公开(公告)号：US09418790B2

公开(公告)日：2016-08-16

申请号：US13433320

申请日：2012-03-29

申请人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

发明人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

IPC分类号： H05K3/02 ,  H05K3/10 ,  H01G4/12 ,  H01G4/005 ,  H01G4/232

CPC分类号： H01G4/12 ,  H01G4/005 ,  H01G4/232

摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

摘要翻译： 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

公开(公告)号：US09131290B2

公开(公告)日：2015-09-08

申请号：US13362317

申请日：2012-01-31

申请人： Yohei Kishi ,  Miyuki Shirakawa ,  Masanao Suzuki ,  Yoshiteru Tsuchinaga ,  Shunsuke Takeuchi

发明人： Yohei Kishi ,  Miyuki Shirakawa ,  Masanao Suzuki ,  Yoshiteru Tsuchinaga ,  Shunsuke Takeuchi

IPC分类号： G10L19/025 ,  H04R3/00

CPC分类号： H04R3/00 ,  G10L19/025

摘要： An audio coding device includes a time frequency transform unit that, with respect to each of a plurality of channels included in an audio signal, generates a time frequency signal indicating frequency components at each time by performing a time frequency transform on a signal of the channel; a transient detection unit that detects a transient with respect to each of the plurality of channels so as to obtain a transient detection time; a transient time correction unit that, when a difference in transient detection times between an early detection channel in which the transient detection time is earliest and a late detection channel that is a channel other than the early detection channel among the plurality of channels is within a range in which the transient; a grid determination unit that, with respect to each of the plurality of channels, and a coding unit that codes.

摘要翻译： 音频编码装置包括：时频变换部，对于包含在音频信号中的多个频道中的每一个，通过对信道的信号进行时间频率变换，生成表示各时刻频率分量的时间频率信号 ; 瞬态检测单元，其针对所述多个通道中的每一个检测瞬态，以获得瞬时检测时间; 瞬时时间校正单元，其中当所述多个频道中的所述瞬时检测时间最早的早期检测信道与作为所述早期检测信道之外的信道的晚期检测信道之间的瞬时检测时间的差异在 短暂的范围; 对于多个信道中的每个信道的网格确定单元和对编码的编码单元。

公开(公告)号：US08804303B2

公开(公告)日：2014-08-12

申请号：US13439916

申请日：2012-04-05

申请人： Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi ,  Shigeyuki Kuroda

发明人： Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi ,  Shigeyuki Kuroda

IPC分类号： H01G4/228 ,  H01G4/005

CPC分类号： H01C7/008 ,  B05D5/12 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  H01L41/083

摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

摘要翻译： 一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。

公开(公告)号：US08631549B2

公开(公告)日：2014-01-21

申请号：US13051013

申请日：2011-03-18

申请人： Akihiro Motoki ,  Kenichi Kawasaki ,  Makoto Ogawa ,  Shigeyuki Kuroda ,  Shunsuke Takeuchi ,  Hideyuki Kashio

发明人： Akihiro Motoki ,  Kenichi Kawasaki ,  Makoto Ogawa ,  Shigeyuki Kuroda ,  Shunsuke Takeuchi ,  Hideyuki Kashio

IPC分类号： H01G4/228

CPC分类号： H01G4/30 ,  H01G4/232

摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.

摘要翻译： 层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤， 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

公开(公告)号：US08184424B2

公开(公告)日：2012-05-22

申请号：US12110484

申请日：2008-04-28

申请人： Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi ,  Shigeyuki Kuroda

发明人： Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi ,  Shigeyuki Kuroda

IPC分类号： H01G4/228 ,  H01G4/005

CPC分类号： H01C7/008 ,  B05D5/12 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  H01L41/083

摘要： A multilayer electronic component includes a laminate including insulating layers that are laminated to each other and internal electrodes provided along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate and an external electrode provided on the predetermined surface. The external electrode includes a plated film which is directly provided on the predetermined surface of the laminate so as to electrically connect edges of the internal electrodes exposed at the predetermined surface of the laminate, and at a boundary portion between each of the internal electrodes and the plated film, a counter diffusion layer is provided, in which a metal component in the plated film and a metal component in the internal electrodes are both detectable, and extend to both sides of the internal electrodes and the plated film, and, at a side of the internal electrodes.

