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公开(公告)号：US08110652B2
公开(公告)日：2012-02-07
申请号：US12374110
申请日：2007-07-17
申请人： Tsuyoshi Bito , Shuta Kihara , Jitsuo Oishi
发明人： Tsuyoshi Bito , Shuta Kihara , Jitsuo Oishi
IPC分类号： C08G73/10 , C09J179/08 , B29C41/12 , H05K1/03
CPC分类号： C08G73/1053 , B32B7/12 , B32B15/08 , B32B2255/06 , B32B2307/748 , B32B2457/00 , C08G73/1042 , C08G73/1071 , C09J179/08 , H05K1/0346 , H05K3/386 , H05K2201/0154 , Y10T428/31681
摘要： A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided.The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.
摘要翻译： 可溶于有机溶剂并具有低吸水系数，热固性，高耐热性和优异粘合性的聚酰亚胺树脂，其制造方法，粘合剂和各自含有聚酰亚胺树脂的薄膜和 提供了包含由聚酰亚胺树脂构成的粘合剂层的覆金属层压板。 聚酰亚胺树脂是含有下述式（1）表示的重复单元和下述式（2）表示的重复单元的聚酰亚胺树脂，下述式（3）表示的基团的比例为50质量％ 摩尔或更多的整个X.
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公开(公告)号：US20090291259A1
公开(公告)日：2009-11-26
申请号：US12307784
申请日：2007-07-05
申请人： Tsuyoshi Bito , Shuta Kihara , Jitsuo Oishi
发明人： Tsuyoshi Bito , Shuta Kihara , Jitsuo Oishi
CPC分类号： C08G73/1042 , B32B7/12 , B32B15/08 , B32B27/281 , B32B2457/08 , C09J179/08 , H05K1/0346 , H05K3/386 , Y10T428/24355 , Y10T428/31681
摘要： A polyimide resin which is satisfactory in solvent solubility and heat resistance, has a low coefficient of water absorption and is excellent in adhesive properties and a method for manufacturing the same, a film containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided.The polyimide resin is a polyimide resin containing a molecule having a repeating unit represented by a structure of any one of the following formulae (1) to (3) in a specified proportion, whose molecular end is capped by an end-capping agent.
摘要翻译： 溶剂溶解性和耐热性良好的聚酰亚胺树脂的吸水系数低，粘合性优异的方法及其制造方法，含有聚酰亚胺树脂的薄膜和包含粘合剂的覆金属层压板 提供由聚酰亚胺树脂构成的层。 聚酰亚胺树脂是分子末端被封端剂封端的含有具有由下述通式（1）〜（3）中任一项所示结构所表示的重复单元的特定比例的分子的聚酰亚胺树脂。
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公开(公告)号：US20090068482A1
公开(公告)日：2009-03-12
申请号：US11814499
申请日：2006-01-20
申请人： Tsuyoshi Bito , Shuta Kihara , Jitsuo Oishi
发明人： Tsuyoshi Bito , Shuta Kihara , Jitsuo Oishi
CPC分类号： H05K3/386 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/5825 , B32B2457/08 , C08G73/1007 , C08G73/1021 , C08G73/1028 , C08G73/1042 , C08G73/1046 , C08G73/105 , C09J179/08 , H05K2201/0154 , H05K2201/0355 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide resin composed of a repeating unit represented by the following formula (1): or composed of the repeating unit represented by the formula (1) and at least one repeating unit represented by the following formula (2): wherein X is the same as defined in the specification, exhibits a good thermoplastic property, a high solubility in solvents and a good heat resistance as well as a low water absorption and an excellent adhesion property. The polyimide resin is useful as the material for the adhesive layer of a metal-clad laminate which is composed of an insulating substrate, a metal layer and an adhesive layer disposed between the insulating substrate and the metal layer.
