公开(公告)号：US20060144156A1

公开(公告)日：2006-07-06

申请号：US11028343

申请日：2005-01-03

申请人： Hamid Borzabadi ,  Dennis Koglin ,  Stephen Long ,  Timothy Vas

发明人： Hamid Borzabadi ,  Dennis Koglin ,  Stephen Long ,  Timothy Vas

IPC分类号： G01L9/00

CPC分类号： G01L9/0051 ,  G01L9/045 ,  G01L19/069

摘要： A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors. The sensor-compensation circuit pairs are calibrated and singulated for final packaging.

摘要翻译： 用于制造集成压力传感器的技术包括多个步骤。 首先，提供位于基板的第一和第二侧上的导电电迹线的基板。 多个补偿电路以与衬底的第一侧上的一个或多个导电电迹线电接触的方式位于衬底的第一侧上的阵列中。 多个压力传感器位于衬底的第二侧上，与衬底的第二侧上的一个或多个导电电迹线电接触。 每个传感器与补偿电路中的一个相关联，以形成多个压力传感器 - 补偿电路对。 衬底包括用于电连接每个传感器 - 补偿电路对的导电通路。 每个补偿电路为相关联的一个传感器提供温度补偿。 传感器补偿电路对被校准和分组以进行最终的封装。

公开(公告)号：US20070157699A1

公开(公告)日：2007-07-12

申请号：US11328032

申请日：2006-01-09

申请人： Gregory Manlove ,  Stephen Long ,  Hamid Borzabadi ,  Timothy Vas ,  Kevin Hawes

发明人： Gregory Manlove ,  Stephen Long ,  Hamid Borzabadi ,  Timothy Vas ,  Kevin Hawes

IPC分类号： G01N3/30

CPC分类号： G01D11/245 ,  G01P1/023

摘要： A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

摘要翻译： 传感器模块设置有具有包含传感器的紧凑壳体。 低温共烧陶瓷基板位于外壳上。 传感器和信号处理电路位于低温共烧陶瓷基片上。 传感器模块还包括基本上封装传感器的金属屏蔽。

公开(公告)号：US20060262829A1

公开(公告)日：2006-11-23

申请号：US11130978

申请日：2005-05-17

申请人： Gregory Manlove ,  Pedro Castillo-Borelly ,  James Logsdon ,  Jack Johnson ,  Timothy Vas ,  Abhijeet Chavan

发明人： Gregory Manlove ,  Pedro Castillo-Borelly ,  James Logsdon ,  Jack Johnson ,  Timothy Vas ,  Abhijeet Chavan

IPC分类号： G01K1/16

CPC分类号： G01J5/16

摘要： An infrared temperature sensing device is provided for sensing temperature of a target object. The sensing device includes a semiconductor substrate, a thermopile infrared sensor mounted to the substrate for sensing temperature of a remote target object, and temperature sensing circuitry mounted to the substrate. The temperature sensing circuitry generates a temperature dependent signal substantially linearly related to ambient temperature of the substrate. The sensing device further includes summing circuitry for generating a signal indicative of infrared sensed temperature as a function of the ambient temperature.

摘要翻译： 提供一种用于感测目标物体的温度的红外温度检测装置。 感测装置包括半导体衬底，安装到衬底的热电堆红外传感器，用于感测远程目标物体的温度，以及安装到衬底的温度感测电路。 温度感测电路产生与衬底的环境温度基本线性相关的温度相关信号。 感测装置还包括用于产生指示作为环境温度的函数的红外感测温度的信号的求和电路。

公开(公告)号：US20060248957A1

公开(公告)日：2006-11-09

申请号：US11124832

申请日：2005-05-09

申请人： Timothy Vas ,  Timothy Betzner ,  Stephen Long

发明人： Timothy Vas ,  Timothy Betzner ,  Stephen Long

IPC分类号： G01L9/00

CPC分类号： G01L19/0645 ,  G01L19/0038 ,  Y10T29/4998

摘要： A silicon-based high pressure sensor module incorporates a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. A bossed container filled with oil is mounted on the substrate and houses a sensor cell. The top surface of the bossed container is flexible and deflects under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensor can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

摘要翻译： 硅基高压传感器模块包含低温共烧陶瓷（LTCC）基板。 LTCC基板可承受高压。 装有油的凸起的容器安装在基板上并且容纳传感器单元。 凸起的容器的顶表面是柔性的并且在压力下偏转。 通过控制上表面的表面积和厚度，压力传感器可被配置成测量宽范围的压力。 油将压力从凸起的容器传递到传感器单元的隔膜，同时保护传感器单元免受高压和恶劣的介质。

公开(公告)号：US20050101047A1

公开(公告)日：2005-05-12

申请号：US11010862

申请日：2004-12-13

申请人： John Freeman ,  William Baney ,  Timothy Betzner ,  Dan Chilcott ,  John Christenson ,  Timothy Vas ,  George Queen ,  Stephen Long

发明人： John Freeman ,  William Baney ,  Timothy Betzner ,  Dan Chilcott ,  John Christenson ,  Timothy Vas ,  George Queen ,  Stephen Long

IPC分类号： B81C1/00 ,  H01L21/00 ,  H04R19/00 ,  H04R25/00 ,  H04R31/00

CPC分类号： H04R31/00 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C1/00666 ,  H04R19/005 ,  H04R31/006 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49005

摘要： A process of forming a capacitive audio transducer, preferably having an all-silicon monolithic construction that includes capacitive plates defined by doped single-crystal silicon layers. The capacitive plates are defined by etching the single-crystal silicon layers, and the capacitive gap therebetween is accurately established by wafer bonding, yielding a transducer that can be produced by high-volume manufacturing practices.

摘要翻译： 形成电容式音频换能器的过程，优选地具有包括由掺杂的单晶硅层限定的电容板的全硅单片结构。 通过蚀刻单晶硅层来限定电容板，并且通过晶片接合精确地建立它们之间的电容间隙，产生可以通过大批量制造实践产生的换能器。

公开(公告)号：US20070214894A1

公开(公告)日：2007-09-20

申请号：US11796353

申请日：2007-04-27

申请人： Timothy Vas ,  Timothy Betzner ,  Stephen Long

发明人： Timothy Vas ,  Timothy Betzner ,  Stephen Long

IPC分类号： G01R31/28 ,  B21B13/22

CPC分类号： G01L19/0645 ,  G01L19/0038 ,  Y10T29/4998

摘要： Silicon-based high pressure sensor modules are manufactured in an array arrangement, incorporating a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. Bossed containers filled with oil are mounted on the substrate in an array. These bossed containers house the sensor cells which are composed of a sensor handle wafer and a diaphragm. The top surface of these bossed containers are flexible and deflect under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensors can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

摘要翻译： 基于硅的高压传感器模块以阵列布置制造，结合有低温共烧陶瓷（LTCC）衬底。 LTCC基板可承受高压。 装满油的凸起的容器以阵列的形式安装在基板上。 这些凸起的容器容纳由传感器处理晶片和隔膜组成的传感器单元。 这些凸起的容器的顶表面是柔性的并且在压力下偏转。 通过控制上表面的表面积和厚度，压力传感器可被配置成测量宽范围的压力。 油将压力从凸起的容器传递到传感器单元的隔膜，同时保护传感器单元免受高压和恶劣的介质。