公开(公告)号：US08054612B2

公开(公告)日：2011-11-08

申请号：US12626031

申请日：2009-11-25

申请人： Kenji Ichinomiya ,  Toshiyuki Kawano ,  Takami Satoh

发明人： Kenji Ichinomiya ,  Toshiyuki Kawano ,  Takami Satoh

IPC分类号： H02B1/04 ,  H01H9/02

CPC分类号： H01H71/0271 ,  H01H1/5844 ,  H01H1/5866 ,  H01H71/04 ,  H01H71/08 ,  H01H71/082 ,  H01H89/06 ,  H02B1/20 ,  H02G5/005

摘要： A plug-in unit includes a breaker electrically connected with a busbar at a power supply side and an electric device electrically connected with the breaker. Joint surfaces making contact with each other are formed at the breaker and the electric device, respectively. The breaker includes a terminal metal fitting connecting the busbar thereto and a plug-in terminal metal fitting installed at the joint surface of the breaker, and the electric device includes a plug terminal, which is installed at the joint surface thereof and capable of being connected with the plug-in terminal metal fitting. The breaker is detachably joined with the electric device by an engaging member including an engaging unit and an engagement receiving unit. The engaging unit and the engagement receiving unit are installed at the joint surfaces of the breaker and the electric device, respectively, and detachably engaged with each other.

摘要翻译： 插入单元包括与电源侧的母线电连接的断路器和与断路器电连接的电气装置。 分别在断路器和电气装置处形成彼此接触的接合面。 断路器包括一个连接母线的端子金属配件和安装在断路器的接合表面上的插入式端子金属配件，该电气设备包括一个插头端子，该插头端子安装在其接合表面并能连接 带插入式端子金属配件。 断路器通过包括接合单元和接合接收单元的接合构件与电气设备可拆卸地接合。 接合单元和接合接收单元分别安装在断路器和电气设备的接合表面处，并且可拆卸地彼此接合。

公开(公告)号：US5681614A

公开(公告)日：1997-10-28

申请号：US595785

申请日：1996-02-02

申请人： Tsutae Omori ,  Kouji Harada ,  Takami Satoh ,  Noriyuki Anai ,  Masafumi Nomura

发明人： Tsutae Omori ,  Kouji Harada ,  Takami Satoh ,  Noriyuki Anai ,  Masafumi Nomura

IPC分类号： G03F7/16 ,  C23C16/44 ,  C23C16/448 ,  H01L21/027 ,  H01L21/30 ,  C23C16/52

CPC分类号： C23C16/4485 ,  C23C16/4412 ,  Y10S427/101

摘要： An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

摘要翻译： 用于半导体晶片的疏水处理的设备包括其中存储HMDS液体的罐，处理所述晶片的处理室，以及用于将HMDS液体从所述罐供应到所述处理室中的单元，其以任何所需的量 时间。 处理室可以通过排气管连接到处理室的喷射器进行减压。 安装有晶片的安装件布置在处理室中，并且其包括嵌入其中的加热器。 一个环围绕安装座，两个液体接收凹口形成在环的顶部。 两个HMDS液体供应管正好在其相应的液体接收凹槽上方延伸。 液相中的HMDS被供应到处理室中并在其中蒸发。 通过调节供应的HMDS液体的量来控制处理室中的HMDS气体的密度。

公开(公告)号：US5505781A

公开(公告)日：1996-04-09

申请号：US189071

申请日：1994-01-28

申请人： Tsutae Omori ,  Kouji Harada ,  Takami Satoh ,  Noriyuki Anai ,  Masafumi Nomura

发明人： Tsutae Omori ,  Kouji Harada ,  Takami Satoh ,  Noriyuki Anai ,  Masafumi Nomura

IPC分类号： G03F7/16 ,  C23C16/44 ,  C23C16/448 ,  H01L21/027 ,  H01L21/30 ,  C23C16/00

CPC分类号： C23C16/4485 ,  C23C16/4412 ,  Y10S427/101

摘要： An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

摘要翻译： 用于半导体晶片的疏水处理的设备包括其中存储HMDS液体的罐，处理所述晶片的处理室，以及用于将HMDS液体从所述罐供应到所述处理室中的单元，其以任何所需的量 时间。 处理室可以通过排气管连接到处理室的喷射器进行减压。 安装有晶片的安装件布置在处理室中，并且其包括嵌入其中的加热器。 一个环围绕安装座，两个液体接收凹口形成在环的顶部。 两个HMDS液体供应管正好在其相应的液体接收凹槽上方延伸。 液相中的HMDS被供应到处理室中并在其中蒸发。 通过调节供应的HMDS液体的量来控制处理室中的HMDS气体的密度。

