公开(公告)号：US4431449A

公开(公告)日：1984-02-14

申请号：US499412

申请日：1983-06-01

申请人： Kenneth R. Dillon ,  Richard L. Terchek

发明人： Kenneth R. Dillon ,  Richard L. Terchek

IPC分类号： B22F1/00 ,  B22F3/26 ,  B22F3/00

CPC分类号： B22F1/0048 ,  B22F3/26 ,  A61F2002/30968 ,  B22F2998/00 ,  B22F2998/10 ,  Y10T428/1216

摘要： A molded, non-refractory metal article is made by molding in a flexible mold a plastic mixture of non-refractory, spherical metal powders and a heat-fugitive binder comprising thermoplastic material to form a green article of predetermined shape and dimensions, heating the green article to remove said binder and consolidate the non-refractory spherical powders in the form of a porous, monolithic skeleton of necked particles of non-refractory metal, infiltrating the skeleton with a molten metal having a melting point that is at least 25.degree. C. less than the melting point of the lowest melting of said spherical, non-refractory metal particles, and cooling the infiltrated skeleton thereby forming a homogeneous, void-free, non-refractory metal article of two intermeshed metal matrices.

摘要翻译： 模制的非难熔金属制品通过在柔性模具中模塑非难熔性球形金属粉末的塑料混合物和包含热塑性材料的散热性粘合剂来形成预定形状和尺寸的绿色制品，加热绿色 制品，以去除所述粘合剂并将非难熔金属的颈缩颗粒的多孔整体骨架形式的非耐火球形粉末固化，用熔点至少为25℃的熔融金属渗透骨架。 小于所述球形，非难熔金属颗粒的最低熔点的熔点，并且冷却渗透的骨架，从而形成两个相互啮合的金属基体的均匀，无空隙的非难熔金属制品。

公开(公告)号：US06984935B2

公开(公告)日：2006-01-10

申请号：US10936420

申请日：2004-09-08

申请人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Paul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

发明人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Paul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

IPC分类号： H01J17/49

CPC分类号： H01J9/242 ,  B29C33/303 ,  B29C33/40 ,  B29C33/424 ,  H01J9/241 ,  H01J2211/36 ,  H01J2217/49

摘要： A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.

公开(公告)号：US06802754B2

公开(公告)日：2004-10-12

申请号：US10626285

申请日：2003-07-24

申请人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Paul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

发明人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Paul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

IPC分类号： H01J924

CPC分类号： H01J9/242 ,  B29C33/303 ,  B29C33/40 ,  B29C33/424 ,  H01J9/241 ,  H01J2211/36 ,  H01J2217/49

摘要： A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.

摘要翻译： 使用微结构模具在图案化衬底上模制和对准微结构的方法。 将包含陶瓷粉末和可固化短效粘合剂的混合物的浆料放置在可拉伸模具的微结构和图案化基底之间。 可以拉伸模具以使模具的微结构与图案化基底的预定部分对准。 浆料在模具和基材之间硬化。 然后去除模具以留下粘附到基底上的微结构并与衬底的图案对准。 可以将微结构热加热以除去粘合剂并最佳地烧制以烧结陶瓷粉末。

公开(公告)号：US06726884B1

公开(公告)日：2004-04-27

申请号：US08665606

申请日：1996-06-18

申请人： Kenneth R. Dillon ,  Richard P. Merry ,  Stephen M. Sanocki

发明人： Kenneth R. Dillon ,  Richard P. Merry ,  Stephen M. Sanocki

IPC分类号： B01D5334

CPC分类号： F01N13/14 ,  F01N3/0211 ,  F01N3/2853 ,  Y02T10/20 ,  Y10T428/131

摘要： An insulating liner for use with exhaust system or pollution control devices such as catalytic converters and diesel particulate filters or traps. The insulating liner is shown in relation to an end cone for use with a catalytic converter. The end cone includes an outer metallic end cone and a free-standing insulating cone positioned within the outer metallic end cone. A substantial portion of the inner surface of the insulating liner is exposed to hot exhaust gas from an internal combustion engine. The insulating liner is preferably formed of a composite containing inorganic fibers and/or particles, which makes the insulating liner rigid, yet capable of withstanding repeated mechanical and thermal shocks.

摘要翻译： 用于排气系统或污染控制装置如催化转化器和柴油颗粒过滤器或疏水阀的绝缘衬垫。 绝缘衬垫相对于与催化转化器一起使用的端锥体示出。 端锥包括外金属端锥体和位于外金属端锥体内的独立绝缘锥体。 绝缘衬套的内表面的大部分暴露于来自内燃机的热废气。 绝缘衬垫优选由含有无机纤维和/或颗粒的复合材料形成，这使得绝缘衬垫刚性，但能耐受重复的机械和热冲击。

公开(公告)号：US06713526B2

公开(公告)日：2004-03-30

申请号：US10057599

申请日：2002-01-24

申请人： Kenneth R. Dillon ,  Kyung H. Moh ,  Thomas Edward Wood ,  Raymond C. Chiu ,  Vincent Wen-Shiuan King ,  Richard P. Rusin

发明人： Kenneth R. Dillon ,  Kyung H. Moh ,  Thomas Edward Wood ,  Raymond C. Chiu ,  Vincent Wen-Shiuan King ,  Richard P. Rusin

IPC分类号： C08F246

CPC分类号： H01J9/242 ,  C03C8/14 ,  C03C8/16 ,  C03C17/04 ,  H01J2211/36 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/24545 ,  Y10T428/252 ,  Y10T428/2991 ,  Y10T428/31612

摘要： A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.

