High-temperature super conducting wire

    公开(公告)号:US11437169B2

    公开(公告)日:2022-09-06

    申请号:US15757707

    申请日:2016-09-06

    Abstract: The present invention relates to a stacking structure of a superconducting wire. The present invention provides a superconducting wire in which a metal substrate, a buffer layer, a superconducting layer, and a stabilizing layer are stacked, the superconducting wire including: a plurality of wedges which penetrates through the superconducting layer and the buffer layer to connect the stabilizing layer and the metal substrate. According to the present invention, it is possible to provide the superconducting wire of which mechanical strength is improved to have high resistance against to deterioration or delamination. Further, the present invention may provide the superconducting wire which is self-protectable against a quench phenomenon. Further, the present invention may provide the superconducting wire which is suitable for application of a high magnetic field.

    PERMANENT MAGNET ELECTRICAL MACHINE FOR REDUCING DETENT FORCE

    公开(公告)号:US20200212773A1

    公开(公告)日:2020-07-02

    申请号:US16349574

    申请日:2017-12-21

    Abstract: The present invention relates to a permanent magnet electrical machine, and more particularly, to a permanent magnet electrical machine for reducing a detent force, the machine being capable of reducing a detent force by arranging a plurality of movers having the same teeth at predetermined intervals. In addition, according to the present invention, the permanent magnet electrical machine comprising a stator and a plurality of movers configured to perform linear motion, curvilinear motion, or rotary motion with respect to the stator is provided.

    Method for manufacturing hybrid packaging material

    公开(公告)号:US10294378B2

    公开(公告)日:2019-05-21

    申请号:US14082328

    申请日:2013-11-18

    Abstract: Disclosed herein is a method of manufacturing a hybrid packaging material, comprising the steps of: (a) forming a colloidal inorganic nanosol; (b) surface-treating the inorganic nanosol of step (a) with an organic metal alkoxide containing an organic function group by stirring the inorganic nanosol together with the organic metal alkoxide; (c) replacing a solvent of the inorganic nanosol with an organic solvent different in type from the solvent to prepare an organic solvent-type inorganic nanosol; (d) substituting the organic solvent of the inorganic nanosol of step (c) with a functional organic monomer or a silicon compound, followed by concentration to prepare a solvent-free organic-inorganic hybrid material; and (e) adding a nanoclay dispersed in a solvent to the solvent-free organic-inorganic hybrid material.

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