摘要翻译： 由下式（1）表示的重复单元构成的聚酰亚胺树脂或由式（1）表示的重复单元和由下式（2）表示的至少一个重复单元构成的聚酰亚胺树脂：其中X相同 表现出良好的热塑性，在溶剂中的高溶解性和良好的耐热性以及低吸水性和优异的粘合性。 聚酰亚胺树脂可用作由绝缘基板，金属层和设置在绝缘基板和金属层之间的粘合剂层构成的覆金属层压板的粘合剂层的材料。
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公开(公告)号：US20080132667A1
公开(公告)日：2008-06-05
申请号：US11722190
申请日：2005-12-19
申请人： Takashi Makinoshima , Shuta Kihara
发明人： Takashi Makinoshima , Shuta Kihara
CPC分类号： C08G18/3846 , C08G18/346 , C08G18/765 , C08G73/10 , C08G2190/00 , Y10T428/10 , Y10T428/1023 , Y10T428/1091
摘要： A polyimide resin is produced by the reaction of a compound selected from 1,2,4,5-cyclohexanetetracarboxylic acid, dianhydride thereof and reactive derivatives thereof and a compound selected from diamines and diisocyanates each containing at least one phenylene group and at least one isopropylidene group. The polyimide resin is colorless and exhibits a high heat resistance, a high transparency and a low water absorption.
摘要翻译： 通过使选自1,2,4,5-环己烷四羧酸，其二酐和其活性衍生物的化合物与选自二胺和二异氰酸酯的化合物反应制备聚酰亚胺树脂，其各自含有至少一个亚苯基和至少一个异亚丙基 组。 聚酰亚胺树脂是无色的，具有高耐热性，高透明性和低吸水性。
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公开(公告)号：US07217462B2
公开(公告)日：2007-05-15
申请号：US10841432
申请日：2004-05-10
申请人： Shuta Kihara , Ko Kedo
发明人： Shuta Kihara , Ko Kedo
IPC分类号： B32B15/08
CPC分类号： B32B27/281 , B32B7/12 , B32B15/08 , B32B27/34 , H05K3/386 , H05K2201/0154 , H05K2203/0759 , Y10S428/901 , Y10T428/31681 , Y10T428/31721
摘要： The metal foil-clad laminate of the present invention comprises at least one polyimide layer made of a polyimide having repeating units represented by the following formula I: wherein R and Φ are as defined in the specification, at least one insulating substrate, and at least one metal foil layer. The polyimide is excellent in thermopress-bonding property, solubility in solvents and heat resistance, and exhibits a low dielectric constant. The metal foil-clad laminate having the polyimide layer is suitably applicable to high-frequency printed wiring boards, etc.
摘要翻译： 本发明的覆金属箔的层压体包含至少一层由聚酰亚胺构成的聚酰亚胺层，该聚酰亚胺具有由下式I表示的重复单元：其中R和Phi如说明书中所定义，至少一个绝缘基材，至少 一个金属箔层。 聚酰亚胺具有优异的耐热粘合性，在溶剂中的溶解性和耐热性，并且表现出低的介电常数。 具有聚酰亚胺层的金属箔覆层压板适用于高频印刷线路板等
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公开(公告)号：US06962756B2
公开(公告)日：2005-11-08
申请号：US10284370
申请日：2002-10-31
申请人： Shuta Kihara , Hiroki Oguro , Ko Kedo
发明人： Shuta Kihara , Hiroki Oguro , Ko Kedo
CPC分类号： C08G73/10 , G02F1/13439 , H01L51/5206 , H01L51/5237 , Y10T428/1023 , Y10T428/31504 , Y10T428/31721
摘要： A transparent electrically-conductive film comprising a substrate made of an aliphatic polyimide having a repeating unit of the formula [I] and a transparent electrically-conductive thin film layer, the transparent electrically-conductive thin film layer being provided on the substrate, wherein R is a tetravalent aliphatic group having 4 to 39 carbon atoms and Φ is a divalent aliphatic group having 1 to 39 carbon atoms or a divalent aromatic group having 6 to 39 carbon atoms; an organic EL element using the above film; a thin-film transistor substrate comprising a substrate formed of a film of a polyimide having a repeating unit of the formula [I] and, provided thereon, a thin-film transistor; and an organic EL element using the above transistor substrate.
