-
公开(公告)号:US20250019538A1
公开(公告)日:2025-01-16
申请号:US18712186
申请日:2022-11-17
Applicant: KANEKA AMERICAS HOLDING, INC.
Inventor: Shusuke Yoshihara , Greg Zientek , Frank Muchna
Abstract: A biodegradable polymer composition includes a biodegradable matrix polymer, and 0.1 to 5 wt. % of a processing aid having a weight average molecular weight of at least 20,000 g/mol. The processing aid is a reaction product of an acrylate monomer and, optionally, at least one copolymerizable monomer. The amount of the acrylate monomer in the processing aid ranges from 50 wt % to 100 wt %, and the amount of the copolymerizable monomer in the processing aid ranges from 0 wt % to 50 wt %. A biodegradable polymer article includes the biodegradable polymer composition. A method includes mixing a biodegradable matrix polymer with 0.1 to 5 wt. % of a processing aid, having a weight average molecular weight of at least 20,000 g/mol above melting temperatures of the biodegradable matrix polymer and the processing aid, to produce a biodegradable polymer composition.
-
公开(公告)号:US11873423B2
公开(公告)日:2024-01-16
申请号:US17434612
申请日:2020-02-28
Applicant: Kaneka Americas Holding, Inc.
Inventor: Wenwen Li , Ken Sutherland
IPC: C08G65/336 , C09J171/02 , C09J5/02 , C09J7/24 , C09J7/30
CPC classification number: C09J171/02 , C08G65/336 , C09J5/02 , C09J7/243 , C09J7/245 , C09J7/30 , C09J2423/006 , C09J2423/166 , C09J2427/006 , C09J2471/00
Abstract: A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.
-
公开(公告)号:US11873394B2
公开(公告)日:2024-01-16
申请号:US17251453
申请日:2019-06-13
Applicant: KANEKA AMERICAS HOLDING, INC.
Inventor: Yoshiaki Matsuoka
IPC: C08L27/06 , C08L25/08 , C08L33/02 , C08F212/08 , C08F220/06 , C08F220/18 , C08F220/14 , C08K3/26
CPC classification number: C08L27/06 , C08F212/08 , C08F220/06 , C08F220/14 , C08F220/1804 , C08K3/26 , C08K2003/265 , C08L2203/30
Abstract: A thermoplastic resin composition, including: 100 parts by weight of a thermoplastic resin (A); and 0.1 to 30 parts by weight of a processing aid (B). The processing aid (B) has a styrene-equivalent weight average molecular weight of from 300,000 to 8,000,000, and contains 60 wt % or more of a polymer (B1) obtained by polymerizing monomers comprising from 40 to 99.9 wt % of styrene, 0.1 to 10 wt % of an acid group-containing monomer, and 0 to 59.9 wt % of a vinyl monomer.
-
公开(公告)号:US20230265285A1
公开(公告)日:2023-08-24
申请号:US18024152
申请日:2021-09-02
Applicant: Kaneka Americas Holding, Inc.
Inventor: Jonathan Barrus , Ruolei Wang , Yoshiteru Masaoka
CPC classification number: C08L71/02 , C08K5/098 , C08J7/0427 , C08J7/043 , C08J2371/02 , C08J2323/28
Abstract: A moisture curable composition, a method of applying the same, and a composition including the same are disclosed herein. In some embodiments, a curable composition, comprises: a component (A) having an organic polymer containing reactive silicon groups represented by the following general formula (1): —Si(R13-a)Xa (1) wherein R1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, wherein X represents a hydrolyzable group, wherein each X is the same or different when two or more X are present, a is an integer from 1 to 3, when a is 1, each R1 may be the same or different, and when a is 2 or 3, each X may be the same or different; a component (B) having a chlorinated polyolefin polymer; and a component (C) having a carboxylic acid metal salt.
-
5.
公开(公告)号:US20240392086A1
公开(公告)日:2024-11-28
申请号:US18693642
申请日:2022-09-30
Applicant: Kaneka Americas Holding, Inc. , KANEKA CORPORATION
Inventor: Tianlei Zhou , Raymond Wong , Leonid Vorobyev
Abstract: An epoxy-based resin composition for clear fiber composites includes epoxy resins and an anhydride curing agent. The epoxy resins include at least one epoxy resin having a refractive index higher than a refractive index of glass fibers, and at least one cycloaliphatic epoxy resin. The amount of non-aromatic components in the epoxy-based resin composition is 60 wt % or higher, based on the total amount of the epoxy resins and the anhydride curing agent. An epoxy-based clear fiber composite for a cover plate in a solar cell panel includes a cured matrix resin and a fiber reinforcement. The epoxy-based clear fiber composite has a refractive index ranging from 1.520 to 1.530 or 1.550 to 1.565, while the difference between the refractive index of the fiber reinforcement and the cured matrix resin is 0.001 or less. A multi-layer epoxy-based clear fiber composite includes a plurality of the epoxy-based clear fiber composite.
