Process for thick film circuit patterning
    3.
    发明授权
    Process for thick film circuit patterning 失效
    厚膜电路图案化工艺

    公开(公告)号:US07741013B2

    公开(公告)日:2010-06-22

    申请号:US11312673

    申请日:2006-02-21

    Abstract: A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.

    Abstract translation: 使用光敏聚合物层图案化厚膜电功能图案的工艺。 将粘性感光层施加到基材表面上。 感光层用光化辐射的图案成像,感光层的曝光区域变硬并且非粘性。 随后应用厚膜组合物片将导致厚膜粘附到剩余的粘性区域。 在剥离片材时,将产生厚膜印刷图案。 该步骤之后是由所使用的厚膜组合物规定的处理轮廓,其导致具有电功能性质的图案。 本发明还延伸到其中从使用的片材中回收厚膜组合物的方法。

    PROCESS FOR THICK FILM CIRCUIT PATTERNING
    7.
    发明申请
    PROCESS FOR THICK FILM CIRCUIT PATTERNING 审中-公开
    厚膜电路图的工艺

    公开(公告)号:US20100104829A1

    公开(公告)日:2010-04-29

    申请号:US12647700

    申请日:2009-12-28

    Abstract: A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.

    Abstract translation: 使用光敏聚合物层图案化厚膜电功能图案的工艺。 将粘性感光层施加到基材表面上。 感光层用光化辐射的图案成像,感光层的曝光区域变硬并且非粘性。 随后应用厚膜组合物片将导致厚膜粘附到剩余的粘性区域。 在剥离片材时,将产生厚膜印刷图案。 该步骤之后是由所使用的厚膜组合物规定的处理轮廓,其导致具有电功能性质的图案。 本发明还延伸到其中从使用的片材中回收厚膜组合物的方法。

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