公开(公告)号：US20140138073A1

公开(公告)日：2014-05-22

申请号：US14233432

申请日：2012-06-27

申请人： Junichi Teraki

发明人： Junichi Teraki

IPC分类号： F28F9/013

CPC分类号： F28F9/013 ,  F24F1/24 ,  F25B31/006 ,  F25D19/006 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A refrigerant pipe attachment structure is provided, in which it can be ensured that a refrigerant pipe is held and thermal resistance between the refrigerant pipe and a heat transfer member can be sufficiently reduced. A heat transfer member formed with an elongated groove into which a refrigerant pipe is fitted and thermally contacting a cooling target is provided. An elastic member formed in an elongated plate shape extending along an extension direction of the refrigerant pipe and including a pipe-facing part facing the refrigerant pipe is provided. A pressing mechanism configured to press the elastic member toward the heat transfer member is provided.

摘要翻译： 提供一种制冷剂配管结构，其中可以确保制冷剂管被保持，并且可以充分降低制冷剂管和传热构件之间的耐热性。 提供一种传热构件，其形成有细长槽，制冷剂管装配到该槽中并与冷却目标热接触。 提供一种弹性构件，其形成为沿着制冷剂管的延伸方向延伸的细长板状，并且包括朝向制冷剂管的面向对面的部分。 提供了一种构造成将弹性构件朝向传热构件按压的按压机构。

公开(公告)号：US08536439B2

公开(公告)日：2013-09-17

申请号：US12810650

申请日：2008-12-18

申请人： Junichi Teraki

发明人： Junichi Teraki

IPC分类号： H01L35/00 ,  H01L37/00 ,  H01L35/28

CPC分类号： H01L35/32

摘要： A thermoelectric device including a first insulating substrate (A) and a second insulating substrate (B) stacked on each other. Including a first electrode (2b) formed on the upper surface of the first insulating substrate (A), a pair of second electrodes (3c, 4c) individually formed on opposite surfaces thereof and connected to each other via a through-hole (7), and a thermoelectric material (5b) provided in the form of a thin film so as to contact the first electrode (2b) and the second electrode (3c). Furthermore, including a pair of third electrodes (8b, 9b) formed on opposite surfaces of the second insulating substrate (B) and connected to each other via a through-hole (10) while one of the third electrodes (8b, 9b) is connected to the first electrode (2b).

摘要翻译： 一种包括彼此堆叠的第一绝缘基板（A）和第二绝缘基板（B）的热电装置。 包括形成在第一绝缘基板（A）的上表面上的第一电极（2b），分别形成在其相对表面上并通过通孔（7）彼此连接的一对第二电极（3c，4c） 以及以薄膜形式设置成与第一电极（2b）和第二电极（3c）接触的热电材料（5b）。 此外，包括形成在第二绝缘基板（B）的相对表面上并通过通孔（10）彼此连接的一对第三电极（8b，9b），而第三电极（8b，9b）中的一个是 连接到第一电极（2b）。

公开(公告)号：US07905108B2

公开(公告)日：2011-03-15

申请号：US10574896

申请日：2004-10-08

申请人： Shuji Ikegami ,  Nobuki Matsui ,  Tomohiro Yabu ,  Junichi Teraki

发明人： Shuji Ikegami ,  Nobuki Matsui ,  Tomohiro Yabu ,  Junichi Teraki

IPC分类号： F25D23/00 ,  F25D17/00

CPC分类号： B01D53/263 ,  F24F3/1411 ,  F24F3/1429 ,  F25B13/00 ,  F25B2313/02343

摘要： An air conditioning apparatus is provided which includes a plurality of heat exchangers (11, 12, 13) for effecting heat exchange between a heating medium (such as refrigerant, cold and hot water et cetera) and air and which is adapted to separately perform sensible heat processing and latent heat processing of room air (RA). In the air conditioning apparatus, at least one heat exchanger (13) is made up of an adsorption heat exchanger (13) that supports on its surface an adsorbent, thereby preventing the increase in apparatus size and making it possible to perform operations at high COP.

摘要翻译： 提供了一种空调装置，其包括多个热交换器（11,12,13），用于在加热介质（例如制冷剂，冷热水等）和空气之间进行热交换，并且适于单独地执行明智的 室内空气（RA）的热处理和潜热处理。 在空气调节装置中，至少一个热交换器（13）由吸附热交换器（13）构成，吸附热交换器（13）表面吸附有吸附剂，从而防止了设备尺寸的增加，并且能够在高COP 。

公开(公告)号：US07810342B2

公开(公告)日：2010-10-12

申请号：US10574899

申请日：2004-10-08

申请人： Nobuki Matsui ,  Shuji Ikegami ,  Tomohiro Yabu ,  Satoshi Ishida ,  Junichi Teraki

发明人： Nobuki Matsui ,  Shuji Ikegami ,  Tomohiro Yabu ,  Satoshi Ishida ,  Junichi Teraki

