BIODEGRADABLE POLYMER COMPOSITION WITH PROCESSING AID

    公开(公告)号:US20250019538A1

    公开(公告)日:2025-01-16

    申请号:US18712186

    申请日:2022-11-17

    Abstract: A biodegradable polymer composition includes a biodegradable matrix polymer, and 0.1 to 5 wt. % of a processing aid having a weight average molecular weight of at least 20,000 g/mol. The processing aid is a reaction product of an acrylate monomer and, optionally, at least one copolymerizable monomer. The amount of the acrylate monomer in the processing aid ranges from 50 wt % to 100 wt %, and the amount of the copolymerizable monomer in the processing aid ranges from 0 wt % to 50 wt %. A biodegradable polymer article includes the biodegradable polymer composition. A method includes mixing a biodegradable matrix polymer with 0.1 to 5 wt. % of a processing aid, having a weight average molecular weight of at least 20,000 g/mol above melting temperatures of the biodegradable matrix polymer and the processing aid, to produce a biodegradable polymer composition.

    Moisture Curable Adhesive Compositions
    4.
    发明公开

    公开(公告)号:US20230265285A1

    公开(公告)日:2023-08-24

    申请号:US18024152

    申请日:2021-09-02

    Abstract: A moisture curable composition, a method of applying the same, and a composition including the same are disclosed herein. In some embodiments, a curable composition, comprises: a component (A) having an organic polymer containing reactive silicon groups represented by the following general formula (1): —Si(R13-a)Xa (1) wherein R1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, wherein X represents a hydrolyzable group, wherein each X is the same or different when two or more X are present, a is an integer from 1 to 3, when a is 1, each R1 may be the same or different, and when a is 2 or 3, each X may be the same or different; a component (B) having a chlorinated polyolefin polymer; and a component (C) having a carboxylic acid metal salt.

    EPOXY-BASED RESIN COMPOSITION FOR CLEAR FIBER COMPOSITES AND EPOXY-BASED CLEAR FIBER COMPOSITES

    公开(公告)号:US20240392086A1

    公开(公告)日:2024-11-28

    申请号:US18693642

    申请日:2022-09-30

    Abstract: An epoxy-based resin composition for clear fiber composites includes epoxy resins and an anhydride curing agent. The epoxy resins include at least one epoxy resin having a refractive index higher than a refractive index of glass fibers, and at least one cycloaliphatic epoxy resin. The amount of non-aromatic components in the epoxy-based resin composition is 60 wt % or higher, based on the total amount of the epoxy resins and the anhydride curing agent. An epoxy-based clear fiber composite for a cover plate in a solar cell panel includes a cured matrix resin and a fiber reinforcement. The epoxy-based clear fiber composite has a refractive index ranging from 1.520 to 1.530 or 1.550 to 1.565, while the difference between the refractive index of the fiber reinforcement and the cured matrix resin is 0.001 or less. A multi-layer epoxy-based clear fiber composite includes a plurality of the epoxy-based clear fiber composite.

    SYSTEM AND METHOD FOR MONITORING AND RESPONDING TO A CEREBROVASCULAR ACCIDENT

    公开(公告)号:US20220192581A1

    公开(公告)日:2022-06-23

    申请号:US17599337

    申请日:2020-08-12

    Inventor: Hiromi Maeda

    Abstract: A system for monitoring and responding to a cerebrovascular accident includes a computer, including a computer processor and a computer transceiver, a storage that stores personal medical information and a risk level, and a portable device attached to a user. When the computer transceiver receives personal medical information of the user, the computer processor calculates the risk level of a cerebrovascular accident based on the personal medical information. When the computer transceiver receives acceleration information, the computer processor determines whether to contact a predetermined contact based on the risk level and the personal medical information. The portable device includes an acceleration sensor, a position receiver, a clock, a portable transceiver, and a portable processor.

    POLYIMIDES FOR TEMPORARY BONDING ADHESIVES, METHODS FOR MANUFACTURING OF THERMOPLASTIC POLYIMIDE MATERIALS, AND METHODS FOR THIN WAFER BONDING USING THE SAME

    公开(公告)号:US20210054147A1

    公开(公告)日:2021-02-25

    申请号:US16977714

    申请日:2019-03-04

    Abstract: Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4′-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate.

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