摘要翻译： 多层电子部件包括层压体，该层压体包括彼此层压的绝缘层和沿着绝缘层之间的界面设置的内部电极，内部电极的边缘暴露在层压体的预定表面处，并且外部电极设置在预定表面上 。 外部电极包括直接设置在层压体的预定表面上的电镀膜，以电连接在层压体的预定表面处暴露的内部电极的边缘，以及在每个内部电极和 提供了一种反扩散层，其中镀膜中的金属成分和内部电极中的金属成分都是可检测的，并且延伸到内部电极和镀膜的两侧，并且在一侧 的内部电极。

公开(公告)号：US08125763B2

公开(公告)日：2012-02-28

申请号：US12490471

申请日：2009-06-24

申请人： Tatsunori Kobayashi ,  Akihiro Motoki ,  Makoto Ogawa ,  Toshiyuki Iwanaga ,  Shunsuke Takeuchi ,  Kenichi Kawasaki

发明人： Tatsunori Kobayashi ,  Akihiro Motoki ,  Makoto Ogawa ,  Toshiyuki Iwanaga ,  Shunsuke Takeuchi ,  Kenichi Kawasaki

IPC分类号： H01G4/228 ,  H01G4/005

CPC分类号： H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  Y10T29/435

摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.

摘要翻译： 多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触 并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。 包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。 铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。

公开(公告)号：US07933113B2

公开(公告)日：2011-04-26

申请号：US12055372

申请日：2008-03-26

申请人： Akihiro Motoki ,  Kenichi Kawasaki ,  Makoto Ogawa ,  Shigeyuki Kuroda ,  Shunsuke Takeuchi ,  Hideyuki Kashio

发明人： Akihiro Motoki ,  Kenichi Kawasaki ,  Makoto Ogawa ,  Shigeyuki Kuroda ,  Shunsuke Takeuchi ,  Hideyuki Kashio

IPC分类号： H01G4/228

CPC分类号： H01G4/30 ,  H01G4/232

摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.

摘要翻译： 层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤， 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

公开(公告)号：US20100328843A1

公开(公告)日：2010-12-30

申请号：US12821305

申请日：2010-06-23

申请人： Masahito SARUBAN ,  Makoto OGAWA ,  Toshiyuki IWANAGA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Shunsuke TAKEUCHI ,  Seiichi NISHIHARA ,  Kenichi KAWASAKI

发明人： Masahito SARUBAN ,  Makoto OGAWA ,  Toshiyuki IWANAGA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Shunsuke TAKEUCHI ,  Seiichi NISHIHARA ,  Kenichi KAWASAKI

IPC分类号： H01G4/008 ,  B05D5/12

CPC分类号： H01G4/2325 ,  H01G4/30 ,  H01L41/083 ,  H01L41/293

摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature. These steps preliminarily diffuse copper included in the plating layers, which has a relatively high diffusion velocity, into the internal electrodes primarily including nickel, thereby reducing a difference in diffusion velocity between copper and nickel at the top temperature, which causes the occurrence of voids.

摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。 这些步骤将包含在具有较高扩散速度的镀层中的铜初步扩散到主要包括镍的内部电极中，从而减少了在最高温度下铜和镍之间扩散速度的差异，这导致空隙的发生。

公开(公告)号：US20100020464A1

公开(公告)日：2010-01-28

申请号：US12405372

申请日：2009-03-17

申请人： Toshiyuki IWANAGA ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Seiichi NISHIHARA ,  Shuji MATSUMOTO

发明人： Toshiyuki IWANAGA ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Seiichi NISHIHARA ,  Shuji MATSUMOTO

IPC分类号： H01G4/30

CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G13/00 ,  Y10T29/435

摘要： A method for producing a multilayer ceramic electronic component includes a plating step including depositing a plating material on the ends of internal electrodes exposed at a predetermined surface of a laminate to form plating deposits primarily composed of a specific metal and growing the plating deposits so as to connect the plating deposits to each other to form a continuous plated layer. The specific metal primarily defining the plated layer is different from a metal defining the internal electrodes. The same or substantially the same metal as the metal defining the internal electrodes is present throughout the plated layer.

摘要翻译： 一种多层陶瓷电子部件的制造方法，其特征在于，具有：在层叠体的规定表面露出的内部电极的端部上形成电镀材料，形成主要由特定金属构成的镀覆层， 将电镀沉积物彼此连接以形成连续的镀层。 主要限定镀层的特定金属与限定内部电极的金属不同。 与定义内部电极的金属相同或基本相同的金属存在于整个镀层中。

公开(公告)号：US20090291317A1

公开(公告)日：2009-11-26

申请号：US12466435

申请日：2009-05-15

申请人： Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

发明人： Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

IPC分类号： B32B5/16 ,  B05D5/12

CPC分类号： H01G4/005 ,  H01G4/008 ,  H01G4/232

摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.

摘要翻译： 层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。 限定上镀膜的金属颗粒可以具有0.5μm或更小的平均尺寸。 限定下镀层的金属颗粒可以是Cu颗粒。