IPC分类号： F25B13/00

CPC分类号： B01D53/261 ,  F24F3/1411 ,  F24F3/1423 ,  F24F3/1429 ,  F24F2203/1016 ,  F24F2203/1032 ,  F24F2203/1056 ,  F24F2203/1068 ,  F24F2203/1084 ,  F25B13/00 ,  F25B2313/021 ,  F25B2313/0272 ,  F25B2400/16

摘要： A refrigerant circuit (10) is provided with two adsorption heat exchangers (31, 32) in addition to an outdoor heat exchanger (21) and an indoor heat exchanger (22). An adsorbent is carried on the surface of each of the adsorption heat exchangers (31, 32). In the adsorption heat exchanger (31, 32) serving as an evaporator, moisture in the air is adsorbed by the adsorbent. In the adsorption heat exchanger (31, 32) serving as a condenser, moisture is desorbed from the adsorbent and then applied to the air. Then, the air dehumidified or humidified by the adsorption heat exchanger (31, 32) is supplied to a room to cope with latent heat load in the room. On the other hand, in the indoor heat exchanger (22), air is cooled or heated. Then, the air cooled or heated by the indoor heat exchanger (22) is supplied to the room to cope with sensible heat load in the room.

摘要翻译： 除了室外热交换器（21）和室内热交换器（22）之外，制冷剂回路（10）还设置有两个吸附热交换器（31,32）。 在每个吸附热交换器（31,32）的表面上承载吸附剂。 在用作蒸发器的吸附热交换器（31,32）中，空气中的水分被吸附剂吸附。 在用作冷凝器的吸附热交换器（31,32）中，水分从吸附剂中解吸，然后施加到空气中。 然后，通过吸附热交换器（31,32）除湿或加湿的空气被供给到室内以应对房间内的潜热负荷。 另一方面，在室内热交换器（22）中，空气被冷却或加热。 然后，将由室内热交换器（22）冷却或加热的空气供给到房间，以应对房间内的显热负荷。

公开(公告)号：US20070039343A1

公开(公告)日：2007-02-22

申请号：US10574896

申请日：2004-10-08

申请人： Shuji Ikegami ,  Nobuki Matsui ,  Tomohiro Yabu ,  Junichi Teraki

发明人： Shuji Ikegami ,  Nobuki Matsui ,  Tomohiro Yabu ,  Junichi Teraki

IPC分类号： F25D23/00 ,  F25B13/00 ,  F25B29/00 ,  F25B27/00

CPC分类号： B01D53/263 ,  F24F3/1411 ,  F24F3/1429 ,  F25B13/00 ,  F25B2313/02343

摘要： An air conditioning apparatus is provided which includes a plurality of heat exchangers (11, 12, 13) for effecting heat exchange between a heating medium (such as refrigerant, cold and hot water et cetera) and air and which is adapted to separately perform sensible heat processing and latent heat processing of room air (RA). In the air conditioning apparatus, at least one heat exchanger (13) is made up of an adsorption heat exchanger (13) that supports on its surface an adsorbent, thereby preventing the increase in apparatus size and making it possible to perform operations at high COP.

摘要翻译： 提供了一种空调装置，其包括多个热交换器（11,12,13），用于在加热介质（例如制冷剂，冷热水等）和空气之间进行热交换，并且适于单独地执行明智的 室内空气（RA）的热处理和潜热处理。 在空气调节装置中，至少一个热交换器（13）由吸附热交换器（13）构成，吸附热交换器（13）表面吸附有吸附剂，从而防止了设备尺寸的增加，并且能够在高COP 。

公开(公告)号：US09784506B2

公开(公告)日：2017-10-10

申请号：US14233432

申请日：2012-06-27

申请人： Junichi Teraki

发明人： Junichi Teraki

IPC分类号： F28F9/04 ,  F28F9/013 ,  H01L23/473 ,  H01L23/40 ,  F25D19/00 ,  F25B31/00 ,  F24F1/24

CPC分类号： F28F9/013 ,  F24F1/24 ,  F25B31/006 ,  F25D19/006 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A refrigerant pipe attachment structure is provided, in which it can be ensured that a refrigerant pipe is held and thermal resistance between the refrigerant pipe and a heat transfer member can be sufficiently reduced. A heat transfer member formed with an elongated groove into which a refrigerant pipe is fitted and thermally contacting a cooling target is provided. An elastic member formed in an elongated plate shape extending along an extension direction of the refrigerant pipe and including a pipe-facing part facing the refrigerant pipe is provided. A pressing mechanism configured to press the elastic member toward the heat transfer member is provided.

公开(公告)号：US20130160485A1

公开(公告)日：2013-06-27

申请号：US13821875

申请日：2011-09-27

申请人： Junichi Teraki

发明人： Junichi Teraki

IPC分类号： F28F1/40 ,  F25B1/00

CPC分类号： F28F1/40 ,  F25B1/00 ,  F25B13/00 ,  F25B2313/021 ,  F25D19/006 ,  F28F13/02 ,  F28F13/06 ,  F28F13/12 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

摘要： A cooler includes a circular pipe member through which a heating medium circulates, and being in thermal contact with a power module to cool the power module with the heating medium flowing through an interior of the circular pipe member. An axially extending channel formation member between which and an inner circumferential surface of the circular pipe member a narrow channel for the heating medium is formed is provided in the circular pipe member.

