摘要:
Provided is a manufacturing method of a semiconductor device wherein the generation of voids is prevented in aluminum-based electrodes or the like. The method is suitable for manufacturing a semiconductor device adapted for vehicles, which is required to have a high reliability. However, it is very difficult that power semiconductor devices such as power MOSFETs, in particular, trench gate type power MOS devices are formed without having any void since the thickness of aluminum-based electrodes thereof is as large as about 3500 to 5500 nm (2.5 μm or more). In the present invention, a method is provided wherein at the time of forming an aluminum-based electrode metal film positioned over a wafer and having a thickness of 2.5 μm or more over a highland/lowland-repeated region in a line and space form by sputtering, the temperature of the wafer is set to 400° C. or higher and lower than 500° C.
摘要:
An apparatus for continuously sterilizes and fills food and medicines containing solids. In this apparatus, a filler nozzle is disposed downstream of a back-pressure tank, and a control valve is interposed between the back-pressure tank and the filler nozzle for controlling the flow rate of the products which are delivered from the sterilizer to the back-pressure tank. The control valve avoids a remarkable pressure loss which might otherwise be invited in the series passages of the apparatus. The outflow of air from the back pressure tank to the filler nozzle is minimized so that the back pressure can be applied to the sterilizer as stably as possible. At the same time, the sterilized products are continuously fed to the filler nozzle so that they can be packed simultaneously with their upstream sterilization.
摘要:
A sterilization apparatus suitable for sterilizing food and medicines containing solid particles, which comprises a forcing device, a sterilizer, a backpressure tank and a backpressure device. The sterilization apparatus is sterilized beforehand under application of a backpressure by employing the forcing device and the backpressure device. The products are sterilized in the sterilizer under pressure by the forcing device and the backpressure tank, and then the sterilized products are collected in the backpressure tank.
摘要:
A filling apparatus for charging a liquid or highly viscous product into containers. The apparatus has a pressurizing tank, buffer tank, filling tank and a filling machine. The tanks have controllable pneumatic internal pressure. The product is fed at a high pressure from the pressurizing tank to the buffer tank and, after decreasing the pressure in the buffer tank, the product is transferred at the normal or low pressure from the buffer tank to the filling tank and filling machine.
摘要:
Embodiments of the present invention improve the efficiency of a cleaning process for cleaning a component part of a magnetic disk drive in a magnetic disk drive manufacturing line. According to one embodiment, a magnetic disk part cleaning apparatus is included in a head stack assembly (HSA) cleaning line for cleaning head stack assemblies of magnetic disk drives included in a magnetic disk drive manufacturing line. The magnetic disk part cleaning apparatus is disposed between a HSA assembly line for assembling a head stack assembly, and head disk assembly (HDA) assembly line for assembling a head disk assembly including the head stack assembly and is connected directly to at least either of the HSA assembly line and the HDA assembly line.
摘要:
Embodiments of the present invention effectively control utilizing a spoiler, the windage vibration of a magnetic head caused by the airflow generated in accordance with rotation of a magnetic disk, while reducing the dust flowing in on the downstream side of the spoiler. According to one embodiment, a spoiler is provided with wings facing a plurality of magnetic disks and a supporting section for the wings is disposed on the upstream side of a head stack assembly in the airflow direction in accordance with the rotation of the magnetic disks. Further, the wings each extend in a direction from the outer circumferences of the magnetic disks towards the spindle shaft while reducing the width of the wing, and is formed to have the width of the wing in a range of 2.7% through 2.9% of the circumferential length of the magnetic disks in a range of two thirds of the length of the wing in a direction towards the spindle shaft from a region located at the outer circumferences of the magnetic disks.
摘要:
A suction-type metering robot hand comprising (a) a hollow suction pad having a gas-permeable obstacle at an opening of the suction pad; and (b) a main body of the robot hand supporting the suction pad and having a vacuum passage communicating with the suction pad. According to the robot hand of the present invention, the provision of the net on the opening of the suction pad makes it possible to suck fragile articles such as a fried cutlet, roasted bean curd, a piece of bread and the like to a desired place.
摘要:
A packing device for articles having directionality that includes imaging means for taking an image of the articles, means for recognizing the direction of the articles, first memory means for storing the direction of the articles, second memory means for storing the direction of the articles to be packed into a container, and means for calculating the difference in angle between the directions stored in the first and second memory means. The direction of the robot hand for grasping the articles is controlled by the output of the calculating means.
摘要:
A system having first, second and third pipes connected respectively to first, second and third ports of a three-way valve. A by-pass pipe is connected at its one end to one of the second and third ports after disconnecting the associated one of the second and third pipes therefrom and at the other end to the other of the second and third pipes prior to the cleaning operation of the system.
摘要:
Provided is a manufacturing method of a semiconductor device wherein the generation of voids is prevented in aluminum-based electrodes or the like. The method is suitable for manufacturing a semiconductor device adapted for vehicles, which is required to have a high reliability. However, it is very difficult that power semiconductor devices such as power MOSFETs, in particular, trench gate type power MOS devices are formed without having any void since the thickness of aluminum-based electrodes thereof is as large as about 3500 to 5500 nm (2.5 μm or more). In the present invention, a method is provided wherein at the time of forming an aluminum-based electrode metal film positioned over a wafer and having a thickness of 2.5 μm or more over a highland/lowland-repeated region in a line and space form by sputtering, the temperature of the wafer is set to 400° C. or higher and lower than 500° C.