公开(公告)号：US10126177B2

公开(公告)日：2018-11-13

申请号：US15117676

申请日：2015-02-05

Applicant: Micro Control Company

Inventor： Donald Robert Olson ,  Daniel Aaron Haapala

IPC: G01K7/01 ,  G01R31/28

Abstract: A remote diode temperature sensing circuit for use in a burn-in system to sense a temperature of a semiconductor device under test includes a temperature sense circuit and an adapter circuit. The temperature sense circuit is configured to output temperature sense currents (Is) during a temperature sense routine. The adapter circuit is configured to drive mirrored sense currents (Ims), which mirror the temperature sense currents, through a diode of the semiconductor device that is connected to an input/output package pin, and present voltage differences across the diode responsive to the mirrored sense currents to the temperature sense circuit. The temperature sense circuit is configured to discharge a temperature output signal that is indicative of the temperature of the diode based on the voltage differences.

公开(公告)号：US11680980B2

公开(公告)日：2023-06-20

申请号：US17476530

申请日：2021-09-16

Applicant: Micro Control Company

Inventor： Tom Alan Tremmel ,  John Thomas McElreath

IPC: G01R31/28 ,  F27D1/18 ,  F27B17/00

CPC classification number: G01R31/2849 ,  F27B17/0025 ,  F27D1/18

Abstract: A semiconductor burn-in oven includes a housing including a burn-in chamber and an opening to the burn-in chamber surrounded by a front face, a heating device, testing circuitry, a door and a sealing mechanism. The door has an open position, in which the burn-in chamber is accessible through the opening, and a closed position, in which the door covers the opening. The sealing mechanism is configured to form a seal around the opening between an interior side of the door and the front face when the door is in the closed position. The sealing mechanism includes at least one sealing member having a recessed position, in which a gap extends between the front face and the interior side of the door, and a sealing position, in which the at least one sealing member closes the gap and forms the seal.

公开(公告)号：US20160349118A1

公开(公告)日：2016-12-01

申请号：US15117676

申请日：2015-02-05

Applicant: MICRO CONTROL COMPANY

Inventor： Donald Robert Olson ,  Daniel Aaron Haapala

IPC: G01K7/01 ,  G01R31/28

CPC classification number: G01K7/01 ,  G01K7/015 ,  G01R31/2874

Abstract: A remote diode temperature sensing circuit for use in a burn-in system to sense a temperature of a semiconductor device under test includes a temperature sense circuit and an adapter circuit. The temperature sense circuit is configured to output temperature sense currents (Is) during a temperature sense routine. The adapter circuit is configured to drive mirrored sense currents (Ims), which mirror the temperature sense currents, through a diode of the semiconductor device that is connected to an input/output package pin, and present voltage differences across the diode responsive to the mirrored sense currents to the temperature sense circuit. The temperature sense circuit is configured to discharge a temperature output signal that is indicative of the temperature of the diode based on the voltage differences.

Abstract translation: 用于在老化系统中检测被测半导体器件的温度的远程二极管温度检测电路包括温度检测电路和适配器电路。 温度检测电路被配置为在温度检测程序期间输出温度感测电流（Is）。 适配器电路被配置为通过连接到输入/输出封装引脚的半导体器件的二极管来驱动镜像温度感测电流的镜像检测电流（Ims），并响应于镜像来产生跨二极管的电压差 检测电流到温度检测电路。 温度检测电路被配置为基于电压差来放出指示二极管的温度的温度输出信号。

公开(公告)号：US20220082611A1

公开(公告)日：2022-03-17

申请号：US17476530

申请日：2021-09-16

Applicant: Micro Control Company

Inventor： Tom Alan Tremmel ,  John Thomas McElreath

IPC: G01R31/28 ,  F27B17/00 ,  F27D1/18

Abstract: A semiconductor burn-in oven includes a housing including a burn-in chamber and an opening to the burn-in chamber surrounded by a front face, a heating device, testing circuitry, a door and a sealing mechanism. The door has an open position, in which the burn-in chamber is accessible through the opening, and a closed position, in which the door covers the opening. The sealing mechanism is configured to form a seal around the opening between an interior side of the door and the front face when the door is in the closed position. The sealing mechanism includes at least one sealing member having a recessed position, in which a gap extends between the front face and the interior side of the door, and a sealing position, in which the at least one sealing member closes the gap and forms the seal.

