公开(公告)号：US20090325116A1

公开(公告)日：2009-12-31

申请号：US12448356

申请日：2008-08-06

申请人： Masanari Matsuura ,  Sotaro Oi ,  Tomoyuki Kubota ,  Masaya Tsuruta

发明人： Masanari Matsuura ,  Sotaro Oi ,  Tomoyuki Kubota ,  Masaya Tsuruta

IPC分类号： F27B5/04

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K2101/40 ,  F27B5/04 ,  F27B5/14 ,  F27B5/16 ,  F27B5/18 ,  F27D7/06 ,  F27D19/00

摘要： A hydrogen vacuum furnace (100) is provided with a process chamber (1) wherein a subject (10) to be heated is stored; a heating chamber (2) wherein a heater lamp (25) is stored; and a crystal board (3) for separating the subject (10) and the heater lamp (25) one from the other. In the hydrogen vacuum furnace (100), the subject (10) is heated by a radiant ray applied from the heater lamp (25). The process chamber (1) and the heating chamber (2) are provided with gas feed ports (11, 21) and exhaust ports (12, 22), respectively, for feeding and exhausting a gas. When the subject (10) is being heated, atmospheric pressure in each chamber is adjusted so that the heating chamber (2) is under positive pressure to the process chamber (1) by feeding or exhausting the gas.

摘要翻译： 氢真空炉（100）设有处理室（1），其中存储被加热物体（10）; 加热室（2），其中存储加热灯（25）; 以及用于将被摄体（10）和加热灯（25）彼此分离的晶体板（3）。 在氢真空炉（100）中，通过从加热灯（25）施加的辐射线加热被检体（10）。 处理室（1）和加热室（2）分别设有用于供给和排出气体的气体供给口（11,21）和排气口（12,22）。 当受试者（10）被加热时，调节每个室中的大气压力，使得加热室（2）通过进料或排出气体而处于处理室（1）的正压力。

公开(公告)号：US20070023486A1

公开(公告)日：2007-02-01

申请号：US11486084

申请日：2006-07-14

申请人： Masanari Matsuura ,  Masahiro Koizumi ,  Masaya Tsuruta ,  Tomoyuki Kubota ,  Yoshiyuki Nakamura

发明人： Masanari Matsuura ,  Masahiro Koizumi ,  Masaya Tsuruta ,  Tomoyuki Kubota ,  Yoshiyuki Nakamura

IPC分类号： B23K31/02

CPC分类号： B23K1/002 ,  B23K2101/42 ,  H01L2224/81222 ,  H01L2924/01019 ,  H01L2924/01068 ,  H05K3/3494 ,  H05K2203/101

摘要： The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an induction coil having a length in the longitudinal direction that is longer than the length of the board. An inner space having a size sufficient to arrange the board therein is maintained inside the induction coil. The board supporting the parts and the solder material will be positioned in the approximate center of the inner space of the induction coil. An alternating current will flow through the induction coil in this state. An alternating magnetic field will be generated in the inner space of the induction coil. Magnetic fluxes will substantially uniformly pass through the inner space of the induction coil along the longitudinal direction of the induction coil. In this way, the plurality of solder material arranged on a plurality of locations on the board may be uniformly heated and melted. The plurality of parts arranged on a plurality of locations on the board may be uniformly soldered to the board because the plurality of solder material may be uniformly heated and melted due to magnetic fluxes that uniformly passing through the board.

摘要翻译： 本发明提供了均匀地加热和熔化布置在板上的多个位置的多个焊料的技术，并且将多个部件均匀地焊接到布置在板上的多个位置中的板。 一种焊接装置，其特征在于，具有长度方向的长度大于所述基板的长度的感应线圈。 在感应线圈内保持具有足以将板布置在其中的尺寸的内部空间。 支撑部件和焊料的板将位于感应线圈的内部空间的大致中心。 在这种状态下，交流电将流过感应线圈。 在感应线圈的内部空间中将产生交变磁场。 磁通量将基本均匀地沿着感应线圈的纵向方向通过感应线圈的内部空间。 以这种方式，布置在板上的多个位置上的多个焊料材料可以被均匀地加热和熔化。 由于多个焊料材料由于均匀地通过板的磁通而被均匀地加热和熔化，所以布置在板上的多个位置上的多个部件可以均匀地焊接到板上。

