摘要:
Structures for 3D sense amplifiers for 3D memories are disclosed. A first embodiment uses one type of vertical transistors in constructing 3D sense amplifiers. A second embodiment uses both n- and p-type transistors for 3D sense amplifiers. Either or both of n- and p-type transistors are vertical transistors. The n- and p-type transistors may reside on different levels, or on the same level above a substrate if both are vertical transistors. In any embodiment, different options are available for gate contact formation. In any embodiments and options or alternatives thereof, one or more sense-enable circuits may be used. Sense amplifiers for several bit lines may be staggered on one or both sides of a memory array. Column multiplexers may be used to couple particular bit lines to data outputs. Bit-line multiplexers may be used to couple certain bit lines to shared 3D sense amplifiers.
摘要:
The invention involves a method of manufacturing a bonded semiconductor structure, comprising providing a support substrate which carries a transistor, and providing an interconnect region earned by the support substrate. The interconnect region includes a first multiple bypass bitline having an upper bypass interconnect and upper bypass via. The method includes providing a first conductive bonding layer carried by the interconnect region, wherein the first conductive bonding layer is connected to the upper bypass interconnect through the upper bypass via, and providing a vertical transistor carried by the first conductive bonding layer, the vertical transistor being in communication with the transistor through the interconnect region. The first multiple bypass bitline reduces the impedance experienced by the vertical transistor.
摘要:
A method for fabricating semiconductor memory device, includes providing a semiconductor substrate; forming a lower region which includes a first data storage device, which is carried by the semiconductor substrate; forming a switching device which is carried by the first data storage device; and forming an upper region which includes a second data storage device, which is carried by the switching device. The step of forming the first storage device includes forming a first electrode having a cylindrical or pillar shape, the first electrode being connected to the switching device.
摘要:
The present invention is to provide individual and payment information to a service server by recognizing whether the service server is to be trusted when individual identification information provided by a user is received from the service server. So, the invention provides an authentication method of the service server and a payment method by using the same, which can prevent the individual identification information and payment from being accessed by a distrusted server in wireless Internet. This present comprises acts of: storing individual identification information provided from a user in an authentication server; authenticating the service server when request of the stored individual identification information is received from the service server, and transmitting the stored individual identification information to the service server when the authentication has succeeded; transmitting a message of requesting a service access to a mobile terminal of the user from the service server; and transmitting the individual identification information sent from the authentication server to the mobile terminal by means of a transmitting query of the individual identification information from the mobile terminal.
摘要:
An apparatus includes a semiconductor chip with a base support structure having a surface and an opposed surface. At least one device structure extends from the surface of the base support structure. A first conductive region is coupled to the base support structure. At least a portion of the first conductive region extends below the opposed surface.
摘要:
An information storage system includes a bonded semiconductor structure having a memory circuit region carried by an interconnect region. The memory circuit region includes a memory control device region having a vertically oriented memory control device. The memory circuit region includes a memory device region in communication with the memory control device region. The memory device region includes a memory device whose operation is controlled by the vertically oriented memory control device.
摘要:
The present invention relates to a method of performing handover from an asynchronous mobile communication network to a synchronous mobile communication network. If the access network of the asynchronous mobile communication network (100) requests handover to an MSC (104) of the asynchronous mobile communication network, the MSC requests/receives subscriber information of the mobile communication terminal from a dual-stack HLR (300), and transmits a handover request message to the synchronous mobile communication network (200). The MSC (203) of the synchronous mobile communication network assigns a forward channel to the mobile communication terminal. The asynchronous mobile communication network (100) transmits a handover instruction message to the asynchronous RF device of the mobile communication terminal. Accordingly, the mobile communication terminal sets up a synchronous RF device, connects to the synchronous mobile communication network through reverse channel assignment and synchronization. The mobile communication terminal transmits a handover completion message to the synchronous mobile communication network.
摘要:
A semiconductor memory device includes a substrate and an interconnect region carried by the substrate. A donor layer is coupled to the interconnect region through a bonding interface. An electronic device is formed with the donor layer, wherein the electronic device is formed after the bonding interface is formed. A capacitor is connected to the electronic device so that the electronic device and capacitor operate as a dynamic random access memory device.
摘要:
Disclosed is a tray handling apparatus in which the conveyance and inversion of a tray can be performed simultaneously to thereby achieve a rapid inspecting operation and a simplified apparatus configuration, and a semiconductor device inspecting method using the tray handling apparatus. The tray handling apparatus includes an inverting unit to turn the tray, in which objects are received, upside down, and a transfer device to convey the object receiving tray from one conveyor to another conveyor while being reciprocally moved above a body of the apparatus. The inverting unit is integrally provided at a lower end of the transfer device, to allow the conveyance and inversion of the tray to be performed simultaneously.
摘要:
A voice message transmission system and method which includes a sending terminal (MS) for registering a voice message and for receiving a notice of a message regarding the registered voice information; a base station controller (BSC) carrying out a call connection of the mobile communication network in response to a request for registering the voice message of the sending terminal (MS) received from a plurality of base stations(BTS); a mobile switching station (MSC/VLR) for carrying out a channel management and control connected from the base station controller (BSC) and carrying out a signal processing function according to the call connection; and an IP server interlocked with the mobile switching station (MSC/VLR), storing the voice message and outdialing on the basis of sender information, and then reproducing and outputting the voice message to the receiving terminal in the case that a receiving signal of the receiving terminal is recognized wherein the IP server includes a voice mailbox server (VMS) and a voice message management server for generating receiving information corresponding to a message identification of the receiving terminal.