摘要翻译： 一种透明导电膜，其包含由具有式[I]的重复单元的脂族聚酰亚胺和透明导电薄膜层构成的基板，所述透明导电薄膜层设置在所述基板上，其中R 是具有4〜39个碳原子的四价脂肪族基团，Phi是碳原子数1〜39的2价脂肪族基团或碳原子数6〜39的2价芳香族基团。 使用上述膜的有机EL元件; 薄膜晶体管基板，包括由具有式[I]的重复单元的聚酰亚胺膜形成的基板，并且在其上设置有薄膜晶体管; 以及使用上述晶体管基板的有机EL元件。
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公开(公告)号：US08293371B2
公开(公告)日：2012-10-23
申请号：US11814499
申请日：2006-01-20
申请人： Tsuyoshi Bito , Shuta Kihara , Jitsuo Oishi
发明人： Tsuyoshi Bito , Shuta Kihara , Jitsuo Oishi
CPC分类号： H05K3/386 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/5825 , B32B2457/08 , C08G73/1007 , C08G73/1021 , C08G73/1028 , C08G73/1042 , C08G73/1046 , C08G73/105 , C09J179/08 , H05K2201/0154 , H05K2201/0355 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide resin composed of a repeating unit represented by the following formula (1): or composed of the repeating unit represented by the formula (1) and at least one repeating unit represented by the following formula (2): wherein X is the same as defined in the specification, exhibits a good thermoplastic property, a high solubility in solvents and a good heat resistance as well as a low water absorption and an excellent adhesion property. The polyimide resin is useful as the material for the adhesive layer of a metal-clad laminate which is composed of an insulating substrate, a metal layer and an adhesive layer disposed between the insulating substrate and the metal layer.
摘要翻译： 由下式（1）表示的重复单元构成的聚酰亚胺树脂或由式（1）表示的重复单元和由下式（2）表示的至少一个重复单元构成的聚酰亚胺树脂：其中X相同 表现出良好的热塑性，在溶剂中的高溶解性和良好的耐热性以及低吸水性和优异的粘合性。 聚酰亚胺树脂可用作由绝缘基板，金属层和设置在绝缘基板和金属层之间的粘合剂层构成的覆金属层压板的粘合剂层的材料。
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公开(公告)号：US07858199B2
公开(公告)日：2010-12-28
申请号：US10839282
申请日：2004-05-06
申请人： Shuta Kihara , Ko Kedo
发明人： Shuta Kihara , Ko Kedo
CPC分类号： H05K1/0346 , Y10S428/901 , Y10T428/31681 , Y10T428/31721 , Y10T428/31855
摘要： The flexible metal-clad laminate of the present invention comprises at least one polyimide layer made of a polyimide having repeating units represented by the following formula I: wherein R and Φ are as defined in the specification, and at least one metal layer. The polyimide is soluble in solvents and excellent in heat resistance and adhesion property, and shows a low dielectric constant even in a high frequency range.
