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1.发明授权Low-cost printed circuit board with integral heat sink for semiconductor package 有权低成本印刷电路板，集成散热片用于半导体封装公开(公告)号：US06337228B1
公开(公告)日：2002-01-08
申请号：US09310660
申请日：1999-05-12
IPC分类号： H01L2144
CPC分类号： H05K1/0204 , H01L23/3128 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/4046 , H05K2201/0355 , H05K2201/10416 , Y10T29/49128 , Y10T29/49155 , H01L2924/00 , H01L2224/05599
摘要： A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press. The heat and pressure forces the resin to the surface of the composite and into the space between the slug and the walls of the composite, where it solidifies, bonding the edges of the slug to the substrate within the opening and adhering the conductive layers to the upper and lower surfaces of the substrate. The resulting laminate can thereafter be processed as a convention printed circuit board to incorporate conventional circuit board features, e.g., circuit traces, wire bonding pads, solder ball mounting lands, and via holes.
摘要翻译： 用于具有球栅阵列封装的占位面积的半导体封装的低成本印刷电路板具有用于安装一个或多个半导体芯片的整体散热器或“块状”，能够有效地将至少5瓦 从典型应用中的包装。 通过形成通过B阶环氧树脂/玻璃纤维复合材料的片材或基底的开口或“预浸渍”形成开口，然后将具有与开口相同的尺寸和形状的导热材料块塞入 开放 含块状复合材料夹在导电金属（优选铜）的两个薄层之间，并且所得到的夹层同时被压制并在加热压机的压板之间加热。 热和压力迫使树脂到复合材料的表面并进入组合体和组合物的壁之间的空间中，在该空间中它凝固，将块状物的边缘粘合到开口内的衬底上，并将导电层粘附到 衬底的上表面和下表面。 此后，所得到的层压板可以作为常规印刷电路板加工，以结合常规的电路板特征，例如电路迹线，引线接合焊盘，焊球安装焊盘和通孔。
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公开(公告)号：US5829988A
公开(公告)日：1998-11-03
申请号：US748752
申请日：1996-11-14
CPC分类号： H05K7/1069
摘要： A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.
摘要翻译： 一种用于球栅阵列芯片载体封装的插座，其包含电互连的管芯。 插座中的单个弹簧元件用于互连球栅阵列的每个球。 单独的弹簧元件向与球栅阵列的球直接接触的衬底的各个部分提供向上的压力。 衬底的各个部分形成为响应于来自下面的弹簧元件的压力而允许弯曲的单个梁构件。
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公开(公告)号：US5650593A
公开(公告)日：1997-07-22
申请号：US383966
申请日：1995-02-06
IPC分类号： H01L23/04 , H01L23/057 , H01L23/08 , H01L23/24 , H01L23/36 , H01L23/498 , H01L23/02 , H01L23/28 , H05K1/18 , H05K7/20
CPC分类号： H01L23/36 , H01L23/04 , H01L23/057 , H01L23/08 , H01L23/24 , H01L23/49816 , H01L23/49827 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195
摘要： A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a heat sink to either the top or bottom thereof with solder. A casing is further formed on the substrate outwardly of the aperture and the heat sink mounted thereacross, the casing being comprised of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted to the heat sink secured therein.
摘要翻译： 一种热增强芯片载体封装，内置散热片，用于半导体集成电路芯片。 电路基板由诸如具有中心开口的PPS或LCP的合适的热塑性材料形成，并且金属附接环用于利用焊料将散热器附接到其顶部或底部。 壳体还进一步形成在孔的外侧，并且安装在其上的散热器，壳体由合适的热塑性材料构成，并与电路基板的一部分化学熔合以在其间产生湿气密封。 用于填充壳体内的空腔的密封剂和盖也可以用于进一步固定和密封安装到固定在其中的散热片的芯片。
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公开(公告)号：US4906160A
公开(公告)日：1990-03-06
申请号：US234999
申请日：1988-08-22
IPC分类号： A01D87/00
CPC分类号： A01D87/0069
摘要： A parking stand for an agricultural loader particularly well suited for use with tractors having mid-mounted mowers or similar tools carried beneath the tractor. The stand includes a pair of legs for each mast, the legs being adapted to fold between a stored position adjacent the mast and a supporting position extending laterally from the mast.
摘要翻译： 特别适用于拖拉机的拖拉机的停车站，该拖拉机具有中间装载的割草机或拖拉机下方的类似工具。 支架包括用于每个桅杆的一对腿部，所述腿部适于在邻近桅杆的存储位置和从桅杆横向延伸的支撑位置之间折叠。
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公开(公告)号：US06507102B2
公开(公告)日：2003-01-14
申请号：US10006642
申请日：2001-12-05
IPC分类号： H01L2310
CPC分类号： H05K1/0204 , H01L23/3128 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/4046 , H05K2201/0355 , H05K2201/10416 , Y10T29/49128 , Y10T29/49155 , H01L2924/00 , H01L2224/05599
摘要： A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press. The heat and pressure forces the resin to the surface of the composite and into the space between the slug and the walls of the composite, where it solidifies, bonding the edges of the slug to the substrate within the opening and adhering the conductive layers to the upper and lower surfaces of the substrate. The resulting laminate can thereafter be processed as a convention printed circuit board to incorporate conventional circuit board features, e.g., circuit traces, wire bonding pads, solder ball mounting lands, and via holes.
