公开(公告)号：US4233620A

公开(公告)日：1980-11-11

申请号：US16034

申请日：1979-02-27

Applicant: Russell E. Darrow ,  Irving Memis ,  Richard M. Poliak

Inventor： Russell E. Darrow ,  Irving Memis ,  Richard M. Poliak

IPC: H01L23/055 ,  H01L23/10

CPC classification number: H01L23/055 ,  H01L23/10 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/10253

Abstract: The hermetic seal of the backside of a substrate of an integrated circuit module is provided by a composition containing about 51.4 to about 60.6% by weight of an epoxy polymer; about 39 to about 48% by weight of a hardener and flexibilizing portion; and up to about 0.6% by weight of a coloring agent.

Abstract translation: 集成电路模块的基板的背面的气密密封由包含约51.4至约60.6重量％的环氧聚合物的组合物提供; 约39至约48重量％的硬化剂和增韧部分; 和至多约0.6重量％的着色剂。

公开(公告)号：US4238528A

公开(公告)日：1980-12-09

申请号：US81298

申请日：1979-10-02

Applicant: Raymond W. Angelo ,  Richard M. Poliak ,  John R. Susko

Inventor： Raymond W. Angelo ,  Richard M. Poliak ,  John R. Susko

IPC: H01B3/30 ,  H01L21/312 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28

CPC classification number: H05K3/284 ,  H01B3/306 ,  H01L21/312 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3157 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01012 ,  H05K2201/09872 ,  H05K2201/10977 ,  Y10T29/49146 ,  Y10T29/49171

Abstract: A protective layer composition, suitable for protecting metal electrodes on components and other microelectronic circuitry, comprises an organic thermoplastic polymeric material, an organic solvent or solvents, and a non-ionic fluorocarbon surfactant as a wetting/leveling/flow control agent. A typical formulation comprises an aromatic polymer which cures to form a polyamide-imide polymer, an organic solvent or a mixture of orangic solvents and a non-ionic fluorocarbon surfactant.

Abstract translation: 适用于保护组件和其他微电子电路上的金属电极的保护层组合物包括有机热塑性聚合材料，有机溶剂或溶剂以及作为润湿/流平/流动控制剂的非离子氟碳表面活性剂。 一种典型的制剂包括固化形成聚酰胺 - 酰亚胺聚合物，有机溶剂或者奥氏体溶剂和非离子氟碳表面活性剂的混合物的芳族聚合物。

公开(公告)号：US4216035A

公开(公告)日：1980-08-05

申请号：US864073

申请日：1977-12-23

Applicant: Peter Bakos ,  Roger E. Haggett ,  Richard M. Poliak

Inventor： Peter Bakos ,  Roger E. Haggett ,  Richard M. Poliak

IPC: H05K3/34 ,  B23K35/36 ,  C09D5/20 ,  C09D171/02 ,  H01B3/42 ,  H01L23/29 ,  H01L23/488 ,  H05K3/28 ,  B23K35/34

CPC classification number: H01L23/293 ,  B23K35/3612 ,  C09D171/02 ,  C09D5/20 ,  H01L23/488 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/284 ,  H05K3/3489

Abstract: A film-forming composition comprising an organic flux base material; and a carboxylic acid anhydride and/or aldehyde; and a process for using are provided.

Abstract translation: 一种成膜组合物，其包含有机助焊剂基材; 和羧酸酐和/或醛; 并提供使用过程。

公开(公告)号：US4441938A

公开(公告)日：1984-04-10

申请号：US480158

申请日：1983-03-29

Applicant: Richard M. Poliak ,  Dennis L. Rivenburgh ,  Carlos J. Sambucetti

Inventor： Richard M. Poliak ,  Dennis L. Rivenburgh ,  Carlos J. Sambucetti

IPC: B23K35/363 ,  B23K35/36 ,  B23K35/34

CPC classification number: B23K35/3612 ,  B23K35/3613

Abstract: A soldering flux comprising of rosin, certain acetic acid derivatives, ionic fluorocarbon surfactant, and organic diluent.

Abstract translation: 包含松香，某些乙酸衍生物，离子型氟碳表面活性剂和有机稀释剂的焊剂。

公开(公告)号：US4294729A

公开(公告)日：1981-10-13

申请号：US104623

申请日：1979-12-17

Applicant: Peter Bakos ,  Russell E. Darrow ,  Joseph Funari ,  Richard M. Poliak

Inventor： Peter Bakos ,  Russell E. Darrow ,  Joseph Funari ,  Richard M. Poliak

IPC: C11D7/50 ,  C09D9/00 ,  H05K3/28 ,  C09D9/04 ,  C11D3/43 ,  C11D3/44

CPC classification number: C09D9/005 ,  H05K3/288

Abstract: Cured epoxy compositions are removed from substrates by employing compositions containing an organic cyclic alcohol and a surface-active agent.

Abstract translation: 通过使用含有机环状醇和表面活性剂的组合物从底物中除去固化的环氧组合物。