BONDING SYSTEM FOR OPTICAL ALIGNMENT
    1.
    发明申请
    BONDING SYSTEM FOR OPTICAL ALIGNMENT 有权
    用于光学对准的接合系统

    公开(公告)号:US20110280511A1

    公开(公告)日:2011-11-17

    申请号:US12778127

    申请日:2010-05-12

    CPC classification number: G02B6/423 G02B6/4238 H01L2224/8114

    Abstract: A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.

    Abstract translation: 提供了一种接合系统和用于对准的接合方法。 光学半导体在其表面上包括光源和多个突出元件。 半导体工作台在其表面上包括光接收元件和多个凹陷元件。 突出元件的侧壁或凹部的侧壁是倾斜的。 第一金属化层设置在每个突出元件的接合表面上,并且第二金属化层设置在每个凹陷元件的底表面上,其中第一金属化层用于与第二金属化层结合。

    Process for using ester plasticized polyurethanes for sealing electrical
devices
    3.
    发明授权
    Process for using ester plasticized polyurethanes for sealing electrical devices 失效
    使用酯增塑聚氨酯密封电气设备的方法

    公开(公告)号:US4705724A

    公开(公告)日:1987-11-10

    申请号:US945981

    申请日:1986-12-24

    Abstract: A plasticized polyurethane gel system comprising the reaction product of an isocyanate compound and a polyol in the presence of an ester plasticizer compound having a total solubility parameter of between about 8.3 and 8.9 or between about 9.1 and 9.7. Said polyurethane systems are cured, cross-linked, non-spewing, grease compatible, and reenterable. This extended polyurethane is further characterized as having superior insulating properties so that it can be used of repairing, encapsulating or reclaiming electrical or telecommunication cables as well as for hard volume encapsulants or general elastomer use.

    Abstract translation: 一种增塑聚氨酯凝胶体系,其包含异氰酸酯化合物和多元醇在总溶解度参数为约8.3至8.9之间或约9.1至9.7之间的酯增塑剂化合物存在下的反应产物。 所述聚氨酯体系被固化,交联,不喷出,润滑脂相容并且可重新连接。 该延伸的聚氨酯的特征还在于具有优异的绝缘性能,使得其可用于修复,封装或回收电缆或通信电缆以及硬体积密封剂或一般弹性体使用。

    Bonding system for optical alignment
    7.
    发明授权
    Bonding system for optical alignment 有权
    用于光学对准的粘合系统

    公开(公告)号:US08265436B2

    公开(公告)日:2012-09-11

    申请号:US12778127

    申请日:2010-05-12

    CPC classification number: G02B6/423 G02B6/4238 H01L2224/8114

    Abstract: A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.

    Abstract translation: 提供了一种接合系统和用于对准的接合方法。 光学半导体在其表面上包括光源和多个突出元件。 半导体工作台在其表面上包括光接收元件和多个凹陷元件。 突出元件的侧壁或凹部的侧壁是倾斜的。 第一金属化层设置在每个突出元件的接合表面上,并且第二金属化层设置在每个凹陷元件的底表面上,其中第一金属化层用于与第二金属化层结合。

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