公开(公告)号：US09033705B2

公开(公告)日：2015-05-19

申请号：US12448356

申请日：2008-08-06

申请人： Masanari Matsuura ,  Sotaro Oi ,  Tomoyuki Kubota ,  Masaya Tsuruta

发明人： Masanari Matsuura ,  Sotaro Oi ,  Tomoyuki Kubota ,  Masaya Tsuruta

IPC分类号： F27B5/18 ,  F27B5/16 ,  B23K1/00 ,  B23K1/008 ,  F27B5/04 ,  F27B5/14 ,  F27D7/06 ,  F27D19/00

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K2101/40 ,  F27B5/04 ,  F27B5/14 ,  F27B5/16 ,  F27B5/18 ,  F27D7/06 ,  F27D19/00

摘要： A hydrogen vacuum furnace (100) is provided with a process chamber (1) wherein a subject (10) to be heated is stored; a heating chamber (2) wherein a heater lamp (25) is stored; and a crystal board (3) for separating the subject (10) and the heater lamp (25) one from the other. In the hydrogen vacuum furnace (100), the subject (10) is heated by a radiant ray applied from the heater lamp (25). The process chamber (1) and the heating chamber (2) are provided with gas feed ports (11, 21) and exhaust ports (12, 22), respectively, for feeding and exhausting a gas. When the subject (10) is being heated, atmospheric pressure in each chamber is adjusted so that the heating chamber (2) is under positive pressure to the process chamber (1) by feeding or exhausting the gas.

公开(公告)号：US08297429B2

公开(公告)日：2012-10-30

申请号：US12449870

申请日：2008-11-05

申请人： Masanari Matsuura ,  Sotaro Ol ,  Tomoyuki Kubota ,  Masaya Tsuruta

发明人： Masanari Matsuura ,  Sotaro Ol ,  Tomoyuki Kubota ,  Masaya Tsuruta

IPC分类号： B65G47/26

CPC分类号： B23K1/005 ,  B23K1/0053 ,  B23K1/0056 ,  B23K1/008 ,  B23K3/08 ,  B23K35/0233 ,  B23K35/26 ,  F27B9/2469 ,  F27B9/26 ,  F27D3/12 ,  F27D3/123 ,  H05K3/0008 ,  H05K3/3494 ,  H05K2203/1509

摘要： A conveyance section positioning method has carrier pallets on which workpieces are fixed, a conveyer, a heating furnace for heating the workpieces, and a positioning mechanism for positioning the carrier pallets, and the method stops the carrier pallets at predetermined positions. The heating furnace has halogen heaters for heating the workpieces. The carrier pallets each have projections and output grooves. Comb tooth-shaped stopper projections engaging with the projections are formed on a carrier stopper. When the carrier stopper is moved forward, the stopper projections and the projections are engaged with each other. In this one operation, the carrier pallets are positioned at places corresponding to the halogen heaters, and then the workpieces are heated.

摘要翻译： 输送部定位方法具有固定工件的搬运托盘，输送机，用于加热工件的加热炉，以及用于定位托盘的定位机构，并且该方法将托架托盘停止在预定位置。 加热炉具有用于加热工件的卤素加热器。 载体托盘各具有突起和输出槽。 与突起接合的梳齿状止动器突起形成在载体塞上。 当载具止动器向前移动时，止动突起和突起彼此接合。 在这一个操作中，载体托盘位于与卤素加热器对应的位置，然后加热工件。

公开(公告)号：US08271124B2

公开(公告)日：2012-09-18

申请号：US12451070

申请日：2008-12-08

申请人： Sotaro Ol ,  Masanari Matsuura ,  Tomoyuki Kubota ,  Masaya Tsuruta

发明人： Sotaro Ol ,  Masanari Matsuura ,  Tomoyuki Kubota ,  Masaya Tsuruta

IPC分类号： G06F19/00

CPC分类号： G01K13/00 ,  G01J5/0003 ,  G01J5/0044 ,  G01J5/08 ,  G01J5/0846 ,  G01K1/143 ,  H05K3/3494 ,  H05K2203/111 ,  H05K2203/163

