公开(公告)号：US09287158B2

公开(公告)日：2016-03-15

申请号：US11630512

申请日：2006-04-18

Applicant: Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

Inventor： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  H01L21/302 ,  H01L21/461 ,  H01L21/687 ,  B24B9/06 ,  B24B49/04 ,  H01L21/67

CPC classification number: H01L21/67219 ,  B24B9/065 ,  B24B49/04 ,  H01L21/302 ,  H01L21/461 ,  H01L21/67253 ,  H01L21/68707 ,  H01L21/68728

Abstract: A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

Abstract translation: 基板处理装置包括：第一抛光单元，用于抛光基板周边部分;第一清洗单元，用于清洁基板;二次清洁和干燥单元，用于干燥在主清洗单元中清洁的基板;以及测量单元， 测量衬底的周边部分。 测量单元包括用于在第一和第二抛光单元中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。

公开(公告)号：US08047896B2

公开(公告)日：2011-11-01

申请号：US12310364

申请日：2007-10-02

Applicant: Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

Inventor： Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC: B24B49/00 ,  B24B21/20

CPC classification number: B24B21/20 ,  B24B21/004 ,  B24B21/04

Abstract: The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).

Abstract translation: 本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗量 的研磨带的外径。 该抛光装置包括：抛光带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45） 43）从研磨带供给卷轴（46）经由研磨头（44）。 抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加转矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供给卷轴（46）的旋转角度的旋转角度检测器REa。

公开(公告)号：US20110256811A1

公开(公告)日：2011-10-20

申请号：US13080821

申请日：2011-04-06

Applicant: Masayuki NAKANISHI ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

Inventor： Masayuki NAKANISHI ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

IPC: B24B1/00

CPC classification number: B24B21/002 ,  B24B9/065 ,  B24B21/04 ,  B24B37/042

Abstract: A polishing method can obtain a good polishing profile which, for example, will not cause peeling of a semiconductor layer from a silicon substrate. The polishing method includes: positioning a polishing head at a position above a polishing start position in an edge portion of a rotating substrate; lowering a polishing tool of the polishing head until the polishing tool comes into contact with the polishing start position in the edge portion of the rotating substrate and a pressure between the polishing tool and the polishing start position reaches a set pressure; allowing the polishing tool to stay at the polishing start position for a predetermined amount of time; and then moving the polishing head toward a peripheral end of the substrate while keeping the polishing tool in contact with the edge portion of the rotating substrate at the set pressure.

Abstract translation: 抛光方法可以获得良好的抛光轮廓，其例如不会导致半导体层从硅衬底剥离。 抛光方法包括：将抛光头定位在旋转基板的边缘部分中的抛光开始位置上方的位置; 降低抛光头的抛光工具，直到研磨工具与旋转基板的边缘部分中的抛光开始位置接触，并且抛光工具和抛光开始位置之间的压力达到设定压力; 允许抛光工具在抛光开始位置停留预定的时间量; 然后将抛光头朝向基板的周缘移动，同时保持抛光工具在旋转基板的边缘部分处于设定压力。

公开(公告)号：US08029333B2

公开(公告)日：2011-10-04

申请号：US11911808

申请日：2007-10-17

Applicant: Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

Inventor： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

IPC: B24B49/00

CPC classification number: B24B9/065 ,  B24B21/16

Abstract: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Abstract translation: 用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动 的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。 将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

公开(公告)号：US20110237164A1

公开(公告)日：2011-09-29

申请号：US12986481

申请日：2011-01-07

Applicant: Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

Inventor： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

IPC: B24B1/00 ,  B24B27/00

CPC classification number: B24B9/065 ,  B24B21/004 ,  B24B37/27

Abstract: A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.

Abstract translation: 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构3，其构造成水平地保持基板W并使基板W旋转; 以及设置在基板的周边部分附近的至少一个抛光头30。 抛光头30具有沿着基板W的圆周方向延伸的至少一个突起51a，51b，并且抛光头30被构造成通过突起51a，51b将抛光带23的抛光表面压靠在基板 基底W从上方或下方。

公开(公告)号：US20100137540A1

公开(公告)日：2010-06-03

申请号：US12531606

申请日：2008-03-21

Applicant: Kenya Ito ,  Hisao Oikawa ,  Koji Ohguma ,  Mikio Yamahiro

Inventor： Kenya Ito ,  Hisao Oikawa ,  Koji Ohguma ,  Mikio Yamahiro

IPC: C08F230/08

CPC classification number: C08F290/148 ,  C08F283/12 ,  C08F290/06 ,  C08F290/068 ,  C08G77/04 ,  C08G77/24 ,  C09D143/04 ,  Y10T428/31855

Abstract: A polymer and a treating agent (such as a surface-treating agent) are provided that have excellent characteristics in such properties as water repellency, oil repellency, antifouling property and charge controlling property. The polymer contains a structural unit derived from fluorosilsesquioxane having an addition polymerizable group, or contains a structural unit derived from fluorosilsesquioxane having an addition polymerizable group and a structural unit derived from organopolysiloxane having an addition polymerizable group. The treating agent contains the polymer. An article treated with the treating agent is also provided.

