Abstract:
Embodiments of the present invention include an apparatus to selectively provide information within a device to enable the device to perform a function. The apparatus comprises a generator unit to generate information for the device to perform the function, a receiver unit to receive information from a source and provide the received information for the device, and a storage unit. The storage unit selectively stores the information from the generator unit and the receiver unit for use by the device in accordance with an information selection signal and a mode signal indicating entry of the device into a particular device mode. Information from the receiver unit is stored in the storage unit in response to availability of information from the receiver unit and the mode signal indicating entry of the device into the particular device mode.
Abstract:
Embodiments of the present invention include an apparatus to selectively provide information within a device to enable the device to perform a function. The apparatus comprises a generator unit to generate information for the device to perform the function, a receiver unit to receive information from a source and provide the received information for the device, and a storage unit. The storage unit selectively stores the information from the generator unit and the receiver unit for use by the device in accordance with an information selection signal and a mode signal indicating entry of the device into a particular device mode. Information from the receiver unit is stored in the storage unit in response to availability of information from the receiver unit and the mode signal indicating entry of the device into the particular device mode.
Abstract:
A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
Abstract:
An apparatus for varying a data input/output path in a memory device, includes DBSAs amplifying a signal loaded on a data bus, fuse circuits producing output signals of specific levels respectively in accordance with whether or not fuses are cut, input multiplexers each of which selects either an external signal inputted through a corresponding pad or another external signal inputted through a pad next to the corresponding pad in accordance with the output signals of the fuse circuits, and applies the selected signal to a write driver, and data input/output parts including output multiplexers, each of the output multiplexers selecting a signal outputted from either a corresponding one of the DBSAs or one next to the corresponding DBSA in accordance with the output signals of the fuse circuits, and outputting the selected signal through a corresponding pad.
Abstract:
A fuse repair circuit for a semiconductor memory device includes a cell array provided with a row redundancy and a column redundancy and a fuse block for driving the row redundancy during a RAS cycle and driving the column redundancy during a CAS cycle, wherein the fuse block consists of an address input unit for selectively outputting a row address or a column address in accordance with switching signals, a plurality of fuse units, wherein redundancy information of a defective cell is programmed, for comparing an inputted address with the programmed redundancy information, and a redundancy driving unit for outputting a matching signal for driving the row redundancy or the column redundancy when the inputted address and the programmed redundancy information are identical.
Abstract:
A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.
Abstract:
A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.
Abstract:
A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
Abstract:
The present invention is a random access memory device with reduced refresh current and method for use in the same. The memory device includes a memory array with a plurality of memory cells. The memory cells are configured to hold a charge. A command block is coupled to the memory bank and is configured to receive refresh commands that are used to periodically refresh the memory cells. A detection circuit is coupled to the command block and to the memory array. The detection circuit is configured to store a hit detect signal when the memory array is accessed. The detection circuit also receives the refresh command. The detections circuit enables block select signals only when the hit detect signal is stored while the refresh command is received.
Abstract:
An apparatus for selecting banks in a semiconductor memory device provides a half-chip by adjusting all bits including the most significant bit (MSB) of bank addresses to select normal banks even if degraded banks are included in both upper and lower bank blocks. In a memory including an upper bank block and a lower bank block which are constructed with a plurality of banks selectable by a plurality of bank addresses, an apparatus for selecting the banks includes a plurality of bank address control parts each corresponding to one address bit of the bank addresses, each of the bank address control part applying a fixed logic value to the upper and lower bank blocks according to a selective cutting of at least one of the fuses, and each of the bank address control parts applying either a corresponding bank address bit input thereto or a bank address bit just below the corresponding bank address bit to the upper and lower bank blocks.