公开(公告)号：US08351144B2

公开(公告)日：2013-01-08

申请号：US12072004

申请日：2008-02-21

申请人： Kimio Nakamura ,  Fumiko Akagi

发明人： Kimio Nakamura ,  Fumiko Akagi

IPC分类号： G11B5/02 ,  G11B11/00

CPC分类号： G11B5/314 ,  B82Y10/00 ,  G11B5/02 ,  G11B2005/0002 ,  G11B2005/0021

摘要： Embodiments of the present invention help to suppress the effects of thermal fluctuation in a thermally assisted magnetic field recording, and improve recording density. According to one embodiment, a recording area of a magnetic disk is heated and the full width at half maximum of an optical power distribution of a near field light generator is controlled to be 100 nm or less. Thereby, the cooling time of the magnetic disk is made 2 nm or less and the effects of thermal fluctuation are suppressed. Moreover, although an incomplete area of the magnetization reversal at the rear end of the magnetic domain is created with rapid cooling, by creating an overshoot at the rising end of the magnetic field waveform of the magnetic recording head, the incomplete area of the magnetization reversal can be overwritten, which is created at the rear end of the magnetic domain previously recorded by the overshoot magnetic field. Therefore, the expansion of the magnetic transition width can be suppressed, resulting in the recording density being improved.

摘要翻译： 本发明的实施例有助于抑制热辅助磁场记录中的热波动的影响，并提高记录密度。 根据一个实施例，加热磁盘的记录区域，并将近场光发生器的光功率分布的最大半值宽度控制在100nm以下。 由此，将磁盘的冷却时间设定为2nm以下，抑制热波动的影响。 此外，尽管通过快速冷却产生磁畴后端的磁化反转的不完整区域，但是通过在磁记录头的磁场波形的上升端产生过冲，磁化反转的不完整区域 可以被覆盖，其在由过冲磁场预先记录的磁畴的后端处产生。 因此，可以抑制磁转移宽度的扩大，导致记录密度提高。

公开(公告)号：US20120080220A1

公开(公告)日：2012-04-05

申请号：US13196317

申请日：2011-08-02

申请人： Kimio NAKAMURA ,  Shuichi TAKEUCHI ,  Yoshiyuki SATOH ,  Kenji KOBAE

发明人： Kimio NAKAMURA ,  Shuichi TAKEUCHI ,  Yoshiyuki SATOH ,  Kenji KOBAE

IPC分类号： H05K1/18 ,  H05K13/00

CPC分类号： H05K1/113 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13019 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/10977 ,  Y10T29/49124 ,  H01L2924/00

摘要： An electronic device includes a circuit board including a first electrode and a second electrode; and an electronic component including a first terminal and a second terminal, wherein the first electrode includes a first pad portion to which the first terminal is connected and a first protrusion portion disposed in a first direction in parallel with a straight line passing through the first electrode and the second electrode with respect to the first pad portion and being into contact with the first terminal, the second electrode includes a second pad portion to which the second terminal is connected and a second protrusion portion disposed in a second direction opposite to the first direction with respect to the second pad portion and being into contact with the second terminal.

摘要翻译： 电子装置包括：电路板，包括第一电极和第二电极; 以及包括第一端子和第二端子的电子部件，其中所述第一电极包括与所述第一端子连接的第一焊盘部分和与通过所述第一电极的直线平行的第一方向设置的第一突出部分 所述第二电极相对于所述第一焊盘部分与所述第一端子接触，所述第二电极包括第二焊盘部分，所述第二端子连接到所述第二焊盘部分，所述第二突出部分设置在与所述第一方向相反的第二方向上 相对于第二焊盘部分并与第二端子接触。

公开(公告)号：US07898908B2

公开(公告)日：2011-03-01

申请号：US11498869

申请日：2006-08-04

申请人： Takuya Matsumoto ,  Kimio Nakamura ,  Yoshio Takahashi

发明人： Takuya Matsumoto ,  Kimio Nakamura ,  Yoshio Takahashi

IPC分类号： G11B5/02

CPC分类号： G11B5/02 ,  G11B5/314 ,  G11B7/1387 ,  G11B11/10536 ,  G11B11/10554 ,  G11B2005/0002 ,  G11B2005/0021

摘要： To reduce background light generated in a circumference of a scatterer in a head for a thermally assisted magnetic recording device using a scatterer having conductivity as an optical near-field generating element, a coil for generating a magnetic field is placed on a bottom portion of a slider, and an optical near-field generating element is placed in an inside of the coil. At this time, an inner diameter of the coil is set not larger than a wavelength of incident light, an interval between leader lines each for conducting an electric current to the coil is set not larger than a half of the wavelength of the light, and the coil for generating the magnetic field is caused to function as a shield for suppressing the background light.