公开(公告)号：US5518552A

公开(公告)日：1996-05-21

申请号：US267542

申请日：1994-06-29

申请人： Kouichi Tanoue ,  Shinzi Kitamura ,  Noriyuki Anai ,  Takami Satoh ,  Takayuki Tomoeda ,  Tatsuya Iwasaki ,  Kengo Mizosaki

发明人： Kouichi Tanoue ,  Shinzi Kitamura ,  Noriyuki Anai ,  Takami Satoh ,  Takayuki Tomoeda ,  Tatsuya Iwasaki ,  Kengo Mizosaki

IPC分类号： G02F1/1333 ,  H01L21/00 ,  B08B1/00 ,  B08B3/02 ,  B08B3/12 ,  B08B7/02

CPC分类号： H01L21/67051 ,  G02F1/1333 ,  H01L21/67046

摘要： A substrate scrubbing and cleaning method in which a substrate is carried to a rotatable scrubbing arrangement, and both surfaces of the substrate are scrubbed by the rotatable scrubbing arrangement while the substrate is maintained substantially horizontal. In addition, a cleaning solution is applied to both surfaces of the substrate while the substrate is substantially horizontal and is linearly reciprocated.

摘要翻译： 衬底洗涤和清洁方法，其中衬底被携带到可旋转的擦洗装置，并且衬底的两个表面被基本保持基本水平的可旋转洗涤装置擦洗。 此外，在衬底基本上水平并且被线性往复运动的同时，将清洁溶液施加到衬底的两个表面。

公开(公告)号：US20100128417A1

公开(公告)日：2010-05-27

申请号：US12626031

申请日：2009-11-25

申请人： Kenji Ichinomiya ,  Toshiyuki Kawano ,  Takami Satoh

发明人： Kenji Ichinomiya ,  Toshiyuki Kawano ,  Takami Satoh

IPC分类号： H02B1/04

CPC分类号： H01H71/0271 ,  H01H1/5844 ,  H01H1/5866 ,  H01H71/04 ,  H01H71/08 ,  H01H71/082 ,  H01H89/06 ,  H02B1/20 ,  H02G5/005

摘要： A plug-in unit includes a breaker electrically connected with a busbar at a power supply side and an electric device electrically connected with the breaker. Joint surfaces making contact with each other are formed at the breaker and the electric device, respectively. The breaker includes a terminal metal fitting connecting the busbar thereto and a plug-in terminal metal fitting installed at the joint surface of the breaker, and the electric device includes a plug terminal, which is installed at the joint surface thereof and capable of being connected with the plug-in terminal metal fitting. The breaker is detachably joined with the electric device by an engaging member including an engaging unit and an engagement receiving unit. The engaging unit and the engagement receiving unit are installed at the joint surfaces of the breaker and the electric device, respectively, and detachably engaged with each other.

摘要翻译： 插入单元包括与电源侧的母线电连接的断路器和与断路器电连接的电气装置。 分别在断路器和电气装置处形成彼此接触的接合面。 断路器包括一个连接母线的端子金属配件和安装在断路器的接合表面上的插入式端子金属配件，该电气设备包括一个插头端子，该插头端子安装在其接合表面并能连接 带插入式端子金属配件。 断路器通过包括接合单元和接合接收单元的接合构件与电气设备可拆卸地接合。 接合单元和接合接收单元分别安装在断路器和电气设备的接合表面处，并且可拆卸地彼此接合。

公开(公告)号：US5488964A

公开(公告)日：1996-02-06

申请号：US880068

申请日：1992-05-07

申请人： Shinya Murakami ,  Yuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

发明人： Shinya Murakami ,  Yuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

IPC分类号： B08B3/02 ,  B08B3/04 ,  B08B3/10 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67754 ,  B08B3/02 ,  B08B3/04 ,  B08B3/102 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67757 ,  Y10S134/902

摘要： Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

公开(公告)号：US5345639A

公开(公告)日：1994-09-13

申请号：US69106

申请日：1993-05-28

申请人： Kouichi Tanoue ,  Shinzi Kitamura ,  Noriyuki Anai ,  Takami Satoh ,  Takayuki Tomoeda ,  Tatsuya Iwasaki ,  Kengo Mizosaki

发明人： Kouichi Tanoue ,  Shinzi Kitamura ,  Noriyuki Anai ,  Takami Satoh ,  Takayuki Tomoeda ,  Tatsuya Iwasaki ,  Kengo Mizosaki

IPC分类号： G02F1/1333 ,  H01L21/00 ,  A46B13/04

CPC分类号： H01L21/67051 ,  G02F1/1333 ,  H01L21/67046

摘要： A substrate scrubbing and cleaning device comprising a mechanism having an upper and a lower brush members for scrubbing both surfaces of an LCD glass substrate, a mechanism for rotating the upper and lower brush members, a mechanism for supplying pure water to the upper and lower brush members, a mechanism for carrying the substrate between the upper and the lower brush members to reciprocate it relative to the upper and lower brush members in a substrate carrying direction, and a controller for controlling the operation of the substrate carrying mechanism.