Abstract translation: 提供聚合物和处理剂（例如表面处理剂），其具有防水性，拒油性，防污性和电荷控制性等性能优异的特性。 聚合物含有衍生自具有加成聚合基团的氟代倍半硅氧烷的结构单元，或含有衍生自具有加聚性基团的氟代倍半硅氧烷的结构单元和衍生自具有加成聚合基团的有机聚硅氧烷的结构单元。 处理剂含有聚合物。 还提供了用处理剂处理的制品。

公开(公告)号：US20090093192A1

公开(公告)日：2009-04-09

申请号：US11911808

申请日：2006-04-18

Applicant: Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

Inventor： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

IPC: B24B9/00 ,  B24B49/12

CPC classification number: B24B9/065 ,  B24B21/16

Abstract: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Abstract translation: 用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动 的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。 将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

公开(公告)号：US20090004952A1

公开(公告)日：2009-01-01

申请号：US12213186

申请日：2008-06-16

Applicant: Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

Inventor： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

IPC: B24B21/02 ,  B24B21/22

CPC classification number: B24B21/002 ,  B24B9/065 ,  H01L21/68707 ,  H01L21/68792

Abstract: A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold the workpiece, a polishing head configured to bring the polishing tape into contact with the workpiece, a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot lying on a predetermined point.

Abstract translation: 根据本发明的抛光装置适用于抛光半导体晶片等基板的周边。 抛光装置包括：保持部，其构造成保持工件;抛光头，被配置为使抛光带与工件接触;供给卷轴，其构造成将抛光带供给到抛光头;构造成倒带抛光的回卷卷轴 已经接触到工件的胶带和摆动机构，其构造成使得抛光头在其枢轴位于预定点上时进行摆动运动。

公开(公告)号：US20070004932A1

公开(公告)日：2007-01-04

申请号：US11517457

申请日：2006-09-08

Applicant: Mikio Yamahiro ,  Hisao Oikawa ,  Kenya Ito ,  Masami Tanaka ,  Nobumasa Ootake ,  Kenichi Watanabe

Inventor： Mikio Yamahiro ,  Hisao Oikawa ,  Kenya Ito ,  Masami Tanaka ,  Nobumasa Ootake ,  Kenichi Watanabe

IPC: C07F7/04 ,  C07F7/08

CPC classification number: C07F7/21 ,  C07F7/0876

Abstract: The object of the present invention is to provide a new kind of silicon compound having an ester-type organic functional group and a new method for providing a T8-silsesquioxane compound having a hydroxyl group by using said silicon compound as the starting material. A silicon compound represented by formula (1) is obtained through the production process characterized by using a silicon compound represented by formula (2). wherein: in formula (1), each of seven R1 group is independently selected from the group consisting of hydrogen, alkyl, substituted or unsubstituted aryl, and substituted or unsubstituted arylalkyl and A2 is a hydroxyl-terminal organic functional group, and in formula (2), each of R1 group is the same as R1 in formula (1), and A1 is an organic functional group containing an acyloxy group.

Abstract translation: 本发明的目的是提供一种具有酯型有机官能团的新型硅化合物和通过使用所述硅来提供具有羟基的T 8 -S-倍半硅氧烷化合物的新方法 化合物作为原料。 通过以式（2）表示的硅化合物为特征的制造方法得到式（1）所示的硅化合物。 其中：在式（1）中，七个R 1基团中的每一个独立地选自氢，烷基，取代或未取代的芳基和取代或未取代的芳基烷基和A 2， / SUP>是羟基末端有机官能团，并且在式（2）中，R 1和R 2各自与式（1）中的R 1相同， A 1是含有酰氧基的有机官能团。

公开(公告)号：US07129370B2

公开(公告)日：2006-10-31

申请号：US10664151

申请日：2003-09-17

Applicant: Mikio Yamahiro ,  Hisao Oikawa ,  Kenya Ito ,  Masami Tanaka ,  Nobumasa Ootake ,  Kenichi Watanabe

Inventor： Mikio Yamahiro ,  Hisao Oikawa ,  Kenya Ito ,  Masami Tanaka ,  Nobumasa Ootake ,  Kenichi Watanabe

IPC: C07F7/04

CPC classification number: C07F7/21 ,  C07F7/0876

Abstract: The object of the present invention is to provide a new kind of silicon compound having an ester-type organic functional group and a new method for providing a T8-silsesquioxane compound having a hydroxyl group by using said silicon compound as the starting material.A silicon compound represented by formula (1) is obtained through the production process characterized by using a silicon compound represented by formula (2). wherein: in formula (1), each of seven R1 group is independently selected from the group consisting of hydrogen, alkyl, substituted or unsubstituted aryl, and substituted or unsubstituted arylalkyl and A2 is a hydroxyl-terminal organic functional group, and in formula (2), each of R1 group is the same as R1 in formula (1), and A1 is an organic functional group containing an acyloxy group.

Abstract translation: 本发明的目的是提供一种具有酯型有机官能团的新型硅化合物和通过使用所述硅来提供具有羟基的T 8 -S-倍半硅氧烷化合物的新方法 化合物作为原料。 通过以式（2）表示的硅化合物为特征的制造方法得到式（1）所示的硅化合物。 其中：在式（1）中，七个R 1基团中的每一个独立地选自氢，烷基，取代或未取代的芳基和取代或未取代的芳基烷基和A 2， / SUP>是羟基末端有机官能团，并且在式（2）中，R 1和R 2各自与式（1）中的R 1相同， A 1是含有酰氧基的有机官能团。