公开(公告)号：US06534901B1

公开(公告)日：2003-03-18

申请号：US09890914

申请日：2001-11-21

Applicant: Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

Inventor： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

IPC: H03H910

CPC classification number: H03H9/1071 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/49117 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically sealed with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.

Abstract translation: SAW元件（13）由压电基板（14）形成，其上设有IDT电极（15），连接电极（16），下面的金属层（17）和声学材料（18）放置在下面的金属 层（17）并且具有平行于压电基板（14）的主表面的表面。 SAW元件安装在具有与连接电极（16）连接的外部端子（11）的封装（10）中，并且封装件用盖（20）气密密封以形成SAW器件。 当使用真空卡盘（30）将这样的SAW元件（13）面对面地安装在封装（10）中时，可以保护其压电基板（14）免受损坏。 当在其连接电极（16）上设置有凸起（23）的SAW元件（13）面朝下安装在封装（10）中时，可以防止电连接的故障。

公开(公告)号：US07035602B2

公开(公告)日：2006-04-25

申请号：US09913259

申请日：2000-12-14

Applicant: Yuki Satoh ,  Tetsuya Tsurunari ,  Koji Hashimoto ,  Hiroshi Takahashi ,  Kozo Murakami

Inventor： Yuki Satoh ,  Tetsuya Tsurunari ,  Koji Hashimoto ,  Hiroshi Takahashi ,  Kozo Murakami

IPC: H01Q11/12

CPC classification number: H04B1/0057 ,  H01P1/15 ,  H04B1/406 ,  H04B1/48

Abstract: A hybrid radio frequency (RF) switching device includes first to fourth ports, a diode coupled between the first port and second port, a first transmission line having a length of λg/4 (where λg is a wave length of a frequency in a first frequency band), and a first element coupled in series with the first transmission line having an almost simple reactance component and nearly opening in a second frequency band. The first transmission line and first element are coupled in series between the second port and third port. The device further includes a second transmission line having a length of λd/4 (where λd is a wavelength of a frequency in the second frequency band), and a second element having an almost simple reactance component and nearly opening in the first frequency band. The second transmission line and second element are coupled in series between the second port and fourth port.

Abstract translation: 混合射频（RF）开关装置包括第一至第四端口，耦合在第一端口和第二端口之间的二极管，具有长度lambdag / 4的第一传输线（其中lambdag是第一端口和第二端口中的频率的波长 频带），以及与第一传输线串联耦合的第一元件具有几乎简单的电抗分量并且在第二频带中几乎打开。 第一传输线和第一元件串联耦合在第二端口和第三端口之间。 该装置还包括具有长度lambdad / 4（其中lambdad是第二频带中的频率的波长）的第二传输线，以及具有几乎简单的电抗分量并且在第一频带中几乎打开的第二元件。 第二传输线和第二元件串联耦合在第二端口和第四端口之间。

公开(公告)号：US20050036278A1

公开(公告)日：2005-02-17

申请号：US10932893

申请日：2004-09-02

Applicant: Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

Inventor： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

IPC: H01L21/50 ,  H01L21/60 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H03H9/25 ,  H02B1/00

CPC classification number: H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.

Abstract translation: 一种电子部件，其中芯片可以以高精度水平安装在封装的某个预定位置，该封装在空腔的内壁中具有台阶级差。 该封装件在内壁表面上具有台阶级差，而形成在阶梯级差的上表面上的内部接触电极。 在封装的底部是屏蔽电极，其上通过粘合层安装芯片。 芯片和内部接触电极通过互连线电连接。 通过利用设置在封装的内底面上的非电极部分的区域来进行芯片和互连线的位置对准，其中至少任一个进行。

公开(公告)号：US20110084573A1

公开(公告)日：2011-04-14

申请号：US12903326

申请日：2010-10-13

Applicant: Toru YAMAJI ,  Tetsuhiro Korechika ,  Koji Kawakita ,  Eiji Kawamoto ,  Mitsuhiro Furukawa ,  Kozo Murakami

Inventor： Toru YAMAJI ,  Tetsuhiro Korechika ,  Koji Kawakita ,  Eiji Kawamoto ,  Mitsuhiro Furukawa ,  Kozo Murakami

IPC: H01L41/047 ,  H01L41/053

CPC classification number: H03H9/132 ,  H03H9/059 ,  H03H9/1092

Abstract: An elastic wave device has the following elements: a piezoelectric substrate; an inter-digital transducer (IDT) electrode disposed on the piezoelectric substrate; internal electrodes disposed above the piezoelectric substrate and electrically connected to the IDT electrode; side walls disposed above the internal electrodes surrounding the IDT electrode; a cover disposed above the side walls so as to cover a space above the IDT electrode; an electrode base layer disposed on the internal electrodes outside the side walls; and connection electrodes disposed on the electrode base layer. Each connection electrode has a first connection electrode disposed on the electrode base layer, and a second connection electrode disposed on the first connection electrode. The horizontal sectional shape of the second connection electrode is non-circular.

