Moisture Curable Adhesive Compositions
    2.
    发明公开

    公开(公告)号:US20230265285A1

    公开(公告)日:2023-08-24

    申请号:US18024152

    申请日:2021-09-02

    Abstract: A moisture curable composition, a method of applying the same, and a composition including the same are disclosed herein. In some embodiments, a curable composition, comprises: a component (A) having an organic polymer containing reactive silicon groups represented by the following general formula (1): —Si(R13-a)Xa (1) wherein R1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, wherein X represents a hydrolyzable group, wherein each X is the same or different when two or more X are present, a is an integer from 1 to 3, when a is 1, each R1 may be the same or different, and when a is 2 or 3, each X may be the same or different; a component (B) having a chlorinated polyolefin polymer; and a component (C) having a carboxylic acid metal salt.

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