公开(公告)号：US5511201A

公开(公告)日：1996-04-23

申请号：US857629

申请日：1992-03-25

申请人： Hideki Kamimaki ,  Kiyokazu Nishioka ,  Tsuguji Tachiuchi ,  Nobuo Tsuchiya ,  Masahiro Jinushi ,  Hitoshi Sadamitsu ,  Hiroshi Ito ,  Takashi Yoshitomi ,  Koichi Isaji ,  Takao Ohba

发明人： Hideki Kamimaki ,  Kiyokazu Nishioka ,  Tsuguji Tachiuchi ,  Nobuo Tsuchiya ,  Masahiro Jinushi ,  Hitoshi Sadamitsu ,  Hiroshi Ito ,  Takashi Yoshitomi ,  Koichi Isaji ,  Takao Ohba

IPC分类号： G09G3/34 ,  G06F11/00 ,  G06F11/30

CPC分类号： G09G3/3406 ,  G09G2320/0606 ,  G09G2320/0626 ,  G09G2330/021 ,  G09G2330/026

摘要： A data processing apparatus which includes a display unit and a power supply controller for supplying power to the display unit. The display unit has a display screen and a back light controller. The power supply controller comprises a switch, at least one output line for receiving the power from the switch and for supplying therethrough the power to electronic devices, a delay circuit for receiving the power from the switch and when the switch is turned ON to start supply of the power, for outputting the power after passage of a predetermined time from the start of the power supply, and a second output line for supplying the power from the delay circuit to the back light controller therethrough. The display unit has a memory means for storing therein a luminance data on the display screen through the back light controller when the power supply is turned OFF and for determining an output state of the display unit through the back light controller on the basis of the luminance data read out from the memory means when the power supply is turned ON. Further, the data processing apparatus has a means for invalidating output of a display data to be output onto the display screen and a means, after the display data is invalidated, for reducing a frequency of a timing signal or invalidating output of the timing signal for the display unit.

摘要翻译： 一种数据处理装置，包括显示单元和用于向显示单元供电的电源控制器。 显示单元具有显示屏和背光控制器。 电源控制器包括开关，至少一个输出线，用于从开关接收电力并通过其向电子设备提供电力;延迟电路，用于从开关接收电力;以及当开关接通以开始供电时 的功率，用于在从电源开始经过预定时间之后输出电力;以及第二输出线，用于将来自延迟电路的电力提供给背光控制器。 显示单元具有存储装置，用于当电源关闭时通过背光控制器在其上存储亮度数据，并且通过背光控制器基于亮度来确定显示单元的输出状态 当电源接通时，从存储器读出的数据意味着。 此外，数据处理装置具有使输出到显示屏幕上的显示数据的输出无效的装置和在显示数据无效之后的装置，用于减少定时信号的频率或使定时信号的输出无效， 显示单元。

公开(公告)号：US5195576A

公开(公告)日：1993-03-23

申请号：US659671

申请日：1991-02-25

申请人： Toshio Hatada ,  Hitoshi Matsushima ,  Yoshihiro Kondou ,  Hiroshi Inoue ,  Kanji Otsuka ,  Yuji Shirai ,  Takao Ohba ,  Akira Yamagiwa

发明人： Toshio Hatada ,  Hitoshi Matsushima ,  Yoshihiro Kondou ,  Hiroshi Inoue ,  Kanji Otsuka ,  Yuji Shirai ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H01L23/473 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  H05K7/10 ,  H05K7/20

CPC分类号： F28F3/022 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/467 ,  H05K7/1015 ,  H01L2224/45015 ,  H01L2224/49109 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/16195

摘要： An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.

摘要翻译： 具有各种结构的LSI冷却装置用于诸如计算机系统的电子设备中。 特别地，装置的LSI冷却适用于具有高发热密度的LSI的冷却。 在本发明的冷却装置中，散热器的压力损失小，冷却性能优异。 这是因为散热器包括细线散热片，使得雷诺数不得超过40个。结果，可以冷却产生大量热量的LSI。 此外，通过将宽幅拉丝物质设置在细线中或通过使用支撑体，可以获得具有刚性的散热器。 此外，包括散热器的LSI的计算机可以应对各种冷却空气送出方法，并且可以以低噪声进行冷却。

公开(公告)号：US5428503A

公开(公告)日：1995-06-27

申请号：US317614

申请日：1994-09-26

申请人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

发明人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H05K7/20

CPC分类号： H05K7/20154 ,  Y10S165/908

摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.

摘要翻译： 一种用于电子设备的冷却装置，用于通过使安装在电子设备上的发热装置的温度分布均匀，更具体地在计算机上，并且为了减少进行维护时所需的工作过程而提高设备的可靠性 电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。 冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。 喷射冷却装置与印刷电路板平行地形成。 喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道，并且形成为将喷射流状态的冷却空气供应到每个发热装置。 因此，冷却空气可以集中以局部冷却印刷电路板，包括产生大热值的热的装置。 因此，能够使发热元件的温度上升均匀。

公开(公告)号：US5504924A

公开(公告)日：1996-04-02

申请号：US317621

申请日：1994-09-26

申请人： Shingeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Toshio Hatada ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa

发明人： Shingeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Toshio Hatada ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： G06F1/00 ,  F28D15/02 ,  G06F1/20 ,  H05K7/20 ,  G06F9/00

CPC分类号： H05K7/208 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  G06F1/206 ,  H05K7/20809 ,  G06F2200/201

摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.

