公开(公告)号：US6055724A

公开(公告)日：2000-05-02

申请号：US155720

申请日：1998-10-02

申请人： Kenichi Nishino ,  Shinji Kanayama ,  Hiroyuki Otani ,  Kohei Enchi ,  Hiroyuki Yoshida

发明人： Kenichi Nishino ,  Shinji Kanayama ,  Hiroyuki Otani ,  Kohei Enchi ,  Hiroyuki Yoshida

IPC分类号： H01L21/60 ,  H01L21/00 ,  H01L21/56 ,  H01L23/28 ,  H01R43/00 ,  B23P19/00

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L21/563 ,  H01L21/67126 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49171 ,  Y10T29/53178

摘要： A method and device for sealing an IC chip are provided, by which a sealing material is surely discharged onto the upper surface of a circuit board, and the occurrence of imperfect sealing can be eliminated. A first gap (h1) is provided between an application nozzle (15) and a circuit board (13) on which an IC chip (12) is mounted before discharging the sealing material (17), after which a second gap (h2) which is greater than the first gap (h1) is provided between the application nozzle (15) and the circuit board (13) while discharging the sealing material (17), thereby accomplishing the sealing of the IC chip (12), and ensuring that the sealing operation is performed after the sealing material (17) has completely come to contact with the upper surface of the circuit board (13).

摘要翻译： PCT No.PCT / JP98 / 00447 Sec。 371日期：1998年10月2日 102（e）1998年10月2日日期PCT提交1998年2月2日PCT公布。 第WO98 / 34276号公报 日本1998年8月6日提供了一种用于密封IC芯片的方法和装置，通过该方法和装置可靠地将密封材料排出到电路板的上表面上，并且可以消除不完全密封的发生。 在排出密封材料（17）之前，在施加喷嘴（15）和安装有IC芯片（12）的电路板（13）之间设置有第一间隙（h1），之后，将第二间隙（h2） 大于在排出密封材料（17）时在施加喷嘴（15）和电路板（13）之间提供第一间隙（h1），从而实现IC芯片（12）的密封，并且确保 在密封材料（17）完全与电路板（13）的上表面接触之后进行密封操作。

公开(公告)号：US06809479B2

公开(公告)日：2004-10-26

申请号：US10265047

申请日：2002-10-04

申请人： Yoko Shimomura ,  Koji Miyazaki ,  Satoshi Kominami ,  Kohei Enchi ,  Hiroyuki Uchiyama

发明人： Yoko Shimomura ,  Koji Miyazaki ,  Satoshi Kominami ,  Kohei Enchi ,  Hiroyuki Uchiyama

IPC分类号： H05B4116

CPC分类号： H01J65/048

摘要： A self-ballasted electrodeless discharge lamp of the invention is provided with a discharge vessel filled with discharge gas, the discharge vessel having a cavity portion, a coil inserted into the cavity portion of the discharge vessel, a ballast circuit for supplying high frequency power to the coil, and a lamp base that is electrically connected to the ballast circuit, wherein the discharge vessel, the coil, the ballast circuit, and the lamp base are configured as a single unit, and a reflective tape for reflecting light that is radiated from the discharge gas and emitted from inside the discharge vessel to its cavity portion side is wound around the coil.

摘要翻译： 本发明的自镇流无电极放电灯设置有充满放电气体的放电容器，放电容器具有空腔部分，插入放电容器的空腔部分中的线圈，用于将高频电力提供给 线圈和电连接到镇流器电路的灯座，其中放电容器，线圈，镇流器电路和灯座被配置为单个单元，以及用于反射从第 放电气体从放电容器内部排出到其空腔部侧卷绕在线圈上。

公开(公告)号：US5894657A

公开(公告)日：1999-04-20

申请号：US569937

申请日：1995-12-08

申请人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Shida ,  Kohei Enchi ,  Kenji Takahashi

