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公开(公告)号：US08763885B2
公开(公告)日：2014-07-01
申请号：US13978727
申请日：2011-12-06
Applicant: Sebastian Piegert , Peter Randelzhofer , Robert Singer
Inventor： Sebastian Piegert , Peter Randelzhofer , Robert Singer
CPC classification number: B23K35/3046 , C22C19/07
Abstract: Cobalt-based solder alloys are proposed. The cobalt-based solder alloys have germanium. The germanium has a higher melting point than nickel-based alloys such that the germanium is used advantageously for repairing or treating components having the nickel-based alloys used at high temperatures. The components are repaired or treated by soldering using the cobalt-based solder alloys.
Abstract translation: 提出了钴基焊料合金。 钴基焊料合金具有锗。 锗具有比镍基合金更高的熔点，使得锗有利地用于修复或处理在高温下使用的镍基合金的组分。 通过使用钴基焊料合金进行焊接修复或处理部件。
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公开(公告)号：US08613885B2
公开(公告)日：2013-12-24
申请号：US12531189
申请日：2008-02-26
Applicant: Paul Heinz , Robert Singer
Inventor： Paul Heinz , Robert Singer
CPC classification number: B23K35/3033 , B23K2101/001 , C22C19/007
Abstract: Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The invention relates to a solder ally that comprises gallium and/or germanium, preferably forms the Y′ phase and has improved mechanical properties.
Abstract translation: 根据现有技术的许多已知的焊料合金利用硅或硼作为熔点减少剂，然而其形成对热机械性能具有不良影响的脆性相。 本发明涉及包含镓和/或锗的焊料，优选形成Y'相并具有改善的机械性能。
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3.发明授权Repair soldering method for repairing a component which comprises a base material with an oriented microstructure 失效用于修复包括具有取向微结构的基材的部件的修补焊接方法公开(公告)号：US07967183B2
公开(公告)日：2011-06-28
申请号：US10588024
申请日：2005-01-28
Applicant: Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
Inventor： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
IPC: B23K31/02
CPC classification number: F01D5/005 , B23K1/0008 , B23K1/0018 , B23K1/002 , B23K1/005 , B23K2101/001 , B23P6/007
Abstract: The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.
Abstract translation: 本发明涉及一种用于修复包括具有定向微结构的基材的部件的方法，其中所述修复点包括相应定向的微结构作为周围的基材。 根据本发明的方法，焊料被施加在要修复的点的区域中，并且通过由器件产生的加热效应被焊接到部件上。 在加热效果期间产生温度梯度，即近似温度特性，所述温度特性在要修复的点的区域中从高温到低温。
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4.发明授权Method for the soldering repair of a component in a vacuum and an adjusted partial oxygen pressure 失效用于真空中的组分的焊接修复和调节的部分氧气压力的方法公开(公告)号：US07874473B2
公开(公告)日：2011-01-25
申请号：US12529707
申请日：2008-02-15
Applicant: Paul Heinz , Robert Singer
Inventor： Paul Heinz , Robert Singer
CPC classification number: B23K1/0018 , B23K1/008 , B23K1/206 , B23K35/30 , B23K35/304 , B23K2101/001 , C22C19/05 , C22C19/057 , F01D5/005 , F05D2230/238 , Y02T50/67 , Y10T29/49318
Abstract: A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.
Abstract translation: 公开了一种通过焊料修复部件的方法。 该方法在特定选择的真空条件下进行，以防止氧化和蒸发。
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5.发明申请公开(公告)号：US20100108745A1
公开(公告)日：2010-05-06
申请号：US12529707
申请日：2008-02-15
Applicant: Paul Heinz , Robert Singer
Inventor： Paul Heinz , Robert Singer
IPC: B23K31/02
CPC classification number: B23K1/0018 , B23K1/008 , B23K1/206 , B23K35/30 , B23K35/304 , B23K2101/001 , C22C19/05 , C22C19/057 , F01D5/005 , F05D2230/238 , Y02T50/67 , Y10T29/49318
Abstract: A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.
Abstract translation: 公开了一种通过焊料修复部件的方法。 该方法在特定选择的真空条件下进行，以防止氧化和蒸发。
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Patent Agency Ranking
6.发明申请Process for Repairing a Component Comprising a Directional Microstructure by Setting a Temperature Gradient During the Laser Heat Action, and a Component Produced by Such a Process 失效通过在激光热作用期间设定温度梯度来修复包含定向微结构的组分的方法和由这种方法产生的组分公开(公告)号：US20100000976A1
公开(公告)日：2010-01-07
申请号：US11989214
申请日：2005-07-22
Applicant: Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
Inventor： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
CPC classification number: B23P6/007 , B23K1/0018 , B23K1/002 , B23K1/0056 , B23K2101/001
Abstract: In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.
