摘要:
The present invention generally relates to a MEMS device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the RF electrode at the same voltage. The anchor region coupling matches the mechanical stiffness in all sections of the cantilever so that all of the cantilevers move together.
摘要:
Embodiments disclosed herein generally solve a stiction problem in switching devices by using a series of pulses of force which take the switch from being strongly adhered to a landing electrode to the point where it is only weakly adhered. Once in the low adhesion state, the switch can then be pulled away from contact with a lower force provided by either the spring constant of the switch and/or the electrostatic forces resulting from low voltages applied to nearby electrodes.
摘要:
A capacitively coupled microelectromechanical device and method of operation. The micromechanical device comprises: a semiconductor substrate; a member operable to deflect about a torsion axis to either of at least two states; and a switch driven for selectively connecting the member to a voltage signal. When a logic high signal is stored on the memory capacitor 308, the mirror transistor 310 is turned on, grounding the mirror structure 312. When a logic low signal is stored on the memory capacitor 308, the mirror transistor 310 is turned off, allowing the mirror to float electrically. Mirrors that are tied to a voltage potential, which typically are grounded, are affected by a reset pulse and rotate away from their landed position. When the mirrors have rotated to the opposite side, a bias signal is applied to hold the repositioned mirror in place in the opposite state. Mirrors that electrically are floating do not experience the forces generated by the reset voltage and remain in their previous state. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.
摘要:
An improved micromechanical device, particularly a micromirror device having improved electrostatic efficiency. A deflectable member comprised of a mirror 302 and an active hinge yoke 306 is suspended address 308 and landing electrodes 312 on a substrate 310 and above upper address electrodes supported above the substrate 310. The deflectable member is operable to rotate about a torsion hinge axis in response to an electrostatic force between the address electrodes and the deflectable member. The upper address electrodes have a stair stepped shape to narrow a gap between the deflectable member and the upper address electeodes. The gap is narrower near the axis of rotation 810 compared to away from the axis. The stair stepped shape is achieved by embedding a portion of an oxide layer 804 between a thin metal layer 806 making up the upper address electrodes 806, the active hinge yoke 306, and the torsion hinges, and a thick metal layer 808 making up the upper address electrodes 806 and the active hinge yoke 306.
摘要:
An improved micromechanical device comprising a substrate (104), a deflectable member (102) suspended over the substrate (104), at least one spring-ring (124) supported above the substrate (104); and at least one address electrode (110) spaced apart from substrate (104). The spring-ring (124) resists deflection of the deflectable member (102) when the deflectable member (102) deflects to contact the spring-ring (124). By moving the address electrode (110) off the substrate level, the micromirror is much more immune to particle-caused short circuits, and a planer surface on which to fabricate the mirror (102) is provided without the need to utilize an inverse spacer layer.
摘要:
A micromechanical device (50) with spring tips (60) and its method of manufacture. A micromechanical device (50) is formed such that there is a deflectable element (36) suspended by at least one hinge (24a) over an air gap, at the bottom of which are landing stops (34a). The element (36) deflects on said hinge and comes into contact with the landing stops (34a) via at least one small metal protrusion (60), or spring tip. The spring tip flexes upon contact allowing more even distribution of forces and less wear and adhesion. The spring tips are formed in standard semiconductor processing steps with the addition of patterning the metal layer (64) from which the hinges are formed to create separated metal elements. When the deflectable element is formed, the metal forming that element bonds to the separated metal elements at the tips, thereby forming the spring tips.
摘要:
"A vehicle and the ballistic shock isolator therefor including a turret, a sensor assembly and a shock isolator isolating the turret from the sensor switch and including upper and lower annular members, a plurality of leaves secured at opposing ends thereof to the annular members, each of the leaves having a corrugated bellows shaped portion in the form of an even number of similarly shaped portions, alternate ones of the similarly shaped portions having an open end in opposing directions, each of the leaves varying in thickness and width in a direction from the upper annular member to the lower annular member. The variation in width of the portion is alternately from wide to narrow and then from narrow to wide in a direction from the upper annular member to the lower annular member. Each of the leaves is composed of a metal having a yield strength which will not be exceeded by the maximum contemplated shock conditions and at least 150 KSI, the metal returning to its original shape after being subjected to shock. The metal is preferably 4000 series stainless steel. By use of the above described ballistic shock isolator, a tank may be subjected to a severe shock due to collision with a non-penetrating projectile with the CITV sensor assembly being capable of rapid repositioning to substantially identically return to its original position relative to the tank, thereby providing reliable boresight for use in connection with further tank deployment.
摘要:
Utilizing a variable capacitor for RF and microwave applications provides for multiple levels of intra-cavity routing that advantageously reduce capacitive coupling. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto. Each of the plurality of cells has a plurality of MEMS devices therein. The MEMS devices share a common RF electrode, one or more ground electrodes and one or more control electrodes. The RF electrode, ground electrodes and control electrodes are all arranged parallel to each other within the cells. The RF electrode is electrically connected to the one or more bond pads using a different level of electrical routing metal.
摘要:
The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode.
摘要:
Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.