摘要翻译： 一种电子计算机冷却系统，其具有用于冷却电子计算机的冷却装置和用于热连接半导体装置的冷却构件，所述冷却构件的工作速度通过冷却而升高到所述冷却装置的低温源。 安装构成电子计算机的半导体装置等的电路板被紧凑地封闭在一个壳体中，诸如制冷装置等的冷却装置。 或者，电路板和冷却装置分别紧密地封闭在分离的可拆卸的外壳中。 因此，可以获得通过使用冷却部件可靠地冷却期望的半导体器件的结构。

公开(公告)号：US5365402A

公开(公告)日：1994-11-15

申请号：US800268

申请日：1991-11-29

申请人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

发明人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2224/32188 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

摘要翻译： 一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。 弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

公开(公告)号：US5361188A

公开(公告)日：1994-11-01

申请号：US115669

申请日：1993-09-02

申请人： Yoshihiro Kondou ,  Hitoshi Matsushima ,  Toshio Hatada ,  Hiroshi Inouye ,  Toshihiro Komatsu ,  Takao Ohba ,  Akira Yamagiwa

发明人： Yoshihiro Kondou ,  Hitoshi Matsushima ,  Toshio Hatada ,  Hiroshi Inouye ,  Toshihiro Komatsu ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H05K7/20 ,  H01L23/467

CPC分类号： H01L23/467 ,  H05K7/20563 ,  H01L2224/32 ,  H01L2224/73253 ,  Y10S165/908

摘要： In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.

摘要翻译： 在电子设备的冷却装置中，分别将多个集成电路装置和大型集成电路装置安装在多个基板上，并且冷却风扇从外部向这些集成电路装置中的每一个提供冷却空气。 具有适于包围每个基板并且沿着基板限定流动路径的梳齿形状的管道将由冷却风扇供应的冷却空气引入到每个集成电路装置。 导管包括多个小孔，其设置在与基板上的集成电路器件的位置对应的位置处，并且具有与集成电路器件的发热值对应的开放区域。 这些小孔将作为喷射流的冷却风扇供给的冷却空气流向集成电路装置。 这种喷射流冷却改善了冷却性能，并且可以使集成电路器件的温度分布均匀。

公开(公告)号：US5315482A

公开(公告)日：1994-05-24

申请号：US961394

申请日：1992-10-15

申请人： Akira Tanaka ,  Hiroichi Shinohara ,  Kazuji Yamada ,  Takao Ohba ,  Akira Yamagiwa ,  Hitoshi Yoshidome ,  Yuji Shirai ,  Toshio Hatada ,  Munehisa Kishimoto ,  Michiharu Honda

发明人： Akira Tanaka ,  Hiroichi Shinohara ,  Kazuji Yamada ,  Takao Ohba ,  Akira Yamagiwa ,  Hitoshi Yoshidome ,  Yuji Shirai ,  Toshio Hatada ,  Munehisa Kishimoto ,  Michiharu Honda

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L25/10 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/36 ,  H05K7/20

CPC分类号： H05K1/021 ,  H01L23/367 ,  H01L25/105 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/182 ,  H05K2203/049 ,  H05K3/0061 ,  H05K3/366

摘要： A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

摘要翻译： 半导体装置包括热扩散板和表面安装印刷板。 在散热板上安装有高发热的半导体装置。 表面安装封装和芯片部件安装在印刷电路板的两个表面上。 在印刷电路板的中心形成通孔，使得半导体器件位于中心。 已经安装了半导体器件的散热板和表面安装印刷板连接并整合。

公开(公告)号：US5313362A

公开(公告)日：1994-05-17

申请号：US885979

申请日：1992-05-20

申请人： Toshio Hatada ,  Hiroshi Inouye ,  Takao Ohba ,  Susumu Iwai

发明人： Toshio Hatada ,  Hiroshi Inouye ,  Takao Ohba ,  Susumu Iwai

IPC分类号： G06F1/20 ,  H01L23/36 ,  H01L23/467 ,  H05K7/20

CPC分类号： G06F1/203

摘要： In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40.degree. C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50.degree. to 60.degree. C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.

摘要翻译： 在天然空气冷却型的小型计算机中，高温散热器促进自然对流，从而增加散热量，并且提高LSI芯片的允许的发热极限，从而提高处理速度 电脑 为此，在约40℃的相对低的温度下，壳体和翅片被用作热辐射器，即使操作者的手被触摸也是安全的。 另一方面，在壳体内部设置约50〜60℃的高温散热器，防止操作者的手直接接触。 通过LSI芯片等产生的热量通过热传导等传递到高温散热器，并且在升温的高温散热器和引入壳体的空气之间进行热交换，以促进 套管内部自然对流。