Abstract translation: 弹性波器件具有以下元件：压电基片; 配置在所述压电基板上的数字式换能器（IDT）电极; 内部电极设置在压电基板上并电连接到IDT电极; 设置在围绕IDT电极的内部电极上方的侧壁; 设置在所述侧壁上方以覆盖所述IDT电极上方的空间的盖; 设置在侧壁外侧的内部电极上的电极基层; 以及设置在电极基底层上的连接电极。 每个连接电极具有设置在电极基底层上的第一连接电极和设置在第一连接电极上的第二连接电极。 第二连接电极的水平截面形状是非圆形的。

公开(公告)号：US07345362B2

公开(公告)日：2008-03-18

申请号：US10932893

申请日：2004-09-02

Applicant: Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

Inventor： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/552 ,  H01L23/02 ,  H01L29/22 ,  H01L33/00 ,  H01L23/12

CPC classification number: H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.

Abstract translation: 一种电子部件，其中芯片可以以高精度水平安装在封装的某个预定位置，该封装在空腔的内壁中具有台阶级差。 该封装件在内壁表面上具有台阶级差，而形成在阶梯级差的上表面上的内部接触电极。 在封装的底部是屏蔽电极，其上通过粘合层安装芯片。 芯片和内部接触电极通过互连线电连接。 通过利用设置在封装的内底面上的非电极部分的区域来进行芯片和互连线的位置对准，其中至少任一个进行。

公开(公告)号：US06804103B1

公开(公告)日：2004-10-12

申请号：US09856822

申请日：2001-08-27

Applicant: Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

Inventor： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

IPC: H01H4700

CPC classification number: H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package 13 is provided with a stepped level-difference 26 in the inner wall surface, and an internal contact electrode 14 formed on the upper surface of the stepped level-difference 26. At the bottom of the package 13 is a shield electrode 15, on which a chip 17 is mounted via an adhesion layer 16. The chip 17 and the internal contact electrode 14 are electrically connected by an interconnection wire 19. Location aligning for the chip 17 and the interconnection wire 19, at least either one of these, is conducted by making use of a region 18a, 18b, which is non-electrode portion, provided on the inner bottom surface of the package 13.

Abstract translation: 一种电子部件，其中芯片可以以高精度水平安装在封装的某个预定位置，该封装在空腔的内壁中具有台阶级差。 封装13在内壁表面设置阶梯级差26，在台阶级差26的上表面上形成有内部接触电极14.封装13的底部是屏蔽电极15， 芯片17通过粘合层16安装在芯片17上。芯片17和内部接触电极14通过互连线19电连接。芯片17和互连线19的位置对准，这些中的至少一个， 通过利用设置在包装13的内底面上的非电极部分的区域18a，18b进行。

公开(公告)号：US06404302B1

公开(公告)日：2002-06-11

申请号：US09600233

申请日：2000-09-05

Applicant: Yuki Satoh ,  Toru Sakuragawa ,  Kozo Murakami

Inventor： Yuki Satoh ,  Toru Sakuragawa ,  Kozo Murakami

IPC: H03H964

CPC classification number: H03H9/6483

Abstract: The present invention relates to a surface acoustic wave (SAW) filter which is used for cellular phones and other mobile communication equipment. The object of the present invention is to realize a SAW filter of which attenuation characteristics and pass characteristics can be set arbitrarily. The SAW filter of the present invention comprises comb-shaped electrodes facing each other disposed on the same piezoelectric substrate, at least two resonators with an input and output terminals, and an equivalent transmission line which is connected between an output terminal of a first resonator and an input terminal of a second resonator. The phase of the transmission line can be adjusted from 5 degrees to 175 degrees arbitrarily at the series resonance frequency of the resonators. This structure realizes a band-stop filter or a band-pass filter whose attenuation characteristics and pass characteristics can be set arbitrarily.

Abstract translation: 本发明涉及一种用于蜂窝电话和其他移动通信设备的声表面波（SAW）滤波器。 本发明的目的是实现可以任意设定衰减特性和通过特性的SAW滤波器。 本发明的SAW滤波器包括设置在同一压电基片上的彼此相对的梳状电极，至少两个具有输入和输出端子的谐振器和连接在第一谐振器的输出端子和 第二谐振器的输入端。 传输线的相位可以在共振器的串联谐振频率下任意调整为5度至175度。 该结构实现了可以任意设定衰减特性和通过特性的带阻滤波器或带通滤波器。

公开(公告)号：US5932950A

公开(公告)日：1999-08-03

申请号：US693383

申请日：1996-08-06

Applicant: Toru Yamada ,  Toshio Ishizaki ,  Kazunori Nishimura ,  Kozo Murakami

Inventor： Toru Yamada ,  Toshio Ishizaki ,  Kazunori Nishimura ,  Kozo Murakami

IPC: H03H7/38 ,  H03H9/00 ,  H03H9/05 ,  H03H9/64 ,  H01L41/08

CPC classification number: H03H9/6479 ,  H03H9/0028 ,  H03H9/0542 ,  H03H9/14591 ,  H03H9/14597 ,  H03H9/6433 ,  H03H9/6463 ,  H03H7/38

Abstract: A SAW resonator disposed with an IDT electrode and reflector electrodes is formed on the surface of a piezoelectric substrate. Three pieces of the SAW resonator form an acoustic coupling by being disposed close to each other, electrode fingers comprising the IDT electrode in the center are all grounded, and IDT electrode fingers are electrically independent on the side to be connected to input-output terminals of the IDT electrodes disposed outside. As a result, three excitation modes having different propagation frequencies are generated which are used to attain a broad band SAW resonator filter. When these three pairs of the IDT electrode are electrically independent, a balanced input-output can be achieved, and excellent out-of-band rejection characteristics can be obtained.