摘要： An object is heated to a preheating temperature in an atmosphere of a reducing gas under the atmospheric pressure while adjusting the setting of the emissivity of a non-contact temperature measuring part and regulating the temperature of the object according to the measured value measured by a contact temperature measuring part. The pressure of the atmosphere is reduced. The object is further heated to a heating temperature under a lowered pressure while regulating the temperature of the object according to the measured value measured by the non-contact temperature measuring part whose setting of the emissivity is adjusted during the heating process to the preheating temperature. The pressure of the atmosphere is increased back to the atmospheric pressure while maintaining the heating temperature of the object. The temperature of the object is decreased under the atmospheric pressure. With this, in the process of heating an object under a lowered pressure, the actual temperature of the object is managed over the whole steps, and the object can be most suitably heated according to the actual temperature.

摘要翻译： 将物体在大气压下在还原气体的气氛中加热到预热温度，同时调节非接触式温度测量部件的发射率的设定，并根据由接触测量的测量值来调节物体的温度 温度测量部分。 大气压力降低。 将该物体进一步在降低的压力下加热到加热温度，同时根据由加热过程中的发射率设定调节到预热温度的非接触式温度测量部件测量的测量值来调节物体的温度。 在保持物体的加热温度的同时，将气氛的压力提高回大气压。 物体的温度在大气压下降低。 由此，在降低压力下对物体进行加热的过程中，物体的实际温度在整个步骤中被管理，并且可以根据实际温度最适当地加热物体。

公开(公告)号：US20100089720A1

公开(公告)日：2010-04-15

申请号：US12449870

申请日：2008-11-05

申请人： Masanari Matsuura ,  Sotaro Ol ,  Tomoyuki Kubota ,  Masaya Tsuruta

发明人： Masanari Matsuura ,  Sotaro Ol ,  Tomoyuki Kubota ,  Masaya Tsuruta

IPC分类号： B65G47/26

CPC分类号： B23K1/005 ,  B23K1/0053 ,  B23K1/0056 ,  B23K1/008 ,  B23K3/08 ,  B23K35/0233 ,  B23K35/26 ,  F27B9/2469 ,  F27B9/26 ,  F27D3/12 ,  F27D3/123 ,  H05K3/0008 ,  H05K3/3494 ,  H05K2203/1509

摘要： A conveyance section positioning method has carrier pallets (40) on which workpieces are fixed, a conveyer (20), a heating furnace (13) for heating the workpieces, and a positioning mechanism for positioning the carrier pallets (40), and the method stops the carrier pallets (40) at predetermined positions. The heating furnace (13) has halogen heaters (30) for heating the workpieces. The carrier pallets (40) each have projections (41) and output grooves (42). Comb tooth-shaped stopper projections (35a) engaging with the projections (41) are formed on a carrier stopper (35). When the carrier stopper (35) is moved forward, the stopper projections (35a) and the projections (41) are engaged with each other. In this one operation, the carrier pallets (40) are positioned at places corresponding to the halogen heaters (30), and then the workpieces are heated.

摘要翻译： 输送部定位方法具有固定有工件的托盘托架（40），用于加热工件的输送机（20），加热炉（13）和用于定位托架托盘（40）的定位机构， 将托架托盘（40）停止在预定位置。 加热炉（13）具有用于加热工件的卤素加热器（30）。 载体托盘（40）各具有突起（41）和输出槽（42）。 与突起（41）接合的梳齿形止动突起（35a）形成在载体塞（35）上。 当行星架止动器（35）向前移动时，止动突起（35a）和突起（41）彼此接合。 在这一个操作中，载体托盘（40）位于与卤素加热器（30）相对应的位置，然后加热工件。

公开(公告)号：US20100121479A1

公开(公告)日：2010-05-13

申请号：US12451070

申请日：2008-12-08

申请人： Sotaro Ol ,  Masanari Matsuura ,  Tomoyuki Kubota ,  Masaya Tsuruta

发明人： Sotaro Ol ,  Masanari Matsuura ,  Tomoyuki Kubota ,  Masaya Tsuruta

IPC分类号： G05D23/19

CPC分类号： G01K13/00 ,  G01J5/0003 ,  G01J5/0044 ,  G01J5/08 ,  G01J5/0846 ,  G01K1/143 ,  H05K3/3494 ,  H05K2203/111 ,  H05K2203/163

