公开(公告)号：US07833897B2

公开(公告)日：2010-11-16

申请号：US11778678

申请日：2007-07-17

Applicant: Sarah H. Knickerbocker ,  Sean A. Allen ,  John J. Garant ,  Jerry A. Gorrell ,  Phillip W Palmatier ,  Christopher L Tessler

Inventor： Sarah H. Knickerbocker ,  Sean A. Allen ,  John J. Garant ,  Jerry A. Gorrell ,  Phillip W Palmatier ,  Christopher L Tessler

IPC: H01L21/44 ,  H01L21/00 ,  B23K31/00 ,  B23K31/02

CPC classification number: B23K3/0623 ,  B23K2101/40

Abstract: A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads.

Abstract translation: 提供了一种用于在晶片或其他电子器件上制造互连焊料凸块的方法，而不会将任何显着量的锡或其他焊料组分从焊料沉积到晶片表面上，锡可能导致晶片中的短路或其它缺陷。 该方法对于众所周知的C4NP互连技术特别有用。 在本发明的一个方面，使用还原气体流速从焊料表面和晶片焊盘表面去除氧化物，并且具有足够的确定或预定的流动和/或室或模具/晶片间距以提供气体速度 穿过焊料表面和晶片焊盘表面，使得Sn或其他污染物在焊料传输期间不会沉积在晶片表面上。 在另一方面，转移接触在焊料的熔点之下进行，随后在转移接触的同时被加热至高于熔融温度。 与晶片焊盘接触的加热焊料被转移到晶片焊盘。

公开(公告)号：US20080210068A1

公开(公告)日：2008-09-04

申请号：US12019350

申请日：2008-01-24

Applicant: Michael J. Weiss ,  Sean A. Allen ,  Vladimir Jambrih

Inventor： Michael J. Weiss ,  Sean A. Allen ,  Vladimir Jambrih

IPC: B26D1/00 ,  B26D5/00

CPC classification number: B26D3/10 ,  B26D1/0006 ,  B26D7/2614 ,  B26D2001/006 ,  B26F1/22 ,  B26F1/44 ,  Y10T83/04 ,  Y10T83/051 ,  Y10T83/2146 ,  Y10T83/8878

Abstract: A modular cassette cutter design with a unique blade retention system for making multiple, simultaneous cuts in elongated strip material. The blades are retained so that they can be individually replaced. The blade hardware is made accessible from one side of the tool for easy replacement. The cassette modules lend themselves for easy accommodation to different types of gasket material and shapes. The cassette module cutters are easily interchangeable to make end cuts or corner cuts, and may be combined in a single press to make different cuts simultaneously. Prefabricated gaskets may be cut using data from linear measurements of cover designs.

Abstract translation: 一种具有独特刀片保持系统的模块化盒式刀具设计，用于同时切割细长带材。 刀片被保留，以便可以单独更换刀片。 刀片硬件可从刀具的一侧进入，以方便更换。 盒式模块本身可以容易地适应不同类型的垫圈材料和形状。 盒式模块切割器可以容易地互换，以便进行切割或角切割，并且可以在单个压榨机中组合以同时进行不同切割。 可以使用来自封面设计的线性测量的数据来切割预制垫片。

公开(公告)号：US20090020590A1

公开(公告)日：2009-01-22

申请号：US11778678

申请日：2007-07-17

Applicant: Sarah H. Knickerbocker ,  Sean A. Allen ,  John J. Garant ,  Jerry A. Gorrell ,  Phillip W Palmatier ,  Christopher L. Tessler

Inventor： Sarah H. Knickerbocker ,  Sean A. Allen ,  John J. Garant ,  Jerry A. Gorrell ,  Phillip W Palmatier ,  Christopher L. Tessler

IPC: B23K31/02

CPC classification number: B23K3/0623 ,  B23K2101/40

Abstract: A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads.

Abstract translation: 提供了一种用于在晶片或其他电子器件上制造互连焊料凸块的方法，而不会将任何显着量的锡或其他焊料组分从焊料沉积到晶片表面上，锡可能导致晶片中的短路或其它缺陷。 该方法对于众所周知的C4NP互连技术特别有用。 在本发明的一个方面，使用还原气体流速从焊料表面和晶片焊盘表面去除氧化物，并且具有足够的确定或预定的流动和/或室或模具/晶片间距以提供气体速度 穿过焊料表面和晶片焊盘表面，使得Sn或其他污染物在焊料传输期间不会沉积在晶片表面上。 在另一方面，转移接触在焊料的熔点之下进行，随后在转移接触的同时被加热至高于熔融温度。 与晶片焊盘接触的加热焊料被转移到晶片焊盘。

公开(公告)号：US5667516A

公开(公告)日：1997-09-16

申请号：US432218

申请日：1995-05-01

Applicant: Sean A. Allen

Inventor： Sean A. Allen

IPC: A61B17/122 ,  A61B17/32 ,  A61B17/42

CPC classification number: A61B17/122 ,  A61B17/32 ,  A61B17/42 ,  A61B2017/1225

Abstract: A disposal device for clamping, cutting and taking blood samples from an unbilical cord of a newly born infant. When the device is closed around an umbilical cord the cord is compressed and two separate pairs of clamping jaws are locked onto the cord. Further compression of the device severs the cord between two clamps and ejects the clamp which retains the infant's end of the unbilical cord. The jaws holding the mother's end of the cord can be opened enough to allow blood samples to be taken while still holding the cord firmly. The present invention comprises a double jaw clamping mechanism which incorporates a releasable locking means, a double jaw fetal end cord clamp which separates from the body of the device and remains locked to the fetal end of the cord, and a hinged holder containing a blade for severing the cord.

Abstract translation: 用于从新出生的婴儿的非生物线夹紧，切割和取血样品的处置装置。 当设备围绕脐带关闭时，电缆被压缩，并且两个分开的夹钳夹在电线上。 该装置的进一步的压缩将两根夹子之间的绳索切断，并弹出保持该非接触绳索的婴儿端的夹具。 保持母亲的绳索末端的钳口可以打开足够的，以便在仍然牢固地握住绳索的同时拍摄血液样本。 本发明包括一个双爪夹紧机构，其包括一个可释放的锁定装置，一个从该装置的主体分离并保持锁定到该绳索的胎端的双钳口胎端帘线夹，以及一个铰链保持架， 切断电线。