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公开(公告)号:US09819327B2
公开(公告)日:2017-11-14
申请号:US14398049
申请日:2013-06-26
申请人: Saravana Maruthamuthu , Thorsten Meyer , Pablo Herrero , Andreas Wolter , Georg Seidemann , Mikael Knudsen , Pauli Jaervinen
发明人: Saravana Maruthamuthu , Thorsten Meyer , Pablo Herrero , Andreas Wolter , Georg Seidemann , Mikael Knudsen , Pauli Jaervinen
CPC分类号: H03H9/0014 , H01Q5/335 , H03H7/40 , H04B1/0458
摘要: Techniques and configurations are disclosed for bulk acoustic wave resonator (BAWR) tuner circuits and their use in integrated circuit (IC) packages and mobile communication devices for radio frequency (RF) communication. In some embodiments, a mobile communication device may include an antenna; a transmitter circuit having an output port, a tuner circuit having one or more BAWRs, an antenna port coupled to the antenna, a transmitter port coupled to the output port of the transmitter circuit, and a control port; and a control circuit, coupled to the control port, configured to adjust an impedance of the tuner circuit, via adjustment of a BAWR or another component of the tuner circuit, based at least in part on an impedance of the antenna. Other embodiments may be described and/or claimed.
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公开(公告)号:US20190272950A1
公开(公告)日:2019-09-05
申请号:US15910820
申请日:2018-03-02
IPC分类号: H01F27/40 , H01F27/28 , H01G4/30 , H01G4/005 , H01G4/40 , H01F41/04 , H01L23/522 , H01L23/528
摘要: A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.
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公开(公告)号:US20190252792A1
公开(公告)日:2019-08-15
申请号:US15892632
申请日:2018-02-09
IPC分类号: H01Q19/06 , H01Q1/48 , H01Q15/08 , H01L23/66 , H01L23/528 , H01L23/498 , H01L23/522 , H01L23/00 , H01L21/56 , H01L21/3205 , H01L21/48 , H01L21/768 , H01L23/13
CPC分类号: H01Q19/06 , H01L21/32051 , H01L21/4846 , H01L21/56 , H01L21/76802 , H01L21/76877 , H01L23/13 , H01L23/49838 , H01L23/5226 , H01L23/528 , H01L23/66 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2223/6616 , H01L2223/6677 , H01L2224/0401 , H01L2224/0557 , H01L2224/16227 , H01L2224/81801 , H01L2924/142 , H01Q1/48 , H01Q15/08
摘要: Some embodiments include packages and methods of making the packages. One of the packages includes a ground layer (e.g., a ground plane) of metal formed over a chip of die, an antenna element of metal formed over the ground layer, and a dielectric lens formed over the antenna element. The dielectric lens includes a plurality of dielectric layers that have graded dielectric constants in a decreasing order along a direction from the antenna element toward a top surface of the package.
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公开(公告)号:US20150333401A1
公开(公告)日:2015-11-19
申请号:US14398049
申请日:2013-06-26
申请人: Saravana MARUTHAMUTHU , Thorsten MEYER , Pablo HERRERO , Andreas WOLTER , Georg SEIDEMANN , Mikael KNUDSEN , Pauli JAERVINEN
发明人: Saravana Maruthamuthu , Thorsten Meyer , Pablo Herrero , Andreas Wolter , Georg Seidemann , Mikael Knudsen , Pauli Jaervinen
IPC分类号: H01Q5/335
CPC分类号: H03H9/0014 , H01Q5/335 , H03H7/40 , H04B1/0458
摘要: Techniques and configurations are disclosed for bulk acoustic wave resonator (BAWR) tuner circuits and their use in integrated circuit (IC) packages and mobile communication devices for radio frequency (RF) communication. In some embodiments, a mobile communication device may include an antenna; a transmitter circuit having an output port, a tuner circuit having one or more BAWRs, an antenna port coupled to the antenna, a transmitter port coupled to the output port of the transmitter circuit, and a control port; and a control circuit, coupled to the control port, configured to adjust an impedance of the tuner circuit, via adjustment of a BAWR or another component of the tuner circuit, based at least in part on an impedance of the antenna. Other embodiments may be described and/or claimed.
摘要翻译: 公开了用于体声波谐振器(BAWR)调谐器电路及其在集成电路(IC)封装中的使用和用于射频(RF)通信的移动通信设备的技术和配置。 在一些实施例中,移动通信设备可以包括天线; 具有输出端口的发射机电路,具有一个或多个BAWR的调谐器电路,耦合到天线的天线端口,耦合到发射机电路的输出端口的发射机端口和控制端口; 以及耦合到控制端口的控制电路,其被配置为至少部分地基于天线的阻抗来调节调谐器电路的阻抗,经由调谐调谐器电路的BAWR或另一部件。 可以描述和/或要求保护其他实施例。
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