摘要翻译： 一种用于使用模具在基底上形成陶瓷微结构的可固化浆料。 浆料是陶瓷粉末，短效粘合剂和稀释剂的混合物。 陶瓷粉末的软化温度低于约400℃至600℃，热膨胀系数与基材的热膨胀系数相当。 短暂的粘合剂能够辐射固化，电子束固化或热固化。 稀释剂在固化粘合剂之后使用模具促进脱模性能，或者在脱粘时快速且完全地烧结粘合剂。

公开(公告)号：US06616887B2

公开(公告)日：2003-09-09

申请号：US09972655

申请日：2001-10-05

申请人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Paul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

发明人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Paul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

IPC分类号： B29C3342

CPC分类号： H01J9/242 ,  B29C33/303 ,  B29C33/40 ,  B29C33/424 ,  H01J9/241 ,  H01J2211/36 ,  H01J2217/49

摘要： A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.

公开(公告)号：US06352763B1

公开(公告)日：2002-03-05

申请号：US09221007

申请日：1998-12-23

申请人： Kenneth R. Dillon ,  Kyung H. Moh ,  Thomas Edward Wood ,  Raymond C. Chiu ,  Vincent Wen-Shiuan King ,  Richard P. Rusin ,  Timothy Lee Hoopman ,  Paul Edward Humpal

发明人： Kenneth R. Dillon ,  Kyung H. Moh ,  Thomas Edward Wood ,  Raymond C. Chiu ,  Vincent Wen-Shiuan King ,  Richard P. Rusin ,  Timothy Lee Hoopman ,  Paul Edward Humpal

IPC分类号： B32B1800

CPC分类号： H01J9/242 ,  C03C8/14 ,  C03C8/16 ,  C03C17/04 ,  H01J2211/36 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/24545 ,  Y10T428/252 ,  Y10T428/2991 ,  Y10T428/31612

摘要： A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.

公开(公告)号：US4455354A

公开(公告)日：1984-06-19

申请号：US207196

申请日：1980-11-14

申请人： Kenneth R. Dillon ,  Richard L. Terchek

发明人： Kenneth R. Dillon ,  Richard L. Terchek

IPC分类号： B22F3/02 ,  B22F3/26 ,  C22C1/00 ,  C22C1/05

CPC分类号： B22F3/26 ,  C22C1/051 ,  B22F2998/00 ,  B22F2998/10 ,  Y10T428/1216 ,  Y10T428/12167

摘要： The shrinkage normally encountered when molding a mixture of spherical cobalt-containing particles and thermoplastic binder, heating the resulting molded article to degrade the binder and form a porous preform, and infiltrating the same is counteracted by adding finely divided elemental iron or elemental nickel to the spherical cobalt-containing particles. In addition to improving dimensional control, the elemental powder addition increases impact strength while maintaining hardness.

摘要翻译： 在模制球形含钴颗粒和热塑性粘合剂的混合物时通常遇到的收缩，加热所得模制品以降解粘合剂并形成多孔预型体，并且通过将细分的铁或元素镍加入到 球形含钴颗粒。 除了改善尺寸控制之外，元素粉末添加增加冲击强度同时保持硬度。

公开(公告)号：USRE40967E1

公开(公告)日：2009-11-10

申请号：US11393165

申请日：2006-03-29

申请人： Kenneth R. Dillon ,  Kyung H. Moh ,  Thomas E. Wood ,  Raymond C. Chiu ,  Vincent W. King ,  Richard P. Rusin

发明人： Kenneth R. Dillon ,  Kyung H. Moh ,  Thomas E. Wood ,  Raymond C. Chiu ,  Vincent W. King ,  Richard P. Rusin

IPC分类号： C08F2/46

CPC分类号： H01J9/242 ,  C03C8/14 ,  C03C8/16 ,  C03C17/04 ,  H01J2211/36 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/24545 ,  Y10T428/252 ,  Y10T428/2991 ,  Y10T428/31612

摘要： A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.

公开(公告)号：US06325610B2

公开(公告)日：2001-12-04

申请号：US09779207

申请日：2001-02-08

申请人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Paul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

发明人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Paul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

IPC分类号： B29C3508

CPC分类号： H01J9/242 ,  B29C33/303 ,  B29C33/40 ,  B29C33/424 ,  H01J9/241 ,  H01J2211/36 ,  H01J2217/49

摘要： An apparatus for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.

摘要翻译： 一种使用微结构模具在图案化衬底上模制和对准微结构的装置。 将包含陶瓷粉末和可固化短效粘合剂的混合物的浆料放置在可拉伸模具的微结构和图案化基底之间。 可以拉伸模具以使模具的微结构与图案化基底的预定部分对准。 浆料在模具和基材之间硬化。 然后去除模具以留下粘附到基底上的微结构并与衬底的图案对准。 可以将微结构热加热以除去粘合剂并最佳地烧制以烧结陶瓷粉末。