摘要翻译： 为了减少使用具有导电性的散射体作为光学近场产生元件的热辅助磁记录装置的头部中的散射体周围产生的背景光，用于产生磁场的线圈被放置在 滑块和光学近场产生元件放置在线圈的内部。 此时，将线圈的内径设定为不大于入射光的波长，将用于向线圈导通电流的引出线之间的间隔设定为不大于光的一半波长， 使得用于产生磁场的线圈用作用于抑制背景光的屏蔽。

公开(公告)号：US20100196161A1

公开(公告)日：2010-08-05

申请号：US12667495

申请日：2007-07-02

申请人： Takakazu Uebori ,  Kimio Nakamura

发明人： Takakazu Uebori ,  Kimio Nakamura

IPC分类号： B63H1/06

CPC分类号： A63H27/12

摘要： When an R/C helicopter of a single rotor type is configured to have a small size and light weight to be used indoors, a flying operation thereof can be stabilized and operability can be improved.A center hub that supports a rotor head to a mainmast is divided into an upper center hub and a lower center hub, and the upper and the lower center hubs are fixed around the shaft of the mainmast with a predetermined angle. A phase angle of a main rotor as an output with respect to an operation input from a swash plate becomes an acute angle, and the main rotor and a stabilizer are mounted to rotate with a phase difference of the acute angle.

摘要翻译： 当单转子类型的R / C直升机被配置为具有体积小且重量轻的室内使用时，其飞行操作可以被稳定并且可以提高可操作性。 将转子头支撑到主仓的中心毂分为上中心毂和下中心毂，上下中心毂以预定角度固定在主仓的轴上。 相对于来自斜盘的操作输入的主转子作为输出的相位角成为锐角，主转子和稳定器安装成以锐角的相位差旋转。

公开(公告)号：US07670873B2

公开(公告)日：2010-03-02

申请号：US11435851

申请日：2006-05-18

申请人： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

发明人： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75304 ,  H01L2224/75744 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.

摘要翻译： 一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。 半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板 施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。 在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合， 基板向凹部弯曲。

公开(公告)号：US20090320270A1

公开(公告)日：2009-12-31

申请号：US12525019

申请日：2007-03-15

申请人： Naoki Ishikawa ,  Hidehiko Kira ,  Kimio Nakamura ,  Takayoshi Matsumura

发明人： Naoki Ishikawa ,  Hidehiko Kira ,  Kimio Nakamura ,  Takayoshi Matsumura

IPC分类号： B23P11/00 ,  B25B27/00

CPC分类号： G11B5/4833 ,  Y10T29/49908 ,  Y10T29/53961

摘要： There are provided a method of assembling a carriage assembly that can uniformly crimp edge portions of spacer holes of spacer portions and keep the spacer portions flat, thereby maintaining the angles of suspensions with high accuracy, and an assembling apparatus that uses such method.The method includes an attaching step of positioning spacer holes 12b of suspensions 12 on through-holes 10a formed in front end portions of a plurality of carriage arms 10 that have been disposed in parallel and attaching the suspensions to the respective carriage arms; and a crimping step of pressing a ball 20 with a diameter that is equal to or larger than an inner diameter of the spacer holes 12b using a pressing member 40 so as to pass the ball successively through the spacer holes 12b and thereby crimp spacer hole 12b edge portions of the spacer portions 12a and attach the suspensions 12 to the carriage arms 10, wherein during the crimping step, the ball 20 is placed in a vicinity of the center axis a at least when the ball 20 is located between the carriage arms 10.

