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    Semiconductor die having increased usable area
    1.
    发明申请
    Semiconductor die having increased usable area 失效
    半导体管芯具有增加的可用面积

    公开(公告)号：US20080220220A1

    公开(公告)日：2008-09-11

    申请号：US11715241

    申请日：2007-03-06

    Applicant: Ken Jian Ming Wang ,  Ming Wang Sze

    Inventor： Ken Jian Ming Wang ,  Ming Wang Sze

    IPC: B32B23/02

    CPC classification number: H01L29/0657 ,  H01L23/13 ,  H01L2924/0002 ,  Y10T428/24777 ,  H01L2924/00

    Abstract: According to one embodiment, a semiconductor die having increased usable area has at least six sides. The semiconductor die has a reduced stress at each corner of the die, resulting in smaller keep out zones near the corners of the semiconductor die, which allow the placement of bond pads near each corner of the die. The semiconductor die further allows the placement of active circuitry near each corner of the semiconductor die. One embodiment results in a 5.0% increase in usable area on the semiconductor die.

    Abstract translation: 根据一个实施例，具有增加的可用面积的半导体管芯具有至少六个边。 半导体管芯在管芯的每个拐角处具有减小的应力，从而在半导体管芯的拐角附近形成较小的保护区域，这允许将接合焊盘放置在管芯的每个拐角附近。 半导体管芯进一步允许在半导体管芯的每个拐角附近放置有源电路。 一个实施例导致半导体管芯上的可用面积增加了5.0％。

    Semiconductor die for increasing yield and usable wafer area
    2.
    发明申请
    Semiconductor die for increasing yield and usable wafer area 审中-公开
    半导体芯片，用于提高产量和可用的晶圆面积

    公开(公告)号：US20080220206A1

    公开(公告)日：2008-09-11

    申请号：US11715175

    申请日：2007-03-06

    Applicant: Ken Jian Ming Wang ,  Ming Wang Sze

    Inventor： Ken Jian Ming Wang ,  Ming Wang Sze

    IPC: B32B3/12

    CPC classification number: H01L21/78 ,  Y10T428/24165

    Abstract: According to one embodiment, a semiconductor die for increasing usable area of a wafer and for increasing yield has a substantially hexagonal shape. The wafer can have, for example, a circular shape. The semiconductor die can be diced by, for example, using a water-jet-guided laser. In one embodiment, the semiconductor die results in an approximately 2.0% to 4.0% reduction in the unusable area of the wafer. Moreover, the substantially hexagonal shape of the semiconductor die reduces stress at corners of the semiconductor die, thus increasing the yield of the wafer.

    Abstract translation: 根据一个实施例，用于增加晶片的可用面积并用于提高产量的半导体管芯具有大致六边形形状。 晶片可以具有例如圆形形状。 半导体管芯可以通过例如使用喷水引导激光来切割。 在一个实施例中，半导体晶片导致晶片的不可用面积减少约2.0％至4.0％。 此外，半导体管芯的大致六边形形状减小了半导体管芯的拐角处的应力，从而提高了晶片的产量。

    Apparatus and method for testing a network connection device
    3.
    发明申请
    Apparatus and method for testing a network connection device 审中-公开
    用于测试网络连接设备的装置和方法

    公开(公告)号：US20060002307A1

    公开(公告)日：2006-01-05

    申请号：US11147737

    申请日：2005-06-08

    Applicant: Yi-Ming Wang ,  Chun-Ming Wang

    Inventor： Yi-Ming Wang ,  Chun-Ming Wang

    IPC: H04L1/00

    CPC classification number: H04L1/24

    Abstract: A test apparatus for testing a to-be-tested network connection device is disclosed. The to-be-tested network connection device has a number of to-be-tested ports. The test apparatus includes a packet generator and a switch fixture. The packet generator is for generating a test packet having a VLAN ID (VID). The switch fixture, having VLAN function, includes a number of fixture ports. The to-be-tested ports are respectively one-to-one electrically coupled to the fixture ports. The switch fixture receives the test packet and transmits the test packet from one of the fixture ports to the corresponding to-be-tested port according to its VID in order to verify the to-be-tested network connection device.

