Abstract:
A method of making a semiconductor device includes forming a transistor structure having one of an embedded epitaxial stressed material in a source and drain region and a stressed channel and well, subjecting the transistor structure to plasma oxidation, and removing spacer material from the transistor structure.
Abstract:
A loading mechanism in a video cassette deck comprising a cassette moving mechanism 100 for moving a cassette receiving portion 200 between an initial location and a running location. The cassette moving mechanism 100 has a slide arm 120 horizontally slidably attached on one of a pair of wall portions 110 provided on both left and right sides of the cassette receiving portion 200, a driving portion for sliding the slide arm 120, a cassette driving gear 130 which is rotatably supported on the wall portion 110 to which the slide arm 120 is attached and which is connected to the cassette receiving portion 200 through a groove portion 112 formed in the wall portion 110, and a door arm 140 for transmitting the motion of the slide arm 120 to a door. The cassette loading mechanism is designed so that the door is opened before the cassette receiving portion 200 is moved when the cassette receiving portion 200 in the running location is moved into the initial location.
Abstract:
In this disk unit, a tray has an air intake opening formed to extend from an upstream side in a rotational direction of a disk rotated by a rotating portion toward an optical pickup and to extend inward from outside a receiving region from the upstream side toward a downstream side in the rotational direction for incorporating air into the side a receiving surface of the tray from the side of the back surface thereof.
Abstract:
A method of making a semiconductor device includes forming a transistor structure having one of an embedded epitaxial stressed material in a source and drain region and a stressed channel and well, subjecting the transistor structure to plasma oxidation, and removing spacer material from the transistor structure.
Abstract:
Disclosed are embodiments of an n-FET structure with silicon carbon S/D regions completely contained inside amorphization regions and with a carbon-free gate electrode. Containing carbon within the amorphization regions, ensures that all of the carbon is substitutional following re-crystallization to maximize the tensile stress imparted on channel region. The gate stack is capped during carbon implantation so the risk of carbon entering the gate stack and degrading the conductivity of the gate polysilicon and/or damaging the gate oxide is essentially eliminated. Thus, the carbon implant regions can be formed deeper. Deeper S/D carbon implants which are completely amorphized and then re-crystallized provide greater tensile stress on the n-FET channel region to further optimize electron mobility. Additionally, the gate electrode is uncapped during the n-type dopant process, so the n-type dopant dose in the gate electrode can be at least great as the dose in the S/D regions.
Abstract:
A magnetic tape apparatus having a bearer formed so as to be reciprocatable in the front-rear direction between a cassette insertion position and a cassette mount position on a chassis for inserting a tape cassette, and a rotating cam provided on the chassis for driving the bearer through an interlocking mechanism with a clutch. In the magnetic tape apparatus, the clutch is turned off to release the interlocking mechanism between the bearer and the rotating cam when the bearer is advanced from the cassette mount position to the cassette insertion position, while the clutch is turned on to establish the interlock between the bearer and the rotating cam when the bearer is retreated from the cassette insertion position to the cassette mount position.
Abstract:
Disclosed are embodiments of an n-FET structure with silicon carbon S/D regions completely contained inside amorphization regions and with a carbon-free gate electrode. Containing carbon within the amorphization regions, ensures that all of the carbon is substitutional following re-crystallization to maximize the tensile stress imparted on channel region. The gate stack is capped during carbon implantation so the risk of carbon entering the gate stack and degrading the conductivity of the gate polysilicon and/or damaging the gate oxide is essentially eliminated. Thus, the carbon implant regions can be formed deeper. Deeper S/D carbon implants which are completely amorphized and then re-crystallized provide greater tensile stress on the n-FET channel region to further optimize electron mobility. Additionally, the gate electrode is uncapped during the n-type dopant process, so the n-type dopant dose in the gate electrode can be at least great as the dose in the S/D regions.
Abstract:
There are provided a disc tray, a traverse unit, and a main chassis unit. The main chassis unit has a main chassis, which has, as observed when the traverse unit is in a stand-by position, a latch portion that engages with a projection portion of a sub rack and a stopper member that restricts the movement of the cam slider. The stopper member has a rotary shaft in the shape of a circular column, a lever portion which the projection portion makes contact, and a lock portion that makes contact with the cam slider and thereby restricts the sliding movement of the cam slider.
Abstract:
Gate oxides having different thicknesses are formed on a semiconductor substrate by forming a first gate oxide on the top surface of the substrate, forming a sacrificial hard mask over a selected area of the first gate oxide; and then forming a second gate oxide. A first poly layer may be formed on the first gate oxide, under the hard mask. After the hard mask is removed, a second poly layer may be formed over the second gate oxide and over the first poly layer. This enables the use of high-k dielectric materials, and the first gate oxide can be thinner than the second gate oxide.
Abstract:
A semiconductor defect type determination method and structure. The method includes providing a semiconductor wafer comprising a first field effect transistor (FET) comprising a first type of structure and a second FET comprising a second different type of structure. A first procedure is performed to determine if a first current flow exists between a first conductive layer formed on the first FET and a second conductive layer formed on the first FET. A second procedure is performed to determine if a second current flow exists between a third conductive layer formed the second FET and a fourth conductive layer formed on the second FET. A determination is made from combining results of the first procedure and results of the second procedure that the first FET and the second FET each comprise a specified type of defect.