摘要翻译： 提供了一种组装支架组件的方法，其可以均匀地压接间隔件部分的间隔孔的边缘部分并且使间隔部分保持平坦，从而以高精度保持悬架的角度，以及使用这种方法的组装装置。 该方法包括将悬架12的间隔孔12b定位在形成在已经平行布置的多个托架臂10的前端部的通孔10a上并将悬架附接到相应的托架臂上的安装步骤; 以及使用按压部件40按压直径等于或大于间隔孔12b的内径的球20的压接步骤，以使球连续通过间隔孔12b，从而压接间隔孔12b 间隔部分12a的边缘部分并将悬架12附接到托架臂10，其中在压接步骤期间，至少当球20位于托架臂10之间时，将球20放置在中心轴线a附近 。

公开(公告)号：US20090015959A1

公开(公告)日：2009-01-15

申请号：US12216722

申请日：2008-07-10

申请人： Kimio Nakamura

发明人： Kimio Nakamura

IPC分类号： G11B5/02

CPC分类号： G11B5/02 ,  G11B5/314 ,  G11B2005/001 ,  G11B2005/0021

摘要： Heating power control is performed in thermally assisted magnetic recording using a patterned recording medium. Trial writing is performed by continuously changing a heating power intensity with respect to a pattern row of a trial writing area provided in plurality on the recording medium. From a reproduction signal thereof, a minimum heating power of recording that is a boundary power between recording and non-recording, and a maximum heating power of recording that is a boundary power between recording and a heating power by which recorded information of an adjacent pattern is deleted are determined to decide an optimum recording power.

摘要翻译： 使用图案化记录介质在热辅助磁记录中进行加热功率控制。 通过连续地改变相对于在记录介质上设置的多个试用书写区域的图案行的加热功率强度来执行试写。 从其再现信号，作为记录和非记录之间的边界电力的记录的最小加热功率和作为记录与加热功率之间的边界功率的记录的最大加热功率，通过该再生信号记录相邻图案的记录信息 被确定为确定最佳记录功率。

公开(公告)号：US20080049357A1

公开(公告)日：2008-02-28

申请号：US11774350

申请日：2007-07-06

申请人： Fumiko Akagi ,  Takuya Matsumoto ,  Kimio Nakamura

发明人： Fumiko Akagi ,  Takuya Matsumoto ,  Kimio Nakamura

IPC分类号： G11B5/127

CPC分类号： G11B5/1278 ,  G11B2005/001 ,  G11B2005/0021

摘要： The optimum head-field intensity for saturation recording is assumed to be 560×103 A/m or more. Under a condition where the recording track width of an information recording medium is equal to or less than 60 nm, the optimum head-field intensity Y satisfies the following inequalities (1) and (2): Y≧(X2−119×X+4135)×1000   (1) Y≦(X2−119×X+const)×1000   (2) where X denotes the nondimensional value of the recording track width divided by 10−9 m, and Y denotes a magnetic field (expressed in units of A/m) which a magnetic pole for head-field application applies to the center of the information recording medium in the direction of the thickness thereof. Note that const=−0.8×v2+33.7×v+4250 if the relative velocity v between the head and the medium at the position of the head is less than 20 m/sec, or const=4600 if the velocity v is equal to or more than 20 m/sec.

摘要翻译： 饱和记录的最佳头场强度假设为560×3×3 / m以上。 在信息记录介质的记录磁道宽度等于或小于60nm的条件下，最佳磁头强度Y满足以下不等式（1）和（2）：<？in-line-formula description = “直线公式”end =“lead”？> Y> =（X <2> -119xX + 4135）x1000（1）<？in-line-formula description =“In-line Formulas” end =“tail”？> <？in-line-formula description =“In-line Formulas”end =“lead”？> Y <=（X ^{2 -119xX + const）x1000 ）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中X表示记录磁道宽度的无量纲值除以10 -9 -9，Y 表示用于头场施加的磁极在信息记录介质的中心沿其厚度方向施加的磁场（以A / m为单位表示）。 注意，如果头部和头部位置之间的头部和介质之间的相对速度v小于20 m / sec，则const = -0.8xv <2> + 33.7xv + 4250，或者const = 4600 if 速度v等于或大于20m / sec。}

公开(公告)号：US20070264752A1

公开(公告)日：2007-11-15

申请号：US11634119

申请日：2006-12-06

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.

摘要翻译： 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。

公开(公告)号：US20070141825A1

公开(公告)日：2007-06-21

申请号：US11359426

申请日：2006-02-23

申请人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

发明人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

IPC分类号： H01L21/44

CPC分类号： H01L21/4853

摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.

摘要翻译： 接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。 该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于 垫子 以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。