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    Method of bonding flying leads
    1.
    发明授权
    Method of bonding flying leads 失效
    拼接飞线的方法

    公开(公告)号：US07582553B2

    公开(公告)日：2009-09-01

    申请号：US11359426

    申请日：2006-02-23

    Applicant: Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    Inventor： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    IPC: H01L21/44

    CPC classification number: H01L21/4853

    Abstract: The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.

    Abstract translation: 接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。 该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于 垫子 以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。

    Method of bonding flying leads
    2.
    发明申请
    Method of bonding flying leads 失效
    拼接飞线的方法

    公开(公告)号：US20070137026A1

    公开(公告)日：2007-06-21

    申请号：US11391362

    申请日：2006-03-29

    Applicant: Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    Inventor： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    IPC: B23K20/10

    CPC classification number: B23K20/10 ,  B23K2101/32 ,  H05K3/26 ,  H05K3/328 ,  Y10T29/49027 ,  Y10T29/4903

    Abstract: A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which at least one contact member that contacts the flying leads and applies the ultrasonic vibration thereto is rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the at least one contact member rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the at least one contact member to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.

    Abstract translation: 结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。 飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。 使用接合工具进行接合，其中至少一个接触飞行引线并且对其施加超声波振动的接触构件被可旋转地支撑。 接合工具沿与所述至少一个接触构件平行布置的与所述飞行导线接触的方向交叉的方向移动，并且所述超声波振动从所述至少一个接触构件施加到所述飞行 导致将相应的飞行引线超声波地结合到衬底焊盘。

    Method of flip-chip mounting
    3.
    发明申请
    Method of flip-chip mounting 有权
    倒装芯片安装方法

    公开(公告)号：US20070184582A1

    公开(公告)日：2007-08-09

    申请号：US11435851

    申请日：2006-05-18

    Applicant: Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

    Inventor： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

    IPC: H01L21/00

    CPC classification number: H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75304 ,  H01L2224/75744 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/00

    Abstract: A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.

    Abstract translation: 一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。 半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板 施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。 在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合， 基板向凹部弯曲。

    Method of bonding flying leads
    4.
    发明申请
    Method of bonding flying leads 审中-公开
    拼接飞线的方法

    公开(公告)号：US20070137025A1

    公开(公告)日：2007-06-21

    申请号：US11359427

    申请日：2006-02-23

    Applicant: Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    Inventor： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    IPC: B23K1/06

    CPC classification number: H05K3/361 ,  G11B5/4846 ,  H05K3/328 ,  H05K2201/0397 ,  H05K2201/10765 ,  H05K2203/0285 ,  Y10T29/49027 ,  Y10T29/4903

    Abstract: The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: positioning the flying leads to correspond to the pads arranged parallel; and applying supersonic vibrations to a bonding tool so as to respectively bond the flying leads to the pads. And widths of the flying leads are wider than those of the pads, and supersonic vibrations are applied to the bonding tool, which is pressing the flying leads onto the pads, so that the flying leads are respectively supersonic-bonded to the pads.

    Abstract translation: 接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。 该方法包括以下步骤：将飞行引线对准于平行布置的焊盘; 以及将超音速振动施加到接合工具，以将所述飞行引线分别连接到所述焊盘。 并且飞行引线的宽度比焊盘的宽度宽，并且超音速振动被施加到将飞行引线压在焊盘上的焊接工具，使得飞行引线分别超音速粘合到焊盘。

    Method of bonding flying leads
    5.
    发明授权
    Method of bonding flying leads 失效
    拼接飞线的方法

    公开(公告)号：US07367108B2

    公开(公告)日：2008-05-06

    申请号：US11391362

    申请日：2006-03-29

    Applicant: Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    Inventor： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    IPC: B23K20/10

    CPC classification number: B23K20/10 ,  B23K2101/32 ,  H05K3/26 ,  H05K3/328 ,  Y10T29/49027 ,  Y10T29/4903

    Abstract: A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the plurality of contact members (at least one contact member) rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the plurality of contact members (at least one contact member) to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.

    Abstract translation: 结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。 飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。 使用接合工具进行接合，其中（至少一个接触构件）多个接触飞行引线并且施加（施加）超声波振动的接触构件被可旋转地支撑。 接合工具沿与多个接触构件（至少一个接触构件）平行布置的飞行导线与飞行导线接触的方向移动，并且从多个接触构件 对飞行的接触构件（至少一个接触构件）导致将相应的飞行引线超声波地结合到衬底焊盘。

    Method of flip-chip mounting
    6.
    发明授权
    Method of flip-chip mounting 有权
    倒装芯片安装方法

    公开(公告)号：US07670873B2

    公开(公告)日：2010-03-02

    申请号：US11435851

    申请日：2006-05-18

    Applicant: Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

    Inventor： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

    IPC: H01L21/00 ,  H01L21/44

    CPC classification number: H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75304 ,  H01L2224/75744 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/00

    Abstract: A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.

    Abstract translation: 一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。 半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板 施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。 在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合， 基板向凹部弯曲。

    Method of bonding flying leads
    7.
    发明申请
    Method of bonding flying leads 失效
    拼接飞线的方法

    公开(公告)号：US20070141825A1

    公开(公告)日：2007-06-21

    申请号：US11359426

    申请日：2006-02-23

    Applicant: Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    Inventor： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    IPC: H01L21/44

    CPC classification number: H01L21/4853

    Abstract: The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.

    Abstract translation: 接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。 该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于 垫子 以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。

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