Abstract:
A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.
Abstract:
A torque sensor packaging system and method includes a torque member that includes one or more holes formed therein for receiving one or more respective fasteners associated with a sensing element. The sensing element can be connected to the torque member to the sensing element in order to transfer torque associated with the torque member to the sensing element for torque sensing operations thereof.
Abstract:
An integrated circuit chip has a substrate, an acoustic wave sensor, and a trimming element. The acoustic wave sensor is formed on the substrate, the trimming element is formed on the substrate, and the trimming element is coupled to the acoustic wave sensor so as to trim the acoustic wave sensor when the trimming element is adjusted. The trimming element, for example, may be a trimming capacitor.
Abstract:
Devices and methods for acoustically measuring temperature and pressure are disclosed. An illustrative SAW sensor can include an electrode structure that transmits and receives surface acoustic waves along a SAW delay line, a temperature sensor for measuring temperature along a first direction of the SAW delay line, and a pressure sensor for measuring pressure along a second direction of the SAW delay line. The SAW sensor can include an antenna that wirelessly transmits and receives RF signals to and from an electrical interrogator unit that can be used to power the SAW sensor.
Abstract:
A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.
Abstract:
A pressure sensor is provided in which the pressure sensing components are isolated from a portion of an attached buffer member which is connected to a fluid conduit. The offset characteristic of the pressure sensor isolates stress from being transmitted between an attached external fluid conduit and the sensitive components of the pressure sensor. One embodiment of the pressure sensor solders a fluid conduit structure to a buffer member that is attached to a pressure sensor die. An alternative embodiment of the present invention avoids the need for making solder connections between the sensor structure and external components by utilizing elastomeric conductors and pressure seals in association with the pressure sensor composite structure and first and second housing structures. These elastomeric conductors also provide improved stress isolation. The housing structures are used to compress to the seal and the elastomeric conductor against selected portions of the composite sensor.
Abstract:
A flowthrough pressure sensor is provided which avoids the creation of crevices and creases that could provide difficult to cleanse regions. The pressure sensor is particularly adapted for use in applications that require cleansing to avoid the build up of bacterial-laden material. The flowthrough pressure sensor is particularly adapted for use in the measurement of bodily fluids. A first conduit is connected in fluid communication with the second conduit which, in turn, is associated with a pressure sensitive element and two compressible seals. A housing member is provided with an opening into which the compressible seals in the pressure sensitive element are disposed. A latching mechanism is provided to force the housing against a boss portion of the first conduit so that the seals and the pressure sensitive element are compressed therebetween.
Abstract:
A particulate matter sensor includes a ceramic rod, a first metal layer deposited on the ceramic rod, a ceramic layer deposited on the first metal layer, and a second metal layer deposited on the ceramic layer. The first metal layer serves as a source electrode, and the second metal layer serves as a detection electrode. In another embodiment, a particulate matter sensor includes a metal rod, a ceramic sheet deposited or wrapped around the ceramic rod, and a metal layer deposited on the ceramic layer or sheet. The metal rod serves as a source electrode, and the second metal layer serves as a detection electrode.
Abstract:
A particulate matter sensor includes a ceramic rod, a first metal layer deposited on the ceramic rod, a ceramic layer deposited on the first metal layer, and a second metal layer deposited on the ceramic layer. The first metal layer serves as a source electrode, and the second metal layer serves as a detection electrode. In another embodiment, a particulate matter sensor includes a metal rod, a ceramic sheet deposited or wrapped around the ceramic rod, and a metal layer deposited on the ceramic layer or sheet. The metal rod serves as a source electrode, and the second metal layer serves as a detection electrode.