公开(公告)号：US5824568A

公开(公告)日：1998-10-20

申请号：US675822

申请日：1996-07-05

Applicant: John Harold Zechman

Inventor： John Harold Zechman

IPC: H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495 ,  H01L23/552 ,  H01L23/64 ,  H01L21/28

CPC classification number: H01L24/85 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/552 ,  H01L23/642 ,  H01L24/48 ,  H01L2223/6622 ,  H01L2224/05601 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4557 ,  H01L2224/456 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/85815 ,  H01L2224/85909 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/30107 ,  Y10T29/49171

Abstract: A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.

Abstract translation: 包含其上具有导电位置的集成电路芯片和通过导电线互连到导电部位的导电引线的复合材料; 其中所述线被电介质材料涂覆。 另外，提供了一种制造该复合材料的方法。

公开(公告)号：US5656830A

公开(公告)日：1997-08-12

申请号：US988849

申请日：1992-12-10

Applicant: John Harold Zechman

Inventor： John Harold Zechman

IPC: H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495 ,  H01L23/552 ,  H01L23/64 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/85 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/552 ,  H01L23/642 ,  H01L24/48 ,  H01L2223/6622 ,  H01L2224/05601 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4557 ,  H01L2224/456 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/85815 ,  H01L2224/85909 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/30107 ,  Y10T29/49171

Abstract: A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.

Abstract translation: 包含其上具有导电位置的集成电路芯片和通过导电线互连到导电部位的导电引线的复合材料; 其中所述线被电介质材料涂覆。 另外，提供了一种制造该复合材料的方法。