，而是矩形（长方形）。
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