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公开(公告)号：US5252022A
公开(公告)日：1993-10-12
申请号：US785359
申请日：1991-10-30
CPC分类号： E02F3/3622
摘要： An implement is coupled to the forward ends of a pair of loader lift arms through the medium of an attachment assembly comprising a pair of implement carriers respectively vertically pivotally mounted to the pair of loader lift arms by a connector rod that extends through aligned holes provided in lower locations of the carriers, the connector rod being releasably fastened to each of the carriers so that the latter are pivoted in unison by hydraulic cylinders connected between the lift arms and upper locations of the carriers. The attachment assembly further includes a pair of downwardly opening hooks welded to upper locations of the back side of the implement and including arcuate portions respectively receiving cylindrical bars defining upper ends of the pair of carriers. Also fixed to the back side of the implement are a pair of rearwardly projecting, tapered connecting pins that are respectively received in holes provided in mounting plates forming lower forward portions of the carriers. The pins are located at outward locations which are visible to an operator so that the mounting of the implement to the carriers can be more easily effected. Quick clips are received through cross bores provided in the mounting pins so as to releasably maintain the connection between the implement and carriers.
摘要翻译： 工具通过连接组件的介质联接到一对装载机提升臂的前端，所述附件组件包括一对工具托架，所述一对工具托架通过连接杆垂直地枢转地安装到一对装载机提升臂上，所述连接杆延伸穿过设置在 载体的下部位置，连接杆可释放地紧固到每个载体，使得后者通过连接在提升臂和载体的上部位置之间的液压缸一起枢转。 附接组件还包括焊接到工具的后侧的上部位置的一对向下开口的钩，并且包括分别容纳限定该对载体的上端的圆柱形的弓形部分。 还固定在工具的背面的是一对向后突出的锥形连接销，其分别容纳在形成载体的下部前部的安装板中的孔中。 销位于操作者可见的外部位置处，使得工具的安装可以更容易地实现。 通过设置在安装销中的十字孔容纳快速夹，以便可释放地保持工具和托架之间的连接。
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公开(公告)号：US4264264A
公开(公告)日：1981-04-28
申请号：US14871
申请日：1979-02-26
申请人： John R. McMillan , Mervin P. Kizlyk
发明人： John R. McMillan , Mervin P. Kizlyk
CPC分类号： E02F3/968 , E02F3/6273
摘要： Structure for detachably mounting a loader to a tractor or other mobile vehicle. An upright pedestal is carried at the rearward end of each loader boom arm for positioning in a receiving support carried on respective sides of the vehicle. Guide and following surfaces provided between the lower portions of each pedestal and support facilitate quick, positive engagement of the pedestal with its support. A transverse pin at the lower end of each receiving support provides a pivotable support for a downwardly opening bracket which is carried on each pedestal and is guided onto the pin by the guide and following surfaces. Engagement of the bracket on the pin horizontally locates the pedestal relative to the support and vertically positions alignable and releasable fastening structure carried between each pedestal and support. In the preferred embodiment, positioning surfaces engageable between the pedestal and support force the bracket vertically onto the pin and restrain the pedestal against upward vertical movement. An adjustable bolt is carried on the support and engages the pedestal to locate its horizontal position relative to the support and assure horizontal alignment of the fastening means.
摘要翻译： 用于将装载机可拆卸地安装到拖拉机或其他移动车辆的结构。 在每个装载机臂臂的后端承载有直立的基座，用于定位在承载在车辆的相应侧面上的接收支撑件中。 在每个基座和支撑件的下部之间设置的引导和跟随表面促进了基座与其支撑件的快速，正面的接合。 每个接收支撑件的下端处的横向销提供用于向下开口支架的可枢转支撑件，该支撑架承载在每个基座上并且通过引导件和随后的表面被引导到销上。 支架在销水平上的接合使基座相对于支撑架定位，并垂直定位在每个基座和支架之间承载的可对准和可释放的紧固结构。 在优选实施例中，可与基座和支撑件接合的定位表面将支架垂直地支撑在销上并且限制基座免受向上的垂直运动。 可调节的螺栓被承载在支撑件上并且接合基座以相对于支撑件定位其水平位置并且确保紧固装置的水平对准。
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公开(公告)号：US5827999A
公开(公告)日：1998-10-27
申请号：US339329
申请日：1994-11-14
IPC分类号： H01L23/04 , H01L23/057 , H01L23/08 , H01L23/24 , H01L23/36 , H01L23/498 , H01L23/02
CPC分类号： H01L23/04 , H01L23/057 , H01L23/08 , H01L23/24 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01021 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/181
摘要： A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted therein from moisture.
摘要翻译： 一种用于一个或多个半导体集成电路芯片的热塑性芯片载体腔封装。 电路基板由合适的热塑性塑料例如PPS或LCP形成。 壳体在衬底顶部进一步形成，壳体由合适的热塑性材料制成，并与电路基板的一部分化学熔合以在其间产生湿气密封。 用于填充壳体内的空腔的密封剂和盖也可以用于进一步固定和密封安装在其中的芯片的水分。
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