摘要： An object is heated to a preheating temperature in an atmosphere of a reducing gas under the atmospheric pressure while adjusting the setting of the emissivity of a non-contact temperature measuring part and regulating the temperature of the object according to the measured value measured by a contact temperature measuring part. The pressure of the atmosphere is reduced. The object is further heated to a heating temperature under a lowered pressure while regulating the temperature of the object according to the measured value measured by the non-contact temperature measuring part whose setting of the emissivity is adjusted during the heating process to the preheating temperature. The pressure of the atmosphere is increased back to the atmospheric pressure while maintaining the heating temperature of the object. The temperature of the object is decreased under the atmospheric pressure. With this, in the process of heating an object under a lowered pressure, the actual temperature of the object is managed over the whole steps, and the object can be most suitably heated according to the actual temperature.

摘要翻译： 将物体在大气压下在还原气体的气氛中加热到预热温度，同时调节非接触式温度测量部件的发射率的设定，并根据由接触测量的测量值来调节物体的温度 温度测量部件。 大气压力降低。 将该物体进一步在降低的压力下加热到加热温度，同时根据由加热过程中的发射率设定调节到预热温度的非接触式温度测量部件测量的测量值来调节物体的温度。 在保持物体的加热温度的同时，将气氛的压力提高回大气压。 物体的温度在大气压下降低。 由此，在降低压力下对物体进行加热的过程中，物体的实际温度在整个步骤中被管理，并且可以根据实际温度最适当地加热物体。

公开(公告)号：US07649159B2

公开(公告)日：2010-01-19

申请号：US11486084

申请日：2006-07-14

申请人： Masanari Matsuura ,  Masahiro Koizumi ,  Masaya Tsuruta ,  Tomoyuki Kubota ,  Yoshiyuki Nakamura

发明人： Masanari Matsuura ,  Masahiro Koizumi ,  Masaya Tsuruta ,  Tomoyuki Kubota ,  Yoshiyuki Nakamura

IPC分类号： H05B6/10 ,  H05B6/12 ,  B23K1/002

CPC分类号： B23K1/002 ,  B23K2101/42 ,  H01L2224/81222 ,  H01L2924/01019 ,  H01L2924/01068 ,  H05K3/3494 ,  H05K2203/101

摘要： The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an induction coil having a length in the longitudinal direction that is longer than the length of the board. An inner space having a size sufficient to arrange the board therein is maintained inside the induction coil. The board supporting the parts and the solder material will be positioned in the approximate center of the inner space of the induction coil. An alternating current will flow through the induction coil in this state. An alternating magnetic field will be generated in the inner space of the induction coil. Magnetic fluxes will substantially uniformly pass through the inner space of the induction coil along the longitudinal direction of the induction coil. In this way, the plurality of solder material arranged on a plurality of locations on the board may be uniformly heated and melted. The plurality of parts arranged on a plurality of locations on the board may be uniformly soldered to the board because the plurality of solder material may be uniformly heated and melted due to magnetic fluxes that uniformly passing through the board.

摘要翻译： 本发明提供了均匀地加热和熔化布置在板上的多个位置的多个焊料的技术，并且将多个部件均匀地焊接到布置在板上的多个位置中的板。 一种焊接装置，其特征在于，具有长度方向的长度大于所述基板的长度的感应线圈。 在感应线圈内保持具有足以将板布置在其中的尺寸的内部空间。 支撑部件和焊料的板将位于感应线圈的内部空间的大致中心。 在这种状态下，交流电将流过感应线圈。 在感应线圈的内部空间中将产生交变磁场。 磁通量将基本均匀地沿着感应线圈的纵向方向通过感应线圈的内部空间。 以这种方式，布置在板上的多个位置上的多个焊料材料可以被均匀地加热和熔化。 由于多个焊料材料由于均匀地通过板的磁通而被均匀地加热和熔化，所以布置在板上的多个位置上的多个部件可以均匀地焊接到板上。