摘要翻译： 冷却器包括圆形管构件，加热介质通过该圆形管构件循环并与功率模块热接触，以使流动通过圆形管构件的内部的加热介质冷却功率模块。 形成有用于加热介质的狭窄通道的圆形管构件的内周面之间的轴向延伸的通道形成构件设置在圆形管构件中。

公开(公告)号：US20100192624A1

公开(公告)日：2010-08-05

申请号：US12446548

申请日：2007-11-12

申请人： Junichi Teraki ,  Takayuki Setoguchi

发明人： Junichi Teraki ,  Takayuki Setoguchi

IPC分类号： F25B1/00

CPC分类号： F25B13/00 ,  F24F11/42 ,  F24F11/43 ,  F24F11/77 ,  F25B31/006 ,  F25B2313/021 ,  F25B2313/02741 ,  F25B2341/0662 ,  F25B2600/021 ,  Y02B30/741

摘要： A heat exchange system includes an outdoor heat exchanger, an indoor heat exchanger, a compressor, an expansion valve, a capillary tube, and a cooling jacket. The compressor is provided on a first path that is one of two paths connecting the outdoor heat exchanger and the indoor heat exchanger, and the expansion valve, the capillary tube and a check valve are provided on a second path of the two paths connecting the outdoor heat exchanger and the indoor heat exchanger that is opposite to the path on which the compressor is provided. The cooling jacket for cooling an object to be cooled is provided between the expansion valve and the capillary tube.

摘要翻译： 热交换系统包括室外热交换器，室内热交换器，压缩机，膨胀阀，毛细管和冷却套。 压缩机设置在作为连接室外热交换器和室内热交换器的两条路径之一的第一路径上，并且膨胀阀，毛细管和止回阀设置在连接室外热交换器的两条路径的第二路径上 热交换器和与设置压缩机的路径相对的室内热交换器。 用于冷却待冷却物体的冷却套设置在膨胀阀和毛细管之间。

公开(公告)号：US20080111151A1

公开(公告)日：2008-05-15

申请号：US11791844

申请日：2005-12-01

申请人： Junichi Teraki ,  Mitsuhiro Tanaka

发明人： Junichi Teraki ,  Mitsuhiro Tanaka

IPC分类号： H01L31/111 ,  H01L21/00

CPC分类号： H01L25/072 ,  H01L23/3677 ,  H01L23/473 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/0272 ,  H05K1/0298 ,  H05K1/183 ,  H05K3/0061 ,  H05K7/20927 ,  H05K2201/064 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power module includes a power semiconductor, a non-power semiconductor, one resin substrate and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor.

摘要翻译： 功率模块包括功率半导体，非功率半导体，一个树脂基板和冷却装置。 功率半导体和非功率半导体构成用于进行电力转换的电源电路。 功率半导体和非功率半导体都安装在树脂基板上。 设置冷却装置以冷却功率半导体。

公开(公告)号：US20110203773A1

公开(公告)日：2011-08-25

申请号：US13127158

申请日：2009-11-02

申请人： Junichi Teraki ,  Mitsuhiro Tanaka ,  Noriyuki Okuda

发明人： Junichi Teraki ,  Mitsuhiro Tanaka ,  Noriyuki Okuda

IPC分类号： F28D15/00 ,  B23P15/26

CPC分类号： H05K7/20254 ,  F28D15/0233 ,  F28D15/0275 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/209 ,  Y10T29/49359 ,  Y10T29/53113 ,  H01L2924/00

摘要： A cooling member includes a heat-transfer member having a groove and a refrigerant introducing pipe pressed into the groove. The refrigerant introducing pipe has a pressed region positioned inwardly of the edge of the heat-transfer member, and at least one curbed surface portion. A method for manufacturing a cooling member includes preparing a punch having at least one curved corner and a pressing surface, positioning the corner, and moving the punch closer to the groove to press the refrigerant introducing pipe into the groove with the pressing surface. A device for manufacturing a cooling member includes the punch and a support configured to support the heat-transfer member so the groove is positioned opposite the punch.

摘要翻译： 冷却构件包括具有凹槽的传热构件和压入槽中的制冷剂引入管。 制冷剂导入管具有位于传热构件的边缘的内侧的压制区域和至少一个弯曲表面部分。 制造冷却构件的方法包括：制备具有至少一个弯曲角和冲压表面的冲头，定位角部，并且使冲头移动到更靠近凹槽的位置，以将压制表面压入制冷剂导入管。 用于制造冷却构件的装置包括冲头和构造成支撑传热构件的支撑件，使得凹槽与冲头相对定位。