摘要:
The semiconductor intergrated circuit comprises: a circuit that executes a predetermined process and a switching circuit that selects a power impedance, The switching circuit selects the power impedance, in accordance with a variation in voltage supplied to the circuit, so that a resonant frequency of the semiconductor integrated circuit is different from a operation frequency of the circuit.
摘要:
A signal transmission system includes: a transmitting section including a first carrier signal generating section configured to generate a carrier signal for modulation and a first frequency converting section configured to generate a transmission signal by frequency-converting a transmission object signal by the carrier signal for modulation, the carrier signal for modulation being generated by the first carrier signal generating section; and a receiving section including a second carrier signal generating section configured to generate a carrier signal for demodulation and a second frequency converting section configured to frequency-convert the transmission signal received by the carrier signal for demodulation, the carrier signal for demodulation being generated by the second carrier signal generating section.
摘要:
A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要:
An electric circuit device operable under a first power supply includes: a first circuit; a switch connecting the first circuit with the first power supply; a second circuit for producing a signal output; a control signal output unit for outputting a control signal in accordance with the signal output of the second circuit, wherein while the first circuit is supplied with a first power supply voltage via the switch by supplying of a driving voltage to the switch, the supply of the driving voltage is temporality cut off in response to the control signal.
摘要:
A signal processing device includes: signal processing circuits. The signal processing circuit includes an input/output circuit configured by an input circuit serving as an input interface of a signal of a predetermined frequency band and/or an output circuit serving as an output interface of a signal of the frequency band and performs transmission of a signal of the frequency band between the signal processing circuit and another signal processing circuit. The output circuits of one and another signal processing circuits include circuits having the same configuration. The input circuits of the one and another signal processing circuits include other circuits having the same configurations. The input/output circuits of the one and another signal processing circuits can perform transmission of a signal of the predetermined frequency band even when any one of transmission media having mutually different characteristics is mediated.
摘要:
Techniques for sending and receiving signals include pre-distorting signals before transmission across a communication path. The signals are pre-distorted as a function of a distortion on the communication path. In one embodiments, transmitter a broadcasts to receiver b and there is also a transmitter b broadcasting to receiver a. This return channel enables both transmitters a and b to have a priori information regarding the transmission medium and path the signal takes. In this way, the nature of the distortion or interference is known to the transmitter, therefore, it pre-distorts the transmitted signal to compensate for the receiver exceeding its capabilities in recovering signal.
摘要:
A signal transmission apparatus includes: a transmission section adapted to transmit a transmission object signal as a radio wave; a reception section adapted to receive the radio wave transmitted from the transmission section and output an electric signal corresponding to the received radio wave; and a connection section adapted to connect a first housing and a second housing of an electronic instrument pivotably around a center axis; the connection section having a radio signal transmission line formed therein by which wireless transmission can be carried out between the transmission section and the reception section.
摘要:
A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
摘要:
A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要:
A semiconductor device whose operational state is switched between a test state and a normal operational state according to a logical value of a signal input from the outside is provided. The semiconductor device includes a first power line, a second power line, a switch that is controlled by a signal line to couple/isolate the first power line to/from the second power line, a control circuit that outputs a control signal, and a state switching circuit that drives the signal line to couple/isolate the first power line to/from the second power line according to a logical value of the control signal when the input signal is one of logical values, whereas the state switching circuit drives the signal line to couple the first power line to the second power line when the first signal is the other logical value.