    Abstract translation: 公开了一种用于测试待测试网络连接设备的测试设备。 待测试的网络连接设备具有多个待测试端口。 测试装置包括分组发生器和开关夹具。 分组生成器用于生成具有VLAN ID（VID）的测试分组。 具有VLAN功能的开关灯具包括多个灯具端口。 待测试的端口分别一对一地电耦合到固定端口。 开关夹具接收测试包，并根据其VID将其中一个灯具端口的测试包发送到相应的待测试端口，以验证待测试的网络连接设备。

    Semiconductor die having increased usable area
    4.
    发明授权
    Semiconductor die having increased usable area 失效
    半导体管芯具有增加的可用面积

    公开(公告)号：US08193613B2

    公开(公告)日：2012-06-05

    申请号：US11715241

    申请日：2007-03-06

    Applicant: Ken Jian Ming Wang ,  Ming Wang Sze

    Inventor： Ken Jian Ming Wang ,  Ming Wang Sze

    IPC: H01L23/544

    CPC classification number: H01L29/0657 ,  H01L23/13 ,  H01L2924/0002 ,  Y10T428/24777 ,  H01L2924/00

    Abstract: According to one embodiment, a semiconductor die having increased usable area has at least six sides. The semiconductor die has a reduced stress at each corner of the die, resulting in smaller keep out zones near the corners of the semiconductor die, which allow the placement of bond pads near each corner of the die. The semiconductor die further allows the placement of active circuitry near each corner of the semiconductor die. One embodiment results in a 5.0% increase in usable area on the semiconductor die.

    Abstract translation: 根据一个实施例，具有增加的可用面积的半导体管芯具有至少六个边。 半导体管芯在管芯的每个拐角处具有减小的应力，从而在半导体管芯的拐角附近形成较小的保护区域，这允许将接合焊盘放置在管芯的每个拐角附近。 半导体管芯进一步允许在半导体管芯的每个拐角附近放置有源电路。 一个实施例导致半导体管芯上的可用面积增加了5.0％。

    Container washing device
    5.
    发明授权
    Container washing device 有权

    公开(公告)号：US12220098B1

    公开(公告)日：2025-02-11

    申请号：US18586553

    申请日：2024-02-26

    Applicant: Ming Wang

    Inventor： Ming Wang

    IPC: A47L15/00 ,  A47L15/42

    Abstract: The present disclosure relates to the technical field of a container scrubbing device, including a connecting sleeve, The connecting sleeve has a first end part; the scrubbing rod is connected to the first end part, and a first scrubbing piece is arranged at a top side and/or a peripheral side of the scrubbing rod; the guide sleeve extends in a longitudinal direction and is sleeved at a peripheral side of the connecting sleeve, so that the connecting sleeve can perform reciprocating motion in the longitudinal direction inside the guide sleeve; a bracket is slidingly sleeve at a peripheral side of the scrubbing rod, and the bottom of the bracket is connected to a top end of the guide sleeve; and the spring is arranged inside the guide sleeve, and two ends of the spring in a compression direction thereof abut against the bracket and the first end part, respectively.

    ELECTRONIC DEVICE
    7.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20180303000A1

    公开(公告)日：2018-10-18

    申请号：US15922887

    申请日：2018-03-15

    Applicant: Sheng-Hung Wang ,  Hui-Lian Chang ,  Ming-Wang Lin ,  Pan-Jen Chen ,  Wei-Lung Huang ,  Ting-Hui Liao

    Inventor： Sheng-Hung Wang ,  Hui-Lian Chang ,  Ming-Wang Lin ,  Pan-Jen Chen ,  Wei-Lung Huang ,  Ting-Hui Liao

    IPC: H05K5/02

    CPC classification number: H05K5/0226 ,  G06F1/1616 ,  G06F1/1681 ,  H05K5/0247

    Abstract: An electronic device includes a first body, a second body, an electrical connection element, and a hinge structure. The electrical connection element is configured to electrically connect the first body with the second body. The hinge structure is configured to pivot the first body with the second body. The hinge structure includes two mounting bases, two first linking assemblies, and a second linking assembly. Each of the mounting bases is connected to the first body and the second body. The two first linking assemblies are respectively pivoted to the two mounting bases. The second linking assembly is disposed between the two mounting bases, and two opposite terminals of the second linking assembly are movably connected to the two mounting bases respectively. The second linking assembly has a receding space configured to accommodate a portion of the electrical connection element.

    Quick detachable wrench structure
    9.
    发明授权
    Quick detachable wrench structure 有权

    公开(公告)号：US09815183B2

    公开(公告)日：2017-11-14

    申请号：US14592622

    申请日：2015-01-08

    Applicant: Yeo Ming Wang

    Inventor： Yeo Ming Wang

    IPC: B25B23/00 ,  B25B13/46

    CPC classification number: B25B23/0057 ,  B25B13/463 ,  B25B23/0035

    Abstract: A quick detachable wrench structure comprises: a wrench head portion, which has a hollow operation accommodation room and a top end portion disposed at an upper portion thereof; and a pressing member, which has a top pressing portion and a bottom plug portion, the bottom plug portion is embedded in the operation accommodation room, the top pressing portion is disposed at an upper portion of the top end portion, a bottom edge of the bottom plug portion is against to a bottom end of the top end portion in order to avoid the bottom plug portion taking off from the operation accommodation room.

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