Rotary magnet sputtering apparatus
    3.
    发明授权
    Rotary magnet sputtering apparatus 有权
    旋转磁体溅射装置

    公开(公告)号:US08496792B2

    公开(公告)日:2013-07-30

    申请号:US12593660

    申请日:2008-03-28

    CPC classification number: C23C14/35 C23C14/54 H01J37/3405 H01J37/347

    Abstract: In a rotary magnet sputtering apparatus, a target consumption displacement quantity is measured, and corresponding to the measurement results, a distance between a rotating magnet group and a target is adjusted, and uniform film forming rate is achieved over a long period of time so as to reduce the change of a target surface due to consumption of the target and to reduce the change of the film forming rate with time. An ultrasonic sensor or a laser transmitting/receiving device may be used as a means for measuring the consumption displacement quantity of the target.

    Abstract translation: 在旋转磁体溅射装置中,测量目标消耗量位移量,并且对应于测量结果,调整旋转磁体组与目标之间的距离,并且长时间实现均匀的成膜速度,以便 以减少由于目标物的消耗导致的目标表面的变化并且随着时间而减少成膜速率的变化。 可以使用超声波传感器或激光发射/接收装置作为测量目标的消耗位移量的装置。

    ROTARY MAGNET SPUTTERING APPARATUS
    5.
    发明申请
    ROTARY MAGNET SPUTTERING APPARATUS 审中-公开
    旋转磁铁溅射装置

    公开(公告)号:US20120064259A1

    公开(公告)日:2012-03-15

    申请号:US13320376

    申请日:2010-03-19

    CPC classification number: C23C14/35 H01J37/3405 H01J37/3497

    Abstract: Provided is a rotary magnet sputtering apparatus that reduces an adverse effect due to heating of a target portion and so on caused by an increase in plasma excitation power. The rotary magnet sputtering apparatus has a structure in which the heat is removed from the target portion by causing a cooling medium to flow in helical spaces formed between a plurality of helical plate-like magnet groups or by providing a cooling passage in a backing plate which supports the target portion.

    Abstract translation: 提供一种旋转磁体溅射装置,其减少由等离子体激发功率的增加引起的由于目标部分的加热引起的不利影响。 旋转磁体溅射装置具有这样的结构,其中通过使冷却介质在形成在多个螺旋状板状磁体组之间的螺旋空间中流动,或者通过在背板中设置冷却通道,从目标部分去除热量 支援目标部分。

    MAGNETRON, MAGNETRON CATHODE BODY MANUFACTURING METHOD, AND CATHODE BODY
    6.
    发明申请
    MAGNETRON, MAGNETRON CATHODE BODY MANUFACTURING METHOD, AND CATHODE BODY 审中-公开
    MAGNETRON,MAGNETRON CATHODE BODY MANUFACTURING METHOD AND CATHODE BODY

    公开(公告)号:US20110169390A1

    公开(公告)日:2011-07-14

    申请号:US13063583

    申请日:2009-09-17

    CPC classification number: H01J25/587 H01J23/05

    Abstract: It is an object of the present invention to obtain a cathode body capable of maintaining a long service life even when a high current flows therethrough. According to the present invention, it is possible to obtain a magnetron cathode body including, as a base material, a high-melting-point metal containing an electron emission material, and rare-earth boride coating a surface thereof. As the electron emission material and the high-melting-point metal, La2O3 and W are desirable, respectively. As the rare-earth boride, LaB6 is preferable.

    Abstract translation: 本发明的目的是获得即使当高电流流经时也能够保持长使用寿命的阴极体。 根据本发明,可以获得包含作为基材的含有电子发射材料的高熔点金属和涂覆其表面的稀土硼化物的磁控阴极体。 作为电子发射材料和高熔点金属,分别需要La 2 O 3和W。 作为稀土硼化物,优选LaB6。

    PHOTOELECTRIC CONVERSION ELEMENT STRUCTURE AND SOLAR CELL
    9.
    发明申请
    PHOTOELECTRIC CONVERSION ELEMENT STRUCTURE AND SOLAR CELL 审中-公开
    光电转换元件结构与太阳能电池

    公开(公告)号:US20110000533A1

    公开(公告)日:2011-01-06

    申请号:US12920900

    申请日:2009-03-02

    Abstract: It is possible to reduce the contact resistance so as to improve the conversion efficiency of a photoelectric conversion element structure. Provided is a photoelectric conversion element structure of the pin structure which selects an upper limit energy level of the valence band of the p-type semiconductor or the electron affinity of the n-type semiconductor layer and the work function of a metal layer which is brought into contact with the semiconductor, so as to reduce the contact resistance as compared to the case when Al or Ag is used as an electrode. The selected metal layer may be arranged between the electrode formed from Al or Ag and the semiconductor or may be substituted for the n- or p-type semiconductor.

    Abstract translation: 可以降低接触电阻,从而提高光电转换元件结构的转换效率。 提供了选择p型半导体的价带的上限能级或n型半导体层的电子亲和力的引脚结构的光电转换元件结构以及被带入的金属层的功函数 与使用Al或Ag作为电极的情况相比,与半导体接触以降低接触电阻。 所选择的金属层可以布置在由Al或Ag形成的电极和半导体之间,或者可以代替n型或p型半导体。

    ROTARY MAGNET SPUTTERING APPARATUS
    10.
    发明申请
    ROTARY MAGNET SPUTTERING APPARATUS 有权
    旋转磁铁溅射装置

    公开(公告)号:US20100126852A1

    公开(公告)日:2010-05-27

    申请号:US12593660

    申请日:2008-03-28

    CPC classification number: C23C14/35 C23C14/54 H01J37/3405 H01J37/347

    Abstract: In a rotary magnet sputtering apparatus, a target consumption displacement quantity is measured, and corresponding to the measurement results, a distance between a rotating magnet group and a target is adjusted, and uniform film forming rate is achieved over a long period of time so as to reduce the change of a target surface due to consumption of the target and to reduce the change of the film forming rate with time. An ultrasonic sensor or a laser transmitting/receiving device may be used as a means for measuring the consumption displacement quantity of the target.

    Abstract translation: 在旋转磁体溅射装置中,测量目标消耗量位移量,并且对应于测量结果,调整旋转磁体组与目标之间的距离,并且长时间实现均匀的成膜速度,以便 以减少由于目标物的消耗导致的目标表面的变化并且随着时间而减少成膜速率的变化。 可以使用超声波传感器或激光发射/接收装置作为测量目标的消耗位移量的装置。

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