摘要:
Packaging techniques for planar resonator gyroscopes, such as disc resonator gyroscopes (DRGs) are disclosed. In one embodiment, a packaged resonator gyroscope comprises a carrier, a substrate layer mounted to the carrier, a baseplate coupled to the substrate to define a cavity between the substrate and the baseplate, and a resonator mounted to the baseplate and suspended in the cavity. Other embodiments may be described.
摘要:
A method for locating and eliminating defects on a substrate wafer includes illuminating a top surface of the substrate wafer with a first illumination source, illuminating a bottom surface of the substrate wafer with a second illumination source, forming an image of a portion of the top surface of the substrate wafer while the substrate wafer is illuminated by the first and second illumination sources, adjusting a contrast of the image to accentuate defects on the top surface of the substrate wafer, locating defects in the image, and ablating the defects on the top surface with a laser.
摘要:
Packaging techniques for planar resonator gyroscopes, such as disc resonator gyroscopes (DRGs) are disclosed. In one embodiment, a packaged resonator gyroscope comprises a carrier, a substrate layer mounted to the carrier, a baseplate coupled to the substrate to define a cavity between the substrate and the baseplate, and a resonator mounted to the baseplate and suspended in the cavity. Other embodiments may be described.
摘要:
A method for tuning an electro-mechanical device such as a MEMS device is disclosed. The method comprises operating a MEMS device in a depressurized system and using FIB micromachining to remove a portion of the MEMS device. Additionally, a method for tuning a plurality of MEMS devices by depositing an active layer and then removing a portion of the active layer using FIB micromachining. Also, a method for tuning a MEMS device and vacuum packaging the MEMS device in situ are provided.
摘要:
Photodiode testing apparatus having the capability of directly measuring photodiode impedance. An E-beam machine is used for photodiode testing, the beam being selectively directed to different diodes in an array. A varying level of infrared flux is applied to the photodiode, causing the photodiode to develop ac voltage and current signals which are used for the direct measurement of impedance.
摘要:
Method and apparatus for calibrating equipment used for testing photodiode arrays by reference to the diode under test. The diodes are illuminated with infrared radiation and different bias voltages, developed by bombardment with an electron beam, are measured at zero current. The measured voltage values are correlated with secondary emission sensor readouts to calibrate the sensor according to the specific diode being tested. Remote light emitting diodes generate the infrared radiation which is coupled to the photodiode array via optical fiber elements.
摘要:
The dominant physical parameter that affects the internal stress of electroplated metals on substrates have been identified and their effects have been systematically studied. Thin electroplated metals have very high internal stresses, even though the substrate displacements are small. Increasing the electroplated metal's thickness greatly reduces the magnitude of the stress, which can be either tensile or compressive depending on the plating conditions, but it may not necessarily reduce the displacement of the substrate. Based on the research done in connection to this application, the relationship between the plating temperatures and the current density needed to obtain near-zero-stress state for electroplated nickel on silicon substrate can be deduced.
摘要:
A method for locating and eliminating defects on a substrate wafer includes illuminating a top surface of the substrate wafer with a first illumination source, illuminating a bottom surface of the substrate wafer with a second illumination source, forming an image of a portion of the top surface of the substrate wafer while the substrate wafer is illuminated by the first and second illumination sources, adjusting a contrast of the image to accentuate defects on the top surface of the substrate wafer, locating defects in the image, and ablating the defects on the top surface with a laser.
摘要:
A method for tuning an electro-mechanical device such as a MEMS device is disclosed. The method comprises operating a MEMS device in a depressurized system and using FIB micromachining to remove a portion of the MEMS device. Additionally, a method for tuning a plurality of MEMS devices by depositing an active layer and then removing a portion of the active layer using FIB micromachining. Also, a method for tuning a MEMS device and vacuum packaging the MEMS device in situ are provided.
摘要:
Apparatus and method for detecting unauthorized disturbance of a protected surface, includes a substrate adapted to conformably encase and adhere to the surface that is to be protected. A plurality of layers, each comprising a plurality of frangible conduits is embedded in the substrate and randomly overlays a majority of the protected surface. Each of the conduits has its ends protruding from the substrate to permit a monitor to be coupled thereto for monitoring the integrity of the continuity of each conduits, and for switching from a first state to a second state whenever the continuity of any of the conduits is broken. A warning alarm is coupled to the monitor for displaying the state of the monitor.