公开(公告)号：US20090323300A1

公开(公告)日：2009-12-31

申请号：US12298337

申请日：2007-04-24

申请人： Daisuke Fujimoto ,  Yasuyuki Mizuno ,  Kazutoshi Danjobara ,  Katsuyuki Masuda ,  Hikari Murai

发明人： Daisuke Fujimoto ,  Yasuyuki Mizuno ,  Kazutoshi Danjobara ,  Katsuyuki Masuda ,  Hikari Murai

IPC分类号： H05K1/14 ,  B32B7/12 ,  B32B5/16 ,  B32B3/10 ,  B32B27/34 ,  B32B27/04 ,  H05K1/00

CPC分类号： H05K3/386 ,  B32B5/022 ,  B32B5/024 ,  B32B7/12 ,  B32B15/08 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/281 ,  B32B27/285 ,  B32B27/306 ,  B32B27/32 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2307/718 ,  B32B2457/08 ,  C09J163/00 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0355 ,  Y10T428/24355 ,  Y10T428/254 ,  Y10T428/265 ,  Y10T428/2852 ,  Y10T428/31721 ,  Y10T442/2459

摘要： The invention provides an adhesive layer-attached conductive foil and a conductor-clad laminated sheet which allow transmission loss to be satisfactorily reduced especially in the high-frequency band, which exhibit excellent heat resistance, and which allow production of printed circuit boards that are adequately resistant to interlayer peeling. The adhesive layer-attached conductive foil of the invention is provided with a conductive foil and an adhesive layer formed on the conductive foil, wherein the adhesive layer is composed of a curable resin composition containing component (A): a polyfunctional epoxy resin, component (B): a polyfunctional phenol resin and component (C): a polyamideimide. The conductor-clad laminated sheet of the invention comprises an insulating layer, a conductive layer situated facing the insulating layer, and an adhesive layer sandwiched between the insulating layer and conductive layer, and the adhesive layer is composed of a cured resin composition containing components (A), (B) and (C).

摘要翻译： 本发明提供一种附着粘合剂层的导电箔和导体包覆层叠片，特别是在耐高温性优异的高频带中，能够令人满意地降低传输损失，并且能够适当地制造印刷电路板 耐层间剥离。 本发明的带粘合剂层的导电箔具有形成在导电箔上的导电箔和粘合层，其中粘合层由含有组分（A）的固化性树脂组合物组成：多官能环氧树脂，组分（ B）：多官能酚树脂和（C）成分：聚酰胺酰亚胺。 本发明的导体包覆层压片包括绝缘层，面向绝缘层的导电层和夹在绝缘层和导电层之间的粘合层，并且粘合层由含有组分的固化树脂组合物 A），（B）和（C）。

公开(公告)号：US08501870B2

公开(公告)日：2013-08-06

申请号：US13615167

申请日：2012-09-13

申请人： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

发明人： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC分类号： C08F8/00

CPC分类号： H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US20120214009A1

公开(公告)日：2012-08-23

申请号：US13463541

申请日：2012-05-03

申请人： Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

发明人： Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

IPC分类号： B32B15/08 ,  B32B37/10 ,  B05D5/12 ,  C08G81/02 ,  C09D109/00

CPC分类号： H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有1,2-乙烯基和（C）交联剂，处于相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08568891B2

公开(公告)日：2013-10-29

申请号：US13463541

申请日：2012-05-03

申请人： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

发明人： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC分类号： B32B15/08

CPC分类号： H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有1,2-乙烯基和（C）交联剂，处于相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US20130000843A1

公开(公告)日：2013-01-03

申请号：US13615167

申请日：2012-09-13

申请人： Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

发明人： Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

IPC分类号： C08L47/00 ,  H05K3/46 ,  C08K3/36 ,  H05K3/00 ,  C08K5/03 ,  C08K5/3417

CPC分类号： H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08277948B2

公开(公告)日：2012-10-02

申请号：US12279571

申请日：2007-02-14

申请人： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

发明人： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC分类号： B32B15/08

CPC分类号： H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US20100233495A1

公开(公告)日：2010-09-16

申请号：US12279571

申请日：2007-02-14

申请人： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

发明人： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC分类号： C08L71/12 ,  C08L73/00 ,  B32B15/08

CPC分类号： H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。