Abstract translation: 在一个方面，提供了一种用于修复包括具有定向微结构的基材的部件的修复方法。 以这样的方式进行修复，即修理的位置相应地具有像周围的基材的定向微观结构。 在要修复的位置的区域中施加焊料，并且通过热暴露将其焊接到部件，从而在以下区域中产生温度梯度，即例如从较高温度到较低温度的温度变化 要修理的位置。
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7.发明授权公开(公告)号：US07288592B2
公开(公告)日：2007-10-30
申请号：US10507241
申请日：2003-04-03
Applicant: Kurt Stark , Robert Singer
Inventor： Kurt Stark , Robert Singer
IPC: C08F30/08
CPC classification number: C09D183/10 , C08F283/12 , C08F218/02
Abstract: Organosilicone and vinyl ester copolymers free from phase separation are prepared by copolymerizing at least one vinyl ester monomer with organosilicones containing difunctional silicone monomers and optionally a minor amount of monofunctional silicone monomers, in a non-aqueous solvent mixture containing at least one solvent with a transfer coefficient greater than 20·10−4 relative to vinyl acetate.
Abstract translation: 通过在至少一种含有至少一种溶剂的非水溶剂混合物中将至少一种乙烯基酯单体与含有双官能硅酮单体和任选的少量单官能有机硅单体的有机硅共聚合来制备无相分离的有机硅氧烷和乙烯基酯共聚物 系数相对于乙酸乙烯酯为大于20.10±0.4。
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公开(公告)号：US5993559A
公开(公告)日：1999-11-30
申请号：US61374
申请日：1998-04-16
Applicant: Robert Singer , Peter Krug , Winfried Esser , Jurgen Ewald , Jurgen Preuhs , Adolf Donner
Inventor： Robert Singer , Peter Krug , Winfried Esser , Jurgen Ewald , Jurgen Preuhs , Adolf Donner
CPC classification number: C22B25/06 , C23F1/44 , Y02P10/228
Abstract: In a method for removing tin from a surface and/or from a region close to the surface of a component part, the component part has a concentrated aqueous sodium hydroxide or concentrated hydrochloric acid flowing in contact with it at a temperature which is distinctly higher than room temperature. Preferably, the temperature is approximately 220.degree. C., and the component part is moreover subjected to a positive pressure of 5.5 bar. The method is suitable for a component part fabricated through the use of unidirectional solidification and liquid-metal cooling, in particular a turbine blade.
Abstract translation: 在从表面和/或从靠近构件表面的区域除去锡的方法中，组分部分具有与其相接触的浓度的氢氧化钠水溶液或浓盐酸，其温度明显高于 室内温度。 优选地，温度为约220℃，并且组分部分进一步经受5.5巴的正压力。 该方法适用于通过使用单向凝固和液态金属冷却制造的部件，特别是涡轮叶片。
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公开(公告)号：US4365040A
公开(公告)日：1982-12-21
申请号：US192732
申请日：1980-10-01
Applicant: Herbert Eck , Robert Singer
Inventor： Herbert Eck , Robert Singer
IPC: C08F2/00 , C08F2/22 , C08F16/00 , C08F218/02 , C08F246/00 , C09D131/02 , C09D157/04 , C09J131/02 , C08F220/26 , C08F220/10
CPC classification number: C08F246/00 , C08F218/02 , C09D131/02 , C09D157/04 , C09J131/02
Abstract: Strongly adhering aqueous plastic dispersions based on copolymers of olefinically unsaturated compounds, which are particularly suitable as binding agents for paints and lacquers and as adhesives, and which are distinguished by their good wet adhesion are described. This is achieved by the inclusion by polymerization of from 0.2% to 7% by weight, based on the total weight of the monomers, of vinyl and/or allyl diacetylacetate having the formula:CH.sub.2 .dbd.CH--(CH.sub.2).sub.n --O--CO--CH(CO--CH.sub.3).sub.2wherein n is 0 or 1, in the production of copolymers of the invention in an aqueous emulsion.
Abstract translation: 描述了基于烯属不饱和化合物的共聚物的强烈粘附的水性塑料分散体，其特别适合作为涂料和漆的粘合剂和粘合剂，并且通过其良好的湿粘合性来区分。 这通过基于单体的总重量计0.2％至7％重量的乙烯基和/或烯丙基二乙酰基乙酸酯通过聚合包含，具有下式：CH2 = CH-（CH2）nO-CO-CH （CO-CH 3）2，其中n为0或1，在本发明的共聚物的水乳液中制备。
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公开(公告)号：US1833918A
公开(公告)日：1931-12-01
申请号：US37905029
申请日：1929-07-17
Applicant: ROBERT SINGER
Inventor： ROBERT SINGER
IPC: A23G9/22
CPC classification number: A23G9/227 , Y10T24/44017 , Y10T24/44256
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