公开(公告)号：US07446400B2

公开(公告)日：2008-11-04

申请号：US11470494

申请日：2006-09-06

申请人： Ya-Chi Chen ,  Chun-Ying Lin ,  Yu-Ren Chen ,  I-Hsin Mao

发明人： Ya-Chi Chen ,  Chun-Ying Lin ,  Yu-Ren Chen ,  I-Hsin Mao

IPC分类号： H01L23/495 ,  H01L23/04 ,  H01L23/48 ,  H01L23/50

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A chip package structure including a chip, a lead frame, first bonding wires and second bonding wires is provided. The chip has an active surface, first bonding pads and second bonding pads, wherein the first bonding pads and the second bonding pads are disposed on the active surface. The chip is fixed below the lead frame, and the lead frame includes inner leads and bus bars. The inner leads and the bus bars are disposed above the active surface of the chip, and the bus bars are located between the inner leads and the corresponding first bonding pads. The first bonding wires respectively connect the first bonding pads and the bus bars. The second bonding wires respectively connect the bus bars and a part of the inner leads. The third bonding wires respectively connect the second bonding pads and the other of the inner leads.

摘要翻译： 提供了包括芯片，引线框架，第一接合线和第二接合线的芯片封装结构。 芯片具有有源表面，第一接合焊盘和第二接合焊盘，其中第一接合焊盘和第二接合焊盘设置在有源表面上。 芯片固定在引线框架下方，引线框架包括内部引线和母线。 内引线和母线设置在芯片的有效表面之上，并且母线位于内引线和相应的第一焊盘之间。 第一接合线分别连接第一接合焊盘和母线。 第二接合线分别连接母线和内引线的一部分。 第三接合线分别连接第二接合焊盘和另一个内部引线。

公开(公告)号：US20080006917A1

公开(公告)日：2008-01-10

申请号：US11470494

申请日：2006-09-06

申请人： Ya-Chi Chen ,  Chun-Ying Lin ,  Yu-Ren Chen ,  I-Hsin Mao

发明人： Ya-Chi Chen ,  Chun-Ying Lin ,  Yu-Ren Chen ,  I-Hsin Mao

IPC分类号： H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A chip package structure including a chip, a lead frame, first bonding wires and second bonding wires is provided. The chip has an active surface, first bonding pads and second bonding pads, wherein the first bonding pads and the second bonding pads are disposed on the active surface. The chip is fixed below the lead frame, and the lead frame includes inner leads and bus bars. The inner leads and the bus bars are disposed above the active surface of the chip, and the bus bars are located between the inner leads and the corresponding first bonding pads. The first bonding wires respectively connect the first bonding pads and the bus bars. The second bonding wires respectively connect the bus bars and a part of the inner leads. The third bonding wires respectively connect the second bonding pads and the other of the inner leads.

摘要翻译： 提供了包括芯片，引线框架，第一接合线和第二接合线的芯片封装结构。 芯片具有有源表面，第一接合焊盘和第二接合焊盘，其中第一接合焊盘和第二接合焊盘设置在有源表面上。 芯片固定在引线框架下方，引线框架包括内部引线和母线。 内引线和母线设置在芯片的有效表面之上，并且母线位于内引线和相应的第一焊盘之间。 第一接合线分别连接第一接合焊盘和母线。 第二接合线分别连接母线和内引线的一部分。 第三接合线分别连接第二接合焊盘和另一个内部引线。

公开(公告)号：US20090321918A1

公开(公告)日：2009-12-31

申请号：US12506255

申请日：2009-07-21

申请人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

发明人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

IPC分类号： H01L23/498

CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L24/97 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.

摘要翻译： 芯片封装包括热增强板，围绕热增强板接触并与热增强板电绝缘，设置在触点和热增强板上的膜状电路层，导电粘合剂层，第一模制件和 设置在膜状电路层上的至少一个芯片。 导电性粘合剂层设置在触点和通过导电粘合剂层与触点电连接的膜状电路层之间。 芯片具有背面，有源表面和设置在其上的许多凸块，并且芯片经由凸块电连接到膜状电路层。 第一模制品至少封装热增强板的一部分，导电粘合剂层，触点的一部分和膜状电路层的至少一部分。 因此，提高了发光芯片封装的散热效率。

公开(公告)号：US20080157333A1

公开(公告)日：2008-07-03

申请号：US11746654

申请日：2007-05-10

申请人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

发明人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

IPC分类号： H01L21/00 ,  H01L23/24

CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L24/97 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： A chip package including a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer is provided. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.

