Apparatus and method for coating diamond on work pieces via hot filament chemical vapor deposition
    2.
    发明申请
    Apparatus and method for coating diamond on work pieces via hot filament chemical vapor deposition 审中-公开
    通过热丝化学气相沉积在工件上涂覆金刚石的装置和方法

    公开(公告)号:US20090197014A1

    公开(公告)日:2009-08-06

    申请号:US12068249

    申请日:2008-02-04

    Abstract: There is a disclosed apparatus for coating diamond on work pieces via hot filament chemical vapor deposition. The apparatus includes a chamber, a pump for pumping air from the chamber, a pressure controller for con trolling the pressure in the chamber, a grid disposed in the chamber, a grid-bias power supply for providing a positive bias to the grid, a holder for carrying the work pieces, a holder-bias power supply for providing a negative bias to the holder, filaments provided between the grid and the carrier, a filament power supply for energizing the filaments to heat up, a programmable temperature controller for controlling the temperature in the chamber and a pipe for transferring reaction gas into the chamber.

    Abstract translation: 公开了一种用于通过热丝化学气相沉积在工件上涂覆金刚石的公开的装置。 该装置包括:腔室,用于从腔室抽空气的泵,用于控制腔室内的压力的压力控制器,设置在腔室中的格栅,用于向栅格提供正偏压的栅极偏置电源; 用于承载工件的保持器,用于向保持器提供负偏压的保持器偏置电源,设置在电网和载体之间的灯丝,用于使灯丝加热的灯丝电源,用于控制灯丝的可编程温度控制器 室内的温度和用于将反应气体输送到室中的管道。

    HIGH-POWER PULSE MAGNETRON SPUTTERING APPARATUS AND SURFACE TREATMENT APPARATUS USING THE SAME
    3.
    发明申请
    HIGH-POWER PULSE MAGNETRON SPUTTERING APPARATUS AND SURFACE TREATMENT APPARATUS USING THE SAME 审中-公开
    高功率脉冲磁控溅射装置及其表面处理装置

    公开(公告)号:US20110011737A1

    公开(公告)日:2011-01-20

    申请号:US12505042

    申请日:2009-07-17

    CPC classification number: H01J37/3405 H01J37/3444 H01J37/3467

    Abstract: A magnetron sputtering apparatus suitable for coating on a workpiece is provided. The magnetron sputtering apparatus includes a vacuum chamber, a holder, a magnetron plasma source and a high-power pulse power supply set, wherein the magnetron plasma source includes a base, a magnetron controller and a target. A reactive gas is inputted into the vacuum chamber, and the holder supporting the workpiece is disposed inside the vacuum chamber. The magnetron plasma source is disposed opposite to the workpiece, wherein the magnetron controller is disposed in the base, and the target is disposed on the base. The high-power pulse power supply set is coupled to the vacuum chamber, the magnetron plasma source and the holder, and a high voltage pulse power is inputted to the magnetron plasma source to generate plasma to coat a film on the surface of the workpiece.

    Abstract translation: 提供了适用于在工件上涂覆的磁控溅射装置。 磁控溅射装置包括真空室,保持器,磁控管等离子体源和大功率脉冲电源组,其中磁控管等离子体源包括基极,磁控管控制器和靶。 反应气体被输入到真空室中,并且支撑工件的支架设置在真空室内。 磁控管等离子体源与工件相对设置,其中磁控管控制器设置在基座中,并且目标件设置在基座上。 大功率脉冲电源组耦合到真空室,磁控管等离子体源和保持器,并且高压脉冲功率被输入到磁控管等离子体源以产生等离子体以在工件的表面上涂覆膜。

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