摘要翻译： 一种基板洗涤和清洁装置，包括具有用于洗涤LCD玻璃基板的两个表面的上部和下部刷构件的机构，用于旋转上部和下部刷构件的机构，用于向上部和下部刷子提供纯水的机构 构件，用于在基板传送方向上相对于上刷毛构件和下刷构件在上刷毛构件和下刷构件之间承载衬底往复运动的机构，以及用于控制衬底承载机构的操作的控制器。

公开(公告)号：US5782990A

公开(公告)日：1998-07-21

申请号：US789537

申请日：1997-01-27

申请人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

发明人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

IPC分类号： B08B3/02 ,  B08B3/04 ,  B08B3/10 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67754 ,  B08B3/02 ,  B08B3/04 ,  B08B3/102 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67757 ,  Y10S134/902

摘要： A washing method for washing objects includes the steps of supplying a washing liquid to a washing vessel and immersing objects in the washing liquid contained in the washing vessel. The method also includes the steps of discharging the liquid at least once from the washing vessel, and starting to apply the washing liquid to the objects when the objects are partly exposed to air as the liquid is discharged from the washing vessel. The washing liquid application is continued during exposure of the objects to the air to prevent the surface of the objects from being dried and stained.

摘要翻译： 用于清洗物体的清洗方法包括以下步骤：将洗涤液体供应到洗涤容器中，并将物品浸入容纳在洗涤容器中的洗涤液体中。 该方法还包括以下步骤：从洗涤容器排出至少一次液体，并且当液体从洗涤容器中排出时，当物体部分暴露在空气中时，开始将洗涤液施加到物体上。 在将物体暴露于空气中期间继续洗涤液体的应用，以防止物体的表面被干燥和染色。

公开(公告)号：US5671764A

公开(公告)日：1997-09-30

申请号：US560708

申请日：1995-11-20

申请人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

发明人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

IPC分类号： B08B3/02 ,  B08B3/04 ,  B08B3/10 ,  H01L21/00 ,  H01L21/677 ,  B08B15/00

CPC分类号： H01L21/67754 ,  B08B3/02 ,  B08B3/04 ,  B08B3/102 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67757 ,  Y10S134/902

摘要： Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

摘要翻译： 本文公开了一种洗涤装置，包括洗涤室，打开/关闭机构和喷嘴。 该室具有开口，设计用于清洗从外部通过开口运送的物体。 打开/关闭机构设计成打开和关闭洗涤室的开口。 喷嘴用于清洗打开/关闭机构。 该装置还包括一个填充有洗涤液体的洗涤容器，用于清洗物体，还有一个喷嘴，用于当清洗液体从洗涤液中排出时物体被部分暴露时，将洗涤液施加到位于洗涤容器中的物体上 船只。

公开(公告)号：US5514852A

公开(公告)日：1996-05-07

申请号：US258206

申请日：1994-06-10

申请人： Hideyuki Takamori ,  Takami Satoh

发明人： Hideyuki Takamori ,  Takami Satoh

IPC分类号： B05C9/14 ,  F27D99/00 ,  G03F7/26 ,  H01L21/00 ,  H01L21/027 ,  H01L21/30 ,  H01L21/324 ,  H01L21/683 ,  F27B9/06

CPC分类号： F27D99/0001 ,  H01L21/67103

摘要： A heat treatment device comprises a table of a thermal conductor located in a housing carrying an object of treatment thereon, and a treatment heat source located in the housing and by the table so that a bottom face of the table is opposite to a top face of the heat source, whereby the object of treatment in heat-treated through the table. An annular groove is formed in the top face of the heat source and evacuated so that the substrate and heat source are securely attached thereby increasing the heat conduction between them.

摘要翻译： 一种热处理装置，其特征在于，包括位于外壳上的热导体的工作台，所述热导体位于所述壳体内的处理对象上，处理热源位于所述壳体和所述工作台中，使得所述工作台的底面与 热源，从而通过桌子进行热处理的处理对象。 在热源的顶面上形成环形槽，并将其排出，从而使基板和热源牢固地连接，从而增加它们之间的热传导。