公开(公告)号：US07982138B2

公开(公告)日：2011-07-19

申请号：US12369143

申请日：2009-02-11

Applicant: Jin-Hak Choi ,  Seoung-Jae Lee ,  Bae-Kyun Kim ,  Eun-Ju Yang ,  Jong-Yun Kim ,  Yeo-Joo Yoon

Inventor： Jin-Hak Choi ,  Seoung-Jae Lee ,  Bae-Kyun Kim ,  Eun-Ju Yang ,  Jong-Yun Kim ,  Yeo-Joo Yoon

IPC: H05K1/09 ,  H05K1/11 ,  B32B3/00

CPC classification number: H05K3/244 ,  C23C18/1651 ,  C23C18/206 ,  C23C18/22 ,  C23C18/32 ,  C23C18/42 ,  C23C18/54 ,  H01L2224/45144 ,  H01L2224/85444 ,  H05K3/383 ,  H05K2203/0392 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/1476 ,  Y10T428/24917

Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.

Abstract translation: 公开了一种对化学镀镍 - 镀金的方法和印刷电路板。 根据本发明的实施例的方法包括：在物体的表面上形成第一镀镍层; 在所述第一镀镍层上形成第二镀镍层; 以及在所述第二镀镍层上形成镀金层。

公开(公告)号：US07553751B2

公开(公告)日：2009-06-30

申请号：US11529377

申请日：2006-09-29

Applicant: Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

Inventor： Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L24/02 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10S438/951 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.

Abstract translation: 形成焊料凸点的方法可以包括在具有焊盘的晶片上形成第一光致抗蚀剂图案。 第一光致抗蚀剂图案可以具有露出垫的一部分的开口。 可以在焊盘上形成第一凸点下冶金（UBM）层，并且可以在第一光致抗蚀剂图案上形成第二UBM层。 可以形成露出第一UBM层的第二光致抗蚀剂图案。 可以在开口中形成焊料凸块。 可以使用剥离剂除去第二光致抗蚀剂图案和第一光致抗蚀剂图案，从而通过剥离方法去除第二UBM层。

公开(公告)号：US07132358B2

公开(公告)日：2006-11-07

申请号：US10922172

申请日：2004-08-20

Applicant: Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

Inventor： Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L24/02 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10S438/951 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer and covers the second UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.

Abstract translation: 形成焊料凸点的方法可以包括在具有焊盘的晶片上形成第一光致抗蚀剂图案。 第一光致抗蚀剂图案可以具有露出垫的一部分的开口。 可以在焊盘上形成第一凸点下冶金（UBM）层，并且可以在第一光致抗蚀剂图案上形成第二UBM层。 可以形成第二光致抗蚀剂图案，其暴露第一UBM层并覆盖第二UBM层。 可以在开口中形成焊料凸块。 可以使用剥离剂除去第二光致抗蚀剂图案和第一光致抗蚀剂图案，从而通过剥离方法去除第二UBM层。

公开(公告)号：US20100059257A1

公开(公告)日：2010-03-11

申请号：US12369143

申请日：2009-02-11

Applicant: Jin-Hak CHOI ,  Seoung-Jae Lee ,  Bae-Kyun Kim ,  Eun-Ju Yang ,  Jong-Yun Kim ,  Yeo-Joo Yoon

Inventor： Jin-Hak CHOI ,  Seoung-Jae Lee ,  Bae-Kyun Kim ,  Eun-Ju Yang ,  Jong-Yun Kim ,  Yeo-Joo Yoon

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H05K3/244 ,  C23C18/1651 ,  C23C18/206 ,  C23C18/22 ,  C23C18/32 ,  C23C18/42 ,  C23C18/54 ,  H01L2224/45144 ,  H01L2224/85444 ,  H05K3/383 ,  H05K2203/0392 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/1476 ,  Y10T428/24917

Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.

Abstract translation: 公开了一种对化学镀镍 - 镀金的方法和印刷电路板。 根据本发明的实施例的方法包括：在物体的表面上形成第一镀镍层; 在所述第一镀镍层上形成第二镀镍层; 以及在所述第二镀镍层上形成镀金层。

公开(公告)号：US20070020913A1

公开(公告)日：2007-01-25

申请号：US11529377

申请日：2006-09-29

Applicant: Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

Inventor： Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L24/02 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10S438/951 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer and covers the second UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.

Abstract translation: 形成焊料凸点的方法可以包括在具有焊盘的晶片上形成第一光致抗蚀剂图案。 第一光致抗蚀剂图案可以具有露出垫的一部分的开口。 可以在焊盘上形成第一凸点下冶金（UBM）层，并且可以在第一光致抗蚀剂图案上形成第二UBM层。 可以形成第二光致抗蚀剂图案，其暴露第一UBM层并覆盖第二UBM层。 可以在开口中形成焊料凸块。 可以使用剥离剂除去第二光致抗蚀剂图案和第一光致抗蚀剂图案，从而通过剥离方法去除第二UBM层。

公开(公告)号：US20060169893A1

公开(公告)日：2006-08-03

申请号：US11254862

申请日：2005-10-21

Applicant: Jae-cheol Lee ,  Chang-bin Lim ,  Jin-hak Choi

Inventor： Jae-cheol Lee ,  Chang-bin Lim ,  Jin-hak Choi

IPC: H01J49/44

CPC classification number: G01N23/2273

Abstract: An X-ray photoelectron spectroscopy includes an X-ray generator generating an X-ray, a collimator collimating the X-ray generated in the X-ray generator, a monochromator for converting the collimated X-ray into a single wavelength X-ray and reflecting the single wavelength X-ray to a test sample, the monochromator being installed to be displaceable and rotatable in response to an irradiating direction of the X-ray, an analysis chamber in which the test sample is disposed, the analysis chamber being installed to be rotatable in response to the displacement of the monochromator so as to allow the single wavelength to be accurately irradiated to the test sample, an energy analyzer for measuring kinetic energy of an electron that is emitted from the test sample by the single wavelength X-ray, and an electron detector for detecting an electron passing to the energy analyzer.

Abstract translation: X射线光电子能谱包括产生X射线的X射线发生器，准直X射线发生器中产生的X射线的准直仪，将准直X射线转换为单波长X射线的单色仪，以及 将单波长X射线反射到测试样品，单色仪被安装成响应于X射线的照射方向而被移动和旋转，分析室中设置测试样品，分析室被安装到 可以响应于单色仪的位移而旋转，以便允许将单个波长精确地照射到测试样品上，该能量分析器用于测量通过单波长X射线从测试样品发射的电子的动能 以及用于检测通过能量分析器的电子的电子检测器。

公开(公告)号：US20050164483A1

公开(公告)日：2005-07-28

申请号：US10922172

申请日：2004-08-20

Applicant: Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

Inventor： Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

IPC: H01L21/44 ,  H01L21/50 ,  H01L21/60 ,  H01L23/485

CPC classification number: H01L24/11 ,  H01L24/02 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10S438/951 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer and covers the second UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.

Abstract translation: 形成焊料凸点的方法可以包括在具有焊盘的晶片上形成第一光致抗蚀剂图案。 第一光致抗蚀剂图案可以具有露出垫的一部分的开口。 可以在焊盘上形成第一凸点下冶金（UBM）层，并且可以在第一光致抗蚀剂图案上形成第二UBM层。 可以形成第二光致抗蚀剂图案，其暴露第一UBM层并覆盖第二UBM层。 可以在开口中形成焊料凸块。 可以使用剥离剂除去第二光致抗蚀剂图案和第一光致抗蚀剂图案，从而通过剥离方法去除第二UBM层。