摘要翻译： 本发明的柔性覆金属层压板包括至少一个由聚酰亚胺制成的聚酰亚胺层，该聚酰亚胺具有由下式I表示的重复单元：其中R和Φ如说明书中所定义，和至少一个金属层。 聚酰亚胺可溶于溶剂，耐热性和粘合性优异，即使在高频范围内也显示出低的介电常数。
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公开(公告)号：US20090306306A1
公开(公告)日：2009-12-10
申请号：US12297518
申请日：2007-04-17
申请人： Masahito Ohkido , Wataru Ueno , Jitsuo Oishi , Shuta Kihara
发明人： Masahito Ohkido , Wataru Ueno , Jitsuo Oishi , Shuta Kihara
IPC分类号： C08G63/91
CPC分类号： C08G73/1007 , C08G73/1028 , C08G73/12 , C08K5/3415 , C08L79/08
摘要： Disclosed is a highly heat-resistant thermosetting polyimide resin composition having long pot life, which enables to obtain a cured product having flexibility and adhesiveness. The thermosetting polyimide resin composition can be obtained through the following steps (1)-(3). Step (1): A step wherein a polyimide (A) is synthesized by a thermal reaction by blending a tetracarboxylic acid component, which is composed of a tetracarboxylic acid dianhydride represented by the formula (1) and one or more compounds selected from tetracarboxylic acids represented by the formula (2) and derivatives of such tetracarboxylic acids, with an aliphatic diamine represented by the formula (3) in such a ratio that the mole number of the tetracarboxylic acid component is higher than the mole number of the aliphatic diamine. Step (2): A step wherein a polyimide (B) is synthesized by a thermal reaction by blending the polyimide (A) obtained in the step (1) with an aromatic diamine represented by the formula (4). Step (3): A step wherein the polyimide (B) obtained in the step (2) is blended and mixed with a bismaleimide compound represented by the formula (5).
摘要翻译： 公开了一种具有长使用期的高耐热性热固性聚酰亚胺树脂组合物，其能够获得具有柔软性和粘合性的固化产物。 热固性聚酰亚胺树脂组合物可以通过以下步骤（1） - （3）获得。 步骤（1）：通过将由式（1）表示的四羧酸二酐和选自四羧酸的一种或多种化合物组成的四羧酸组分，通过热反应合成聚酰亚胺（A） 由式（2）表示的这些四羧酸的衍生物和这样的四羧酸的衍生物与由式（3）表示的脂肪族二胺的比例使得四羧酸成分的摩尔数高于脂肪族二胺的摩尔数。 工序（2）：通过将由工序（1）得到的聚酰亚胺（A）与式（4）所示的芳香族二胺混合而通过热反应合成聚酰亚胺（B）的工序。 步骤（3）：将步骤（2）中得到的聚酰亚胺（B）与由式（5）表示的双马来酰亚胺化合物混合并混合的步骤。
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公开(公告)号：US06861147B2
公开(公告)日：2005-03-01
申请号：US10408130
申请日：2003-04-08
申请人： Takaaki Kutsuna , Shuta Kihara
发明人： Takaaki Kutsuna , Shuta Kihara
CPC分类号： C08J7/045 , C08G59/52 , Y10T428/266 , Y10T428/31511 , Y10T428/31515 , Y10T428/31518 , Y10T428/31522 , Y10T428/31525 , Y10T428/31529
摘要： Provided is a gas barrier film in which in coating or laminating a single layer film or a multiplayer film comprising at least one (a) thermoplastic resin layer on which an inorganic compound is vapor deposited or (b) layer comprising metal foil, wherein 40% by weight or more of a skeletal structure represented by the following Formula (1) is contained in an epoxy resin-cured product formed from an epoxy resin composition comprising an epoxy resin and an epoxy resin curing agent as principal components. The above gas barrier film has a toughness and a high gas barrier property brought about by the above epoxy resin composition used for adhering or coating on various film materials in addition to a suitable adhesive performance to various film materials, so that it is a gas barrier film which does not cause a marked reduction in a gas barrier property brought about by treatment such as bending in mold-processing of the film and which is excellent in a flexibility
摘要翻译： 本发明提供一种阻气膜，其中在涂覆或层压单层膜或多层膜的方法中，所述单层膜或多层膜包含至少一种（a）气相沉积无机化合物的热塑性树脂层或（b）包含金属箔的层，其中40％ 由下述通式（1）所示的骨架结构体包含在由环氧树脂和环氧树脂固化剂作为主要成分的环氧树脂组合物形成的环氧树脂固化物中。 除了对各种膜材料的合适的粘合性能之外，上述阻气膜还具有由用于粘附或涂布在各种膜材料上的上述环氧树脂组合物带来的韧性和高气体阻隔性，因此它是阻气性 膜不会导致膜的模具加工中的弯曲等处理引起的阻气性显着降低，柔软性优异
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