Method of transferring a thin crystalline semiconductor layer
    3.
    发明申请
    Method of transferring a thin crystalline semiconductor layer 审中-公开
    转移薄晶体半导体层的方法

    公开(公告)号:US20060270190A1

    公开(公告)日:2006-11-30

    申请号:US11137979

    申请日:2005-05-25

    IPC分类号: H01L21/30

    CPC分类号: H01L21/76254

    摘要: A method for transferring a monocrystalline, thin layer from a first substrate onto a second substrate involves deposition of a doped semiconductor layer on a substrate and epitaxial growth of a thin, monocrystalline, semiconductor layer on the doped layer. After bonding the thin epitaxial monocrystalline semiconductor layer to a second substrate, hydrogen is introduced into the doped layer, and the thin layer is cleaved and transferred to the second substrate, with the cleaving controlled to happen at the doped layer.

    摘要翻译: 将单晶薄层从第一衬底转移到第二衬底上的方法包括在衬底上沉积掺杂半导体层,并在掺杂层上沉积薄的单晶半导体层。 在将薄的外延单晶半导体层接合到第二衬底之后,将氢引入到掺杂层中,并且薄层被切割并转移到第二衬底,其中解理被控制在掺杂层发生。