Abstract translation: 设置有IDT电极和反射器电极的SAW谐振器形成在压电基板的表面上。 三个SAW谐振器通过彼此靠近地布置形成声耦合，包括中心的IDT电极的电极指全部接地，并且IDT电极指在与要连接到的输入输出端子 IDT电极位于外部。 结果，产生了具有不同传播频率的三种激励模式，用于获得宽带SAW谐振滤波器。 当这三对IDT电极是电独立的时，可以实现平衡的输入 - 输出，并且可以获得优异的带外抑制特性。

公开(公告)号：US08471433B2

公开(公告)日：2013-06-25

申请号：US12903326

申请日：2010-10-13

Applicant: Toru Yamaji ,  Tetsuhiro Korechika ,  Koji Kawakita ,  Eiji Kawamoto ,  Mitsuhiro Furukawa ,  Kozo Murakami

Inventor： Toru Yamaji ,  Tetsuhiro Korechika ,  Koji Kawakita ,  Eiji Kawamoto ,  Mitsuhiro Furukawa ,  Kozo Murakami

IPC: H03H9/02 ,  H03H9/05

CPC classification number: H03H9/132 ,  H03H9/059 ,  H03H9/1092

Abstract: An elastic wave device has the following elements: a piezoelectric substrate; an inter-digital transducer (IDT) electrode disposed on the piezoelectric substrate; internal electrodes disposed above the piezoelectric substrate and electrically connected to the IDT electrode; side walls disposed above the internal electrodes surrounding the IDT electrode; a cover disposed above the side walls so as to cover a space above the IDT electrode; an electrode base layer disposed on the internal electrodes outside the side walls; and connection electrodes disposed on the electrode base layer. Each connection electrode has a first connection electrode disposed on the electrode base layer, and a second connection electrode disposed on the first connection electrode. The horizontal sectional shape of the second connection electrode is non-circular.

Abstract translation: 弹性波器件具有以下元件：压电基片; 配置在所述压电基板上的数字式换能器（IDT）电极; 内部电极设置在压电基板上并电连接到IDT电极; 设置在围绕IDT电极的内部电极上方的侧壁; 设置在所述侧壁上方以覆盖所述IDT电极上方的空间的盖; 设置在侧壁外侧的内部电极上的电极基层; 以及设置在电极基底层上的连接电极。 每个连接电极具有设置在电极基底层上的第一连接电极和设置在第一连接电极上的第二连接电极。 第二连接电极的水平截面形状是非圆形的。

公开(公告)号：US06891449B2

公开(公告)日：2005-05-10

申请号：US10087275

申请日：2002-03-01

Applicant: Ryoichi Takayama ,  Tetsuo Kawasaki ,  Yuki Satoh ,  Kozo Murakami ,  Toru Sakuragawa

Inventor： Ryoichi Takayama ,  Tetsuo Kawasaki ,  Yuki Satoh ,  Kozo Murakami ,  Toru Sakuragawa

IPC: H01P1/213 ,  H03H7/19 ,  H03H9/145 ,  H03H9/25 ,  H03H9/64 ,  H03H9/72 ,  H04B1/50

CPC classification number: H03H9/6483 ,  H03H7/19

Abstract: An antenna duplexer has a power durability to a signal input from an antenna terminal and has stable characteristics. The antenna duplexer includes an input terminal, a transmission filter including a surface acoustic wave (SAW) filter having an input port connected to the input terminal, a phase shifter having an input port connected to an output port of the transmission filter, a reception filter having an input port connected to an output port of the phase shifter, an output terminal connected to the output port of the reception filter, and an antenna terminal connected between the transmission filter and the phase shifter. The transmission filter has a power durability at the output port of the filter, being equal to or larger than a power durability at the input port of the filter.

Abstract translation: 天线双工器具有对从天线端子输入的信号的功率耐久性，并具有稳定的特性。 天线双工器包括输入端子，包括具有连接到输入端子的输入端口的表面声波滤波器的发送滤波器，具有连接到发送滤波器的输出端口的输入端口的移相器，接收滤波器 具有连接到移相器的输出端口的输入端口，连接到接收滤波器的输出端口的输出端子以及连接在发送滤波器和移相器之间的天线端子。 传动过滤器在过滤器的输出端口处具有等于或大于过滤器的输入端口处的功率耐久性的功率耐久性。