公开(公告)号：US20040182564A1

公开(公告)日：2004-09-23

申请号：US10669736

申请日：2003-09-24

Applicant: Micro Control Company

Inventor： Tom A. Tremmel

IPC: F24F011/04

CPC classification number: G01R31/2862 ,  G01R31/2874

Abstract: A chip temperature sensor includes a support member, a resistance temperature detector (RTD), and signal leads. The support member is slidably mountable within a heat sink bore of a burn-in oven heat exchange system and includes first and second ends, a socket formed in the first end, a bore extending from the socket through the second end, and a flange positioned between the first and second ends. The RTD is seated in the socket and includes a chip contact surface that is raised relative to the first end. The RTD is configured to produce a temperature signal that is indicative of a temperature at the chip contact surface. The signal leads are attached to the RTD and extend through the bore of the support member and out the second end of the support member. A heat exchange system that includes the above-described chip temperature sensor.

Abstract translation: 芯片温度传感器包括支撑部件，电阻温度检测器（RTD）和信号引线。 支撑构件可滑动地安装在老化炉热交换系统的散热孔内，并且包括第一端和第二端，形成在第一端的插座，从插座延伸穿过第二端的孔，以及定位的凸缘 在第一和第二端之间。 RTD位于插座中并且包括相对于第一端升高的芯片接触表面。 RTD被配置为产生指示芯片接触表面处的温度的温度信号。 信号引线连接到RTD并延伸穿过支撑构件的孔并且从支撑构件的第二端延伸出来。 一种包括上述芯片温度传感器的热交换系统。

公开(公告)号：US12007434B2

公开(公告)日：2024-06-11

申请号：US17507242

申请日：2021-10-21

Applicant: Micro Control Company

Inventor： Aidan Michael Fawcett

IPC: G01R31/28 ,  G05B19/418

CPC classification number: G01R31/2868 ,  G01R31/2862 ,  G01R31/2863 ,  G01R31/2865 ,  G05B19/41805

Abstract: A semiconductor burn-in oven includes a housing having a chamber, a heating device, testing circuitry having circuit connectors, and a seating assembly. The seating assembly includes a main frame, a main frame actuator connected to the main frame, a plurality of hook members connected to the main frame, and a hook driver. The main frame actuator is configured to drive movement of the main frame along a first axis between an extended position and a retracted position. The hook driver is configured to pivot each of the hook members about a pivot axis between a receiving position and a latching position. Board connectors of burn-in boards supported within the chamber are driven to seat with the circuit connectors when the burn-in boards are latched by the hook members in their latching position and the main frame is moved from the extended position to the retracted position.

公开(公告)号：US20220120808A1

公开(公告)日：2022-04-21

申请号：US17507242

申请日：2021-10-21

Applicant: Micro Control Company

Inventor： Aidan Michael Fawcett

IPC: G01R31/28 ,  G05B19/418

Abstract: A semiconductor burn-in oven includes a housing having a chamber, a heating device, testing circuitry having circuit connectors, and a seating assembly. The seating assembly includes a main frame, a main frame actuator connected to the main frame, a plurality of hook members connected to the main frame, and a hook driver. The main frame actuator is configured to drive movement of the main frame along a first axis between an extended position and a retracted position. The hook driver is configured to pivot each of the hook members about a pivot axis between a receiving position and a latching position. Board connectors of burn-in boards supported within the chamber are driven to seat with the circuit connectors when the burn-in boards are latched by the hook members in their latching position and the main frame is moved from the extended position to the retracted position.