摘要翻译： 包括热增强板的芯片封装，在热增强板周围接触并与热增强板电绝缘，设置在触点和热增强板上的膜状电路层，导电粘合剂层，第一模制件和 提供设置在膜状电路层上的至少一个芯片。 导电性粘合剂层设置在触点和通过导电粘合剂层与触点电连接的膜状电路层之间。 芯片具有背面，有源表面和设置在其上的许多凸块，并且芯片经由凸块电连接到膜状电路层。 第一模制品至少封装热增强板的一部分，导电粘合剂层，触点的一部分和膜状电路层的至少一部分。 因此，提高了发光芯片封装的散热效率。

公开(公告)号：US20070267756A1

公开(公告)日：2007-11-22

申请号：US11543052

申请日：2006-10-05

申请人： I-Hsin Mao ,  Ya-Chi Chen ,  Chun-Ying Lin ,  Yu-Ren Chen

发明人： I-Hsin Mao ,  Ya-Chi Chen ,  Chun-Ying Lin ,  Yu-Ren Chen

IPC分类号： H01L23/52

CPC分类号： H01L23/49531 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC package with a defined wire-bonding region primarily comprises a multi-layer lead frame with a plurality of leads, a chip, a plurality of bonding wires within the wire-bonding region, and at least an electrical transition component outside the wire-bonding region. At least a transition finger is carried on one of the lead and is electrically isolated from the corresponding carrying lead without covering inner end of the carrying lead. The parts of the electrical transition component electrically connects the transition finger to another lead that is not directly below the transition finger to reduce the crossings of the bonding wires or to increase the vertical distances between the bonding wires at the crossings to avoid electrical shorts between the bonding wires during encapsulation.

摘要翻译： 具有限定的引线键合区域的IC封装主要包括具有多个引线的多层引线框架，芯片，引线接合区域内的多个接合线，以及至少一个引线接合区域外的电过渡部件， 接合区域。 至少一个过渡指状物承载在一个引线上，并且与相应的承载导线电隔离，而不覆盖承载引线的内端。 电过渡部件的部分将过渡指状物电连接到不是过渡指状物下方的另一导线，以减少接合线的交叉，或者增加在交叉处的接合线之间的垂直距离，以避免在两者之间的电短路 封装期间接合线。

公开(公告)号：US07932531B2

公开(公告)日：2011-04-26

申请号：US12506255

申请日：2009-07-21

申请人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

发明人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

IPC分类号： H01L33/00

CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L24/97 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.

摘要翻译： 芯片封装包括热增强板，围绕热增强板接触并与热增强板电绝缘，设置在触点和热增强板上的膜状电路层，导电粘合剂层，第一模制件和 设置在膜状电路层上的至少一个芯片。 导电性粘合剂层设置在触点和通过导电粘合剂层与触点电连接的膜状电路层之间。 芯片具有背面，有源表面和设置在其上的许多凸块，并且芯片经由凸块电连接到膜状电路层。 第一模制品至少封装热增强板的一部分，导电粘合剂层，触点的一部分和膜状电路层的至少一部分。 因此，提高了发光芯片封装的散热效率。

公开(公告)号：US07642137B2

公开(公告)日：2010-01-05

申请号：US11746654

申请日：2007-05-10

申请人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

发明人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

IPC分类号： H01L21/44

CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L24/97 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： A chip package including a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer is provided. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.

摘要翻译： 包括热增强板的芯片封装，在热增强板周围接触并与热增强板电绝缘，设置在触点和热增强板上的膜状电路层，导电粘合剂层，第一模制件和 提供设置在膜状电路层上的至少一个芯片。 导电性粘合剂层设置在触点和通过导电粘合剂层与触点电连接的膜状电路层之间。 芯片具有背面，有源表面和设置在其上的许多凸块，并且芯片经由凸块电连接到膜状电路层。 第一模制品至少封装热增强板的一部分，导电粘合剂层，触点的一部分和膜状电路层的至少一部分。 因此，提高了发光芯片封装的散热效率。