-
公开(公告)号:US20230295001A1
公开(公告)日:2023-09-21
申请号:US18200832
申请日:2023-05-23
Applicant: Kaneka Americas Holding, Inc. , Texas A&M University
Inventor: Hung-Jue Sue , Joseph Baker , Fangqing Xia , Cong Liu
CPC classification number: C01G25/00 , C08K9/04 , C01P2004/64 , C01P2004/24
Abstract: A method of forming a composition having exfoliated nanoplatelets functionalized with covalently bound surface-modifiers, includes exfoliating a layered nanoclay is exfoliated with a surfactant. The method also includes reacting the exfoliated layered nanoclay with a surface modifier comprising one or more of an epoxide, a silane, or an isocyanate.
-
公开(公告)号:US20230287195A1
公开(公告)日:2023-09-14
申请号:US18318783
申请日:2023-05-17
Inventor: Xi ZHANG , Haiqing YAO , Hung-Jue SUE , Masahiro MIYAMOTO
CPC classification number: C08K3/041 , C08J3/215 , C08K3/04 , C08K3/22 , C08K3/32 , C09C1/04 , C09C1/043 , C09C1/44 , C09C3/08 , C08J2329/04 , C08K2003/2296 , C08K2003/328 , C08K2201/001 , C08K2201/011
Abstract: A composition including a medium and surfactant-free nanoparticles (SFNPs) at different dispersion state or aggregation form. The composition includes: (a) a composition of a medium and surfactant-free nanoparticles in primary form, wherein the dielectric constant value (DE value) of the medium is equal to or larger than the intrinsic dielectric constant value (IDE) of the SFNPs and smaller than about 1.5 times of the IDE of the SFNPs; (b) a composition of a medium and reaction-limited aggregation form of SFNPs, wherein the DE value of the medium is much larger than the IDE of the surfactant-free nanoparticles; (c) a composition of a medium and diffusion-limited aggregation form of SFNPs, wherein the DE value of the medium is smaller than the IDE of the surfactant-free nanoparticles; and (d) a composition comprising redispersible aggregation form of surfactant-free nanoparticles, wherein the surfactant-free nanoparticles are induced to aggregate in the diffusion-limited fashion in a medium with a DE value that is smaller than the IDE of the surfactant-free nanoparticles.
-
公开(公告)号:US12091508B2
公开(公告)日:2024-09-17
申请号:US16977714
申请日:2019-03-04
Applicant: Kaneka Americas Holding, Inc.
Inventor: Samuel Kyran , Hiroyuki Furutani
IPC: C09J179/08 , C08G73/10 , H01L21/68
CPC classification number: C08G73/1064 , C08G73/1042 , C08G73/1071 , C09J179/08 , C09J2400/143 , H01L21/68
Abstract: Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4′-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate.
-
公开(公告)号:US20220192581A1
公开(公告)日:2022-06-23
申请号:US17599337
申请日:2020-08-12
Applicant: KANEKA CORPORATION , Kaneka Americas Holding, Inc.
Inventor: Hiromi Maeda
Abstract: A system for monitoring and responding to a cerebrovascular accident includes a computer, including a computer processor and a computer transceiver, a storage that stores personal medical information and a risk level, and a portable device attached to a user. When the computer transceiver receives personal medical information of the user, the computer processor calculates the risk level of a cerebrovascular accident based on the personal medical information. When the computer transceiver receives acceleration information, the computer processor determines whether to contact a predetermined contact based on the risk level and the personal medical information. The portable device includes an acceleration sensor, a position receiver, a clock, a portable transceiver, and a portable processor.
-
公开(公告)号:US20210054147A1
公开(公告)日:2021-02-25
申请号:US16977714
申请日:2019-03-04
Applicant: Kaneka Americas Holding, Inc.
Inventor: Samuel Kyran , Hiroyuki Furutani
IPC: C08G73/10 , C09J179/08
Abstract: Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4′-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate.
-
-
-
-
-
-
-
-
-