发明人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Shida ,  Kohei Enchi ,  Kenji Takahashi

IPC分类号： H01L21/50 ,  H01L21/52 ,  H05K13/00 ,  H05K13/02 ,  H05K13/04 ,  H05K13/08 ,  H05K3/30

CPC分类号： H05K13/0408 ,  H05K13/0069 ,  H05K13/02 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： An electronic component mounting apparatus includes a feeding device for feeding a to-be-placed element including an electronic component, an anisotropic conductive film, or a paste, a holding device for holding the fed element, an element moving device for supporting and moving the holding device in a first direction and placing the element held by the holding device on a circuit board, and a board moving device for holding and moving the circuit board in a second direction generally at right angles to the first direction where the element moving device is moved.

摘要翻译： 一种电子部件安装装置，包括：馈送装置，用于馈送包括电子部件，各向异性导电膜或糊状物的待放置元件，用于保持馈送元件的保持装置;用于支撑和移动的元件移动装置 保持装置在第一方向上并且将由保持装置保持的元件放置在电路板上，以及板移动装置，用于沿着与元件移动装置的第一方向成直角的第二方向保持和移动电路板 移动了

公开(公告)号：US06527905B1

公开(公告)日：2003-03-04

申请号：US09703924

申请日：2000-11-02

申请人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

发明人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

IPC分类号： B32B3500

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/11005 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01082 ,  H05K13/0465 ,  H05K13/0469 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/17 ,  Y10T156/1798 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of mounting an electronic component at a specified position of an object. The method includes applying a sealant beforehand in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then, without obstructing successive bonding of electrodes of the electronic component and the object, the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component because of the air bubbles can be reduced. Only a short period of time is required to apply the sealant even though it is applied twice, so that production time is shortened and production efficiency is improved.

摘要翻译： 一种将电子部件安装在物体的指定位置的方法。 该方法包括在第一施加过程中预先施加密封剂。 密封剂通过在布置位置避免电极，并且紧密接触布置的电子部件和物体，在第一施加过程中快速，充分且强制地施加。 然后，在不妨碍电子部件和物体的电极的连续接合的情况下，以通常的方式进行电极的接合。 通过以与常规方法相同的方式将密封剂施加到电子部件的周边来进行第二施加过程，该方法足以使密封剂流动到先前施加在电子部件下方的密封剂。 可以相应地进行第二次应用程序的充分进行。 气泡不会被夹在电子部件和物体之间，结果是由于气泡而导致的电子部件的破损或腐蚀导致的安装故障可以减少。 即使施加两次，也只需要很短的时间来施加密封剂，从而缩短生产时间并提高生产效率。

公开(公告)号：US06206066B1

公开(公告)日：2001-03-27

申请号：US09091104

申请日：1998-06-12

申请人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

发明人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

IPC分类号： B32B3500

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/11005 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01082 ,  H05K13/0465 ,  H05K13/0469 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/17 ,  Y10T156/1798 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of and apparatus for mounting an electronic component at a specified position of an object. The method includes applying a sealant in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component can be reduced. Only a short period of time is required to apply the sealant even though it is applied twice, so that production time is shortened and production efficiency is improved.

摘要翻译： 一种用于将电子部件安装在物体的指定位置的方法和装置。 该方法包括在第一施加过程中施加密封剂。 密封剂通过在布置位置避免电极，并且紧密接触布置的电子部件和物体，在第一施加过程中快速，充分且强制地施加。 然后以通常的方式进行电极的接合。 通过以与常规方法相同的方式将密封剂施加到电子部件的周边来进行第二施加过程，该方法足以使密封剂流动到先前施加在电子部件下方的密封剂。 可以相应地进行第二次应用程序的充分进行。 气泡不会被夹在电子部件和物体之间，结果是由于电子部件的断裂或腐蚀导致的安装故障可以减少。 即使施加两次，也只需要很短的时间来施加